• 공업화학
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• 제35권3호
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• pp.209-213
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• 2024

전도성 페이스트와 PET 필름 사이의 접착특성 개선을 위해 PET 필름을 산과 염기를 이용하여 화학 처리와 코로나 방전처리를 통한 물리적 처리를 진행하였다. 실제 산업적 제조에 적용되는 에틸셀룰로오스와 실란 처리 셀룰로오스 나노섬유(cellulose nano fiber, CNF)를 바인더로 적용한 페이스트를 제조하고 PET 필름에 코팅하여 접착특성을 비교하였다. 코로나 방전 처리된 PET 필름에 실란 처리 CNF가 바인더로 적용된 페이스트가 코팅된 시편에서 접착특성이 최고 수준인 5B를 나타내었다. 반면, PET 필름을 산/염기로 화학처리한 경우 접착특성 개선 효과가 나타나지 않음을 확인할 수 있었다.

• 전기전자학회논문지
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• 제22권1호
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• pp.193-196
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• 2018

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

• Journal of Information Display
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• 제4권1호
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Journal of Electrochemical Science and Technology
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• 제12권3호
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• pp.330-338
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• 2021

An integral electrode-bipolar plate assembly, which is composed of electrode, conductive adhesive film (CAF) and bipolar plate, has been developed and evaluated for application with a vanadium redox flow battery (VRB) to decrease contact resistance between electrode and bipolar plate. The CAF, made of EVA (ethylene-vinyl-acetate) material with carbon black or CNT (Carbon Nano Tube), is applied between the electrode and the bipolar plate to enable an integral assembly by adhesion. In order to evaluate the integral assembly of VRB by adhesive film, the resistivity of integral assembly and the performance of single cell were investigated. Thus, it was verified that the integral assembly is applicable to redox flow battery. Through resistance and contact resistance of bare EVA and CAF films on bipolar plate were changed. Among the adhesive films, CAF film coated with carbon black showed the lowest value in through resistance, and CAF film coated with CNT showed the lowest value in contact resistance, respectively. The efficiency of VRB single cell was improved by applying CAF films coated with carbon black and CNT, resulting in the reduced overvoltage in charging process. Therefore, the energy efficiency of both CAF films, about 84%, were improved than that of blank cell, about 79.5 % under current density at 40 mA cm^-2. The energy efficiency of the two cells were similar, but carbon black coated CAF improved the coulomb efficiency and CNT coated CAF improved the voltage efficiency, respectively.

• 공업화학
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• 제33권4호
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• pp.381-385
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• 2022

유해화학물질의 감지 센서 개발을 위해 기재 필름과 전도성 페이스트의 접착 내구성 확보가 매우 중요하다. 본 연구에서는 폴리에틸렌테레프탈레이트(polyethylene terephthalate, PET) 필름에 폴리아닐린/그래핀나노플레이트(graphene nano plate, GNP) 페이스트를 코팅하여 접착 특성을 평가한 결과 cross cut 0B 또는 1B 등급으로 센서 적용에 문제가 있어 에스테르계 바인더를 이용하여 접착 특성 개선 연구를 수행하였다. 에스테르계 바인더가 10 wt% 이상 첨가되면 센서 적용이 가능한 cross cut 등급이 3B 이상을 나타내었다. 바인더의 과량 첨가는 전도성 페이스트의 전기적 특성에 영향을 줄 수 있으며 실제로 황산에 대한 반응성이 감소함을 확인하였다. 전기적 특성 개선을 위해 카본블랙(carbon black, CB) 함량 변화 시험을 수행하였고 CB 2 wt%에서 최적의 전기적 특성을 보임을 확인하였다.

• ETRI Journal
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• 제32권3호
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• pp.414-421
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• 2010

The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.

• 문화기술의 융합
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• 제4권3호
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• pp.209-212
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• 2018

이방성 도전필름(ACF)을 사용한 본딩은 납땜이 용이하지 않은 이질적인 소재 간 미세 접합을 형성하는데 널리 사용되어진다. 성공적인 ACF 본딩 구현을 위한 3가지 제한조건이 존재한다. 본딩 접촉점은 설정된 작업 시간동안 적절한 압력과 온도를 유지한 헤드에 의해서 압착되어야 한다. 본 논문에서는 머신 비전을 기반으로 한 ACF 본딩기법을 제안하고 실험을 통해 검증한다. 시스템은 본딩 작업대 상의 PCB 위치 및 방향을 계산하고 헤드가 압착되어야 하는 최적의 접촉점을 결정한다. 제안한 시스템이 접촉면 상의 헤드 평탄도를 보장함으로써 접착력을 향상시킬 수 있음을 실험결과를 통해 보여준다.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.207-214
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• 2001

The conductive polymers, polyaniline (PANI) emeralidin base and 3,4-polyethylene dioxythiophene(PEDOT) were synthesized and coated on the PET film dealt with acryl type primer to study the electromagnetic shielding effectiveness. When both PANI and PEDOT were coated on the PET film dealt with acryl type priemer, their surface properties such as he adhesive increased. For PANI, when blended with the binder such as PMMA, it adhesive and surface hardness increased, too. The visible light transmittance decreased, while the electromagnetic shielding effectiveness increased, when coated thickness of PANI and PEDOT increased. For PANI, the electromagnetic shielding effectiveness increased as its surface resistance decreased. For PANI, when the surface resistance was 140 Ω/$\square$, the shielding effectiveness was found to be 11 dB in the far field, and 13 dB in the near field at 1 GHz. For PEDOT, when the surface resistance was 200 Ω/$\square$, the shielding effectiveness was found to be 3 dB in the far field, and 7dB in the near field.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.