• Title/Summary/Keyword: Conductive Alloy

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Experimental Study on the Characteristics of Thermal Sensitivity for Fusible Alloy Type Sprinkler Head (가용합금형 스프링클러 헤드의 열감도 특성에 관한 실험적 연구)

  • 권오승;이진호
    • Fire Science and Engineering
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    • v.9 no.1
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    • pp.20-29
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    • 1995
  • The sprinkler head is a component of the sprinkler system intended to discharge water for automatic detection and extinguishment of fires. On this study, thermal characteristic values affecting the sensitivity of the fusible alloy type sprinkler head were obtained and analyzed under heated air stream condition which had constant temperature and velocity. The experiment was carried out under the forced convection condition with both the conductive heat loss considered and neglected. The thermal characteristic values of the sprinkler head were obtained in accordance with the material and shape of the heat responsive element and the conditions of the main body.

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Kinetic Parameter Analysis of Hydrogen Diffusion Reaction for Hydrogen Storage Alloy of Fuel Cell System (연료전지의 수소저장용 합금에 대한 수소확산반응의 속도론적 해석)

  • Kim, Ho-Sung
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.20 no.2
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    • pp.45-49
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    • 2006
  • Electrochemical hydrogenation/dehydrogenation properties were studied for a single particle of a Mm-based(Mm : minh metal) hydrogen storage alloy($MmNi_{3.55}Co_{0.75}Mn_{0.4}Al_{0.3}$) for fuel cell and Ni-MH batteries. A carbon fiber microelectrode was manipulated to make electrical contact with an alloy particle, and the potential-step experiment was carried out to determine the apparent chemical diffusion coefficient of hydrogen atom($D_{app}$) in the alloy. Since the alloy particle we used here was a dense, conductive sphere, the spherical diffusion model was employed for data analysis. $D_{app}$ was found to vary the order between $10^{-9}\;and\;10^{-10}[cm^2/s]$ over the course of hydrogenation and dehydrogenation process. Compared with the conventional composite film electrodes, the single particle measurements using the microelectrode gave more detailed, true information about the hydrogen storage alloy.

Micro Joining Process Using Solderable Anisotropic Conductive Adhesive (Solderable 이방성 도전성 접착제를 이용한 마이크로 접합 프로세스)

  • Yim, Byung-Seung;Jeon, Sung-Ho;Song, Yong;Kim, Yeon-Hee;Kim, Joo-Heon;Kim, Jong-Min
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.73-73
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    • 2009
  • In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

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Development of Bismuth Alloy-Based Anode Material for Lithium-Ion Battery (리튬이온 전지용 Bismuth 합금 기반 음극재 개발)

  • Chi Rong Sun;Jae Hoon Kim
    • Clean Technology
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    • v.30 no.1
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    • pp.23-27
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    • 2024
  • Bismuth is a promising anodic for Li-ion batteries (LIBs) due to its adequate operating voltage and high-volume capacity (3,765 mAh cm-3). Nevertheless, inevitable volume expansion during Bi alloy reactions leads to severe capacity loss and cell destruction. To address this, a complex of bismuth alloy nanoparticles (Bi@NC) embedded in an N doping-carbon coating is fabricated via a simple pyrolysis method. Nano-sized bismuth alloys can improve the reaction dynamics through a shortened Li+-ion diffusion path. In addition, the N-doped carbon coating effectively buffers the volume change of bismuth during the extended alloy/dealloy reaction with Li+ ions and maintains an effective conductive network. Based on the Thermogravimetric analysis (TGA) showed high bismuth alloy loading (80.9 wt%) and maintained a high gravimetric capacity of 315 mAh g-1 up to 100 cycles with high volumetric capacity of 845.6 mAh cm-3.

Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame (LED 리드프레임 패키징용 Cu/STS/Cu 클래드 메탈의 기계 및 열전도 특성의 온도 안정성 연구)

  • Kim, Young-Sung;Kim, Il-Gwon
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.77-81
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    • 2013
  • We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame (LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구)

  • Lee, Chang-Hun;Kim, Ki-Chul;Kim, Young-Sung
    • Journal of Welding and Joining
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    • v.30 no.3
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    • pp.32-37
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    • 2012
  • Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

Enhancement of Wetting Characteristics for Anisotropic Conductive Adhesive with Low Melting Point Solder via Carboxylic Acid-based Novel Reductants (카르복실산계 환원제를 통한 저융점 솔더입자가 포함된 이방성 전도성 접착제의 젖음 특성 향상 연구)

