• Journal of the Korean Vacuum Society
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• v.20 no.2
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• pp.146-154
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• 2011

The adhesive-tape of a liquid leak film sensor including the alarm system is developed. The sensing film is composed of three layers such as base film layer, conductive line layer, and protection film layer. The thickness of film is 300~500 um, the width is 3.55 cm, and the unit length is 200 m. On the conductive line layer, three conducting lines and one resistive line are formulated by the electronic printing method with a conducting ink of silver-nano size. When a liquid leaks for the electricity to be conducted between the conductive line and the resistive line, the position of leakage is monitored by measuring the voltage varied according to the change of resistance between two lines. The error range of sensing position of 200 m film sensor is ${\pm}1m$.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.4
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• pp.250-254
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• 2016

In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at $185^{\circ}C$, Rseries was measured 0.013[${\Omega}$] which is the highest point. At $185^{\circ}C$, 2N and 6sec in bonding time, $P_{max}$ was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.390-390
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• 2000

This research is the development of a skin-type tactile sensor for service robot using PVDF film for the detection of the contact state. The Prototype of the tactile sensor which has 8$\times$8 taxels was fabricated using PVDF film In the fabrication procedure of the sensor, the electrode patterns and common electrode of the thin conductive tape were attached to the both side of the 28 micro meter thickness PVDF film using conductive adhesive. The sensor was covered with polyester film for insulation and attached to the rubber base for making stable structure. The signals of a contact pressure to the tactile sensor were sensed and processed in the DSP system in which the signals were digitized and filtered. Finally, the signals were integrated for taking the force profile. The processed signals of the output of the sensor were visualized in PC, the shape and force distribution of the contact object were obtained. The reasonable performance for the detection of contact state was verified through the experiment.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.75-84
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• 2018

According to IHS, the overall display market is expected to grow at an average annual rate of 6% from $ 104 billion in 2016, to $ 138 billion in 2021. Among them, the OLED display panel will grow from $ 15 billion to $ 41 billion over the same period, forecasting a high annual growth rate of 22%. However, the refraction index, light leakage, bubble generation, adhesion deterioration, peeling phenomenon, moisture resistance, light transmittance, low turbidity. OCA (optically clear adhesive), which solves problems such as improving the resistance of the conductive film, is largely dependent on imported products. In addition, in 2016, the world market is worth KRW4.3 trillion, and the adhesive market has a large market effect. In this study, we tried to analyze the technical competitiveness of patent and thesis by classifying OCA (optically clear adhesive, optical adhesive) for display panel by curing method. As a result of the study, the amount of patents and papers in Korea was found to be superior to other competitors, but the quality level was low. In particular, it was found that the achievements of the papers in the hot melt field are lacking and the government should expand its support.

• Journal of Mechanical Science and Technology
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• v.16 no.10
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• pp.1222-1228
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• 2002

This research is the development of a flexible tactile sensor array for service robots using PVDF (polyvinylidene fluoride) film for the detection of a contact state in real time. The prototype of the tactile sensor which has 8${\times}$8 array using PVDF film was fabricated. In the fabrication procedure, the electrode patterns and the common electrode of the thin conductive tape were attached to both sides of the 281$\mu\textrm{m}$ thickness PVDF film using conductive adhesive. The sensor was covered with polyester film for insulation and attached to the rubber base for a stable structure. The proposed fabrication method is simple and easy to make the sensor. The sensor has the advantages in the implementing for practical applications because its structure is flexible and the shape of the each tactile element can be designed arbitrarily. The signals of a contact force to the tactile sensor were sensed and processed in the DSP system in which the signals are digitized and filtered. Finally, the signals were integrated for taking the force profile. The processed signals of the output of the sensor were visualized in a personal computer, and the shape and force distribution of the contact object were obtained. The reasonable performance for the detection of the contact state was verified through the sensing examples.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• Textile Coloration and Finishing
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• v.28 no.1
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.