[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.7471/ikeee.2018.22.1.193

High Temperature Reliability Study of Anisotropic Conductive Adhesive for Electronic Components

Woo, Eun-Ju (JIANGXI HOLITECH KOREA BRANCH)
Moon, Yu-Sung (JIANGXI HOLITECH KOREA BRANCH)
Kim, Jung-Won (JIANGXI HOLITECH KOREA BRANCH)

Publication Information

Journal of IKEEE / v.22, no.1, 2018 , pp. 193-196 More about this Journal

Abstract

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

Keywords

Touch panel; ACP; ACF; FPC; High temp; CTE;

Citations & Related Records

Reference

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