  • Kim, Hyo-Mi;Kim, Joo-Heon
    • Polymer(Korea)
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    • v.34 no.1
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    • pp.52-57
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    • 2010
  • The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

Characteristics of the AlON-Al2O3 Ceramic Coatings on the Al2021 Alloy by Electrolytic Plasma Processing

  • Wang, Kai;Byeon, Sang-Sik;Kim, Geun-Woo;Park, Keun-Young;Ahmed, Faheem;Koo, Bon-Heun
    • Korean Journal of Materials Research
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    • v.22 no.3
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    • pp.155-158
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    • 2012
  • In this work, AlON-$Al_2O_3$ coatings were prepared on Al2021 alloy by the electrolytic plasma processing (EPP) method. The experimental electrolytes include: 2 g/l NaOH as the electrolytic conductive agent, 10 g/l $Na_2AlO_2$ as the alumina formative agent, and 0.5 g/l $NaNO_2$, $NaNO_3$, and $NH_4NO_3$ as the nitride inducing agents. The effects of different nitrogen inducing agents were studied by a combined compositional and structural analyses of the ceramic coatings carried out by Xray diffractometry (XRD) and scanning electron microscopy (SEM) for the specimens EPP-treated at room temperature for 15 min under a hybrid voltage of 260 DC along with an AC 50 Hz power supply (200 V). Microhardness tests and wear tests were carried out to correlate the evolution of the microstructure and the resulting mechanical properties. Potentiodynamic polarizations and immersion corrosion tests were carried out in 3.5wt% NaCl water solutions under static conditions in order to evaluate the corrosion behavior of the coated samples. The results demonstrate that $NaNO_2$ is proven to be a good nitrogen inducing agent to produce high quality AlON-$Al_2O_3$ ceramic coatings.

Evaporation Cooling of Droplet due to Surface Roughness under Radiative Heat Input Condition (복사가열조건에서 표면 거칠기에 따른 액적의 증발 냉각)

  • Bang Chang-Hoon;Kwon Jin-Sun;Yea Yong-Taeg
    • Journal of the Korean Society of Safety
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    • v.19 no.3 s.67
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    • pp.14-19
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    • 2004
  • The objective of the present work is to examine evaporation cooling of droplet due to surface roughness under radiative heat input condition. The surface temperatures varied from $80\~160^{\circ}C$ on aluminum alloy (AL 2024) and surface roughness was $0.18{\mu}m,\;1.36{\mu}m$. The results are as follows; Regardless of surface roughness under radiative heat input condition, as droplet diameter is larger, the in-depth temperature of solid decreases and evaporation time increases. In the case of $0.18{\mu}m\;and\;1.36{\mu}m$ of surface roughness, the larger the surface roughness is, the less the evaporation time is and the larger the temperature within the solid is. In the case of $Ra=0.18{\mu}m$ evaporation time and time averaged heat flux for radiative heat input case is shorter than for the conductive case.

Electrochemical Hydrogenation Behavior of Surface-Treated Mg-based Alloys for Hydrogen Storage of Fuel Cell (연료전지의 수소저장용 마그네슘계 합금의 표면제어에 의한 전기화학적 수소화 거동 연구)

  • Kim, Ho-Sung;Lee, Jong-Ho;Boo, Seong-Jae
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.20 no.7
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    • pp.46-52
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    • 2006
  • The effects of surface treatment on the hydrogen storage properties of a $Mg_2Ni$ alloy particle were investigated by the microvoltammetric technique, in which a carbon-filament microelectrode was manipulated to make electrical contact with the particle in a KOH aqueous solution. It was found that the hydrogen storage properties of $Mg_2Ni$ at room temperature were improved by the surface treatment with a nickel plating solution. The sodium salts(sodium phosphate and sodium dihydrogen citrate) contained in the nickel plating solution made the alloy form an amorphous-like state, resulting in an improved hydrogen charge/discharge capacity at room temperature as high as about 150[mAh/g] from the original value of 17[mAh/g]. Potential-step experiment was carried out to determine the apparent chemical diffusion coefficient of hydrogen atom($D_{app}$) in the alloy. Since the alloy particle we used here was a dense, conductive sphere, the spherical diffusion model was employed for data analysis. $D_{app}$ was found to vary the order between $10^{-8}{\sim}10^{-9}[cm^2/s]$ over the course of hydrogenation and dehydrogenation process.