• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.53-60
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• 2018

In this paper, the effect of different 3D printing parameters including laminated angle and annealing temperature is observed their effect on FDM conductive 3D printing. In FDM 3D printing, a conductive filament is heated quickly, extruded, and then cooled rapidly. FDM 3D Print conductive filament is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress. when the printed conductive specimens this internal stress can be increase electrical resistance and decrease electrical conductivity. Therefore, This experiment would like to use annealing to remove internal stress and increase electrical conductivity. The result of experiment when 3D printing conductive specimen be oven cooling of annealing temperature $120^{\circ}C$ electrical resistance appeared decrease than before annealing. So We have found that 3D printing annealing removes internal stresses and increases the electrical conductivity of printed specimens. These results are very useful for making conductive 3D printing electronic circuit, sensor ect...with electrical conductance suitable for the application.

• Journal of the Korean Applied Science and Technology
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• v.35 no.3
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• pp.935-939
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• 2018

3D Printing technology is developing in various prototypes for medical treatment, food, fashion as well as machinery and equipment parts production. 3D printing technology is also able to fully be utilized to other industries in terms of developing its technology which has been reported in many field of areas. 3D printing technology is expected to be used in various applications related to $4^{th}$ industrial revolution such as finished products and parts even it is still carried out in the prototype model. In this study, we have investigated and developed conductive resin for 3d printing application based on reduced graphene oxide(rGO)/Polypyrrole(Ppy) composite and polycaprolactone(PCL) as a biodegradable polymer. The electrical properties and surface morphology of the conductive PCL resin based on therGO/Ppy composite were analyzed by 4point-probe and scanning electron microscope(SEM). The conductive PCL resin based on rGO/Ppy composite is expected to be applicable not only 3D printing, but also electronic materials in other industrial fields.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.81-88
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• 2020

In this paper, the performances of the electrical characteristics of the Fused Deposition Modeling (FDM) 3D-printed flexible resistance sensor was evaluated. The FDM 3D printing flexible resistive sensor is composed of flexible-material thermoplastic polyurethane and a conductive PLA (carbon black conductive polylactic acid) polymer. While 3D printing, polymer filaments heat up quickly before being extruded and cooled down quickly. Polymers have poor thermal conductivity so the heating and cooling causes unevenness, which then results in internal stress on the printed parts due to the rapidity of the heating and cooling. Electrical resistance measurements show that the 3D-printed flexible sensor is unstable due to internal stress, so the 3D-printed flexible sensor resistance curve does not match the increases and decreases in the displacement curve. Therefore, annealing was performed to eliminate the mismatch between electrical resistance and displacement. Annealing eliminates residual stress on the sensor, so the electrical resistance of the sensor increases and decreases in proportion to displacement. Additionally, the resistance is lowered in comparison to before annealing. The results of this study will be very useful for the fabrication of various devices that employ 3D-printed flexible sensor that have multiple degrees of freedom and are not limited by size and shape.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.63-71
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• 2020

Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.174-182
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• 2020

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

• Design & Manufacturing
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• v.13 no.3
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• pp.1-11
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• 2019

Recently, studies on the development of flexible electronic devices by combining flexible materials and a conductor have been actively performed as interest in wearable devices. Especially, carbon nanotubes (CNT) or graphene coating have been used to construct a circuit to induce improvement in flexibility and rigidity. Various technologies have been developed in the surface coating of conductive materials, which are key to the manufacture of flexible electronic devices. Surface coating products with 3D coating and micro-patterns have been proposed through electrospinning, electrification, and 3D printing technologies. As a result of this advanced surface coating technology, there is a growing interest in manufacturing gradient conductive surfaces. Gradient surfaces have the advantage that they are adapted to apply a gentle change or to inspect optimum conditions in a particular region by imparting continuously changing properties. In this study, we propose a manufacturing technique to produce a continuous gradient conductive surface by combining a partial stretching of elastomer and a conductive material coating, and introduce experimental results to confirm its performance.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.154-154
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• 2006

Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• Journal of the Korea Fashion and Costume Design Association
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• v.22 no.2
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• pp.117-136
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• 2020

The purpose of this study is to analyze changes in high-tech fashion along with the types and characteristics of high-tech fashion that have appeared recently providing diverse material for the fashion field. High-tech fashion requires such research to learn how much distance one has in one's life. It is also meaningful to predict what direction high-tech fashion research may be needed. For research methods, previous research and literary studies were considered and photographs in which high-tech techniques were used were collected using the keyword 'high-tech fashion'. High-tech fashion types can be organized into the four types of luminescent types, mutual interaction types, 3D printing fashion, and virtual fashion. The research results were as follows. First, luminescent fashion was an important expression method of high-tech fashion. Materials for luminescent fashion first started with LED electric wire connections and many methods have been attempted with the appearance of electrically conductive clothing material, such as luminescent lasers and beam projectors. Second, interactive high-tech fashion often appears as variable fashion. The work of Hussein Chalayan, which was combined with advanced technology, set up a base for variable type interactive high-tech fashion in the 2000s. As bioengineering technology has developed, fashion that interacts with the environment without an energy source has appeared and the interaction among fashion, people, and the environment can be seen. Third, diverse forms of expressiveness in virtual reality such as 3D CLO shows a great difference with past high-tech fashion. Simple and diverse attempts made through virtual fittings reduce the limitations of time and space, permit interaction, and add a sense of reality through speed and dynamic physical beauty. Fourth, 3D printed fashion expresses complex and detailed clothing material that is different from those before with the development of computer 3D modeling technology. Modeling that can imitate geometric and bio-engineered structures is possible and mysterious feelings are passed on to people through creative expressions.