• 한국기계가공학회지
• /
• 제17권6호
• /
• pp.53-60
• /
• 2018

In this paper, the effect of different 3D printing parameters including laminated angle and annealing temperature is observed their effect on FDM conductive 3D printing. In FDM 3D printing, a conductive filament is heated quickly, extruded, and then cooled rapidly. FDM 3D Print conductive filament is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress. when the printed conductive specimens this internal stress can be increase electrical resistance and decrease electrical conductivity. Therefore, This experiment would like to use annealing to remove internal stress and increase electrical conductivity. The result of experiment when 3D printing conductive specimen be oven cooling of annealing temperature $120^{\circ}C$ electrical resistance appeared decrease than before annealing. So We have found that 3D printing annealing removes internal stresses and increases the electrical conductivity of printed specimens. These results are very useful for making conductive 3D printing electronic circuit, sensor ect...with electrical conductance suitable for the application.

• 한국응용과학기술학회지
• /
• 제35권3호
• /
• pp.935-939
• /
• 2018

3D프린팅 기술은 산업적 응용을 넘어서 기계 설비 및 각종 장비의 부품생산뿐만 아니라 의료, 식품, 패션에 이르기까지 많은 시제품들의 개발 및 연구가 진행되고 있다. 3D 프린팅 기반 기술의 적용사례를 볼 때 정밀도와 제작 속도 측면에서도 다른 산업에 충분이 활용될 수 있는 기술의 개발이 보고되고 있으나, 아직까지는 시제품 위주로 이용되고 있으며, 향후 3D 프린팅 기술은 4차산업혁명과 관련하여 광범위한 분야에서 응용될 수 있는 완성품이나 부품제작에 이용될 것으로 예상된다. 본 연구에서는 탄소나노 재료중 대표적으로 많이 이용되는 환원그래핀 [rGO(reduced graphene oxide)]과 전도성 고분자중 생체 친화적인 특성을 갖는 폴리피롤[Ppy(Polypyrrole)]의 복합체를 생분해성 고분자인 폴리카프로락톤 [PCL(polycaprolactone)]과 혼합하여 3D 프린팅용 전도성 레진을 개발하고자 하였다. 결과로, 폴리피롤과 환원그래핀 각각 5 wt%, 0.75 wt% 에서 최적의 전기적 특성을 나타내었으며, 환원그래핀의 농도에 따른 표면분석에서도 이와 부합하는 결과를 확인 할 수 있었다. 본 연구를 통하여 제조된 전도성 레진은 3D 프린팅 뿐만 아니라, 다른 산업분야의 전자재료에도 적용이 가능할 것으로 사료된다.

• 한국기계가공학회지
• /
• 제19권1호
• /
• pp.81-88
• /
• 2020

In this paper, the performances of the electrical characteristics of the Fused Deposition Modeling (FDM) 3D-printed flexible resistance sensor was evaluated. The FDM 3D printing flexible resistive sensor is composed of flexible-material thermoplastic polyurethane and a conductive PLA (carbon black conductive polylactic acid) polymer. While 3D printing, polymer filaments heat up quickly before being extruded and cooled down quickly. Polymers have poor thermal conductivity so the heating and cooling causes unevenness, which then results in internal stress on the printed parts due to the rapidity of the heating and cooling. Electrical resistance measurements show that the 3D-printed flexible sensor is unstable due to internal stress, so the 3D-printed flexible sensor resistance curve does not match the increases and decreases in the displacement curve. Therefore, annealing was performed to eliminate the mismatch between electrical resistance and displacement. Annealing eliminates residual stress on the sensor, so the electrical resistance of the sensor increases and decreases in proportion to displacement. Additionally, the resistance is lowered in comparison to before annealing. The results of this study will be very useful for the fabrication of various devices that employ 3D-printed flexible sensor that have multiple degrees of freedom and are not limited by size and shape.

• 한국기계가공학회지
• /
• 제19권1호
• /
• pp.63-71
• /
• 2020

Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.

• 한국결정성장학회지
• /
• 제30권5호
• /
• pp.174-182
• /
• 2020

최근 잉크젯 프린팅 기술을 이용한 인쇄전자 분야가 차세대 기술로서 각광받고 있으며, 복수의 프린트 헤드(head)로부터 다양한 잉크 형태의 소재를 정밀하게 출력하여 적층할 수 있는 3D 프린팅 기술에 관한 연구가 활발하게 진행되고 있다. 본 연구에서는 잉크젯 3D 프린팅 기술을 이용하여 광경화성 실리카 잉크와 PVP가 첨가된 나노 구리 잉크로 절연층과 전도층의 복합구조체를 제작하였다. 프린팅 구동 조건과 잉크의 유변학적 거동을 최적화하여 정밀한 광경화 실리카 절연층을 적층 제조하였으며, 절연층의 저항은 2.43 × 10¹³ Ω·cm의 값을 나타내었다. 광경화 실리카 절연층 위에는 액적 간격 제어를 통하여 나노 구리 전도층을 프린팅하였다. PVP 첨가 나노 구리 잉크의 소결은 IPL 광소결 공정을 이용하였으며, 어닐링 온도와 인가 전압 변화에 따른 전기적, 기계적 특성을 확인하였다. 100℃ 어닐링 온도와 700 V IPL 광소결 조건에서 PVP가 첨가된 나노 구리 전도층의 저항은 29 μΩ·cm으로 매우 낮으며, 광경화 실리카 절연층과의 접착력은 매우 우수한 것으로 확인하였다.

• Design & Manufacturing
• /
• 제13권3호
• /
• pp.1-11
• /
• 2019

Recently, studies on the development of flexible electronic devices by combining flexible materials and a conductor have been actively performed as interest in wearable devices. Especially, carbon nanotubes (CNT) or graphene coating have been used to construct a circuit to induce improvement in flexibility and rigidity. Various technologies have been developed in the surface coating of conductive materials, which are key to the manufacture of flexible electronic devices. Surface coating products with 3D coating and micro-patterns have been proposed through electrospinning, electrification, and 3D printing technologies. As a result of this advanced surface coating technology, there is a growing interest in manufacturing gradient conductive surfaces. Gradient surfaces have the advantage that they are adapted to apply a gentle change or to inspect optimum conditions in a particular region by imparting continuously changing properties. In this study, we propose a manufacturing technique to produce a continuous gradient conductive surface by combining a partial stretching of elastomer and a conductive material coating, and introduce experimental results to confirm its performance.

• 한국정밀공학회지
• /
• 제31권12호
• /
• pp.1061-1066
• /
• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
• /
• pp.154-154
• /
• 2006

글씨 전도성 잉크의 인쇄공정에 있어서 반복인쇄를 정밀하게 수행할 수 있는 기술로서 align system을 개발하였다. 이 system의 resolution 은 0.5um 이며 인쇄 working plate의 이송속도는 최대 1.5m/s 이다. 현재 소성 공정을 포함한 반복인쇄 실험은 30um이상의 drop탄착점 오차를 보이고 있으며, 두께와 전기전도도 향상을 위한 정밀한 align system이 필요하게 되었다. 이를 충족시키기 위해 개발되어진 초정밀 align system은 $1{\sim}2{\mu}m$이내의 오차로 반복인쇄가 가능하며, head가 토출하는 잉크의 straightness 및 전도성 잉크를 토출하는 인쇄평가기의 기계적 정밀도도 확인할 수 있다. 모든 잉크 배선의 두께 항상 인쇄실험이 가능하며, substrate의 종류와 잉크에 제한적이지 않다. 특히 prototype의 기판배선을 위해 PCB에 배선을 형성할 시에 본 system으로 직접 align mark를 지정할 수 있어 기판 내에 미리 제작되어진 align용 인식마크가 불필요하다. 이 system을 이용하여 drop과 배선의 반복인쇄실험을 진행하였으며, 광학현미경과 3D profiler를 사용하여 분석해 보았다.

• 한국기계가공학회지
• /
• 제15권2호
• /
• pp.1-8
• /
• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• 한국의상디자인학회지
• /
• 제22권2호
• /
• pp.117-136
• /
• 2020

The purpose of this study is to analyze changes in high-tech fashion along with the types and characteristics of high-tech fashion that have appeared recently providing diverse material for the fashion field. High-tech fashion requires such research to learn how much distance one has in one's life. It is also meaningful to predict what direction high-tech fashion research may be needed. For research methods, previous research and literary studies were considered and photographs in which high-tech techniques were used were collected using the keyword 'high-tech fashion'. High-tech fashion types can be organized into the four types of luminescent types, mutual interaction types, 3D printing fashion, and virtual fashion. The research results were as follows. First, luminescent fashion was an important expression method of high-tech fashion. Materials for luminescent fashion first started with LED electric wire connections and many methods have been attempted with the appearance of electrically conductive clothing material, such as luminescent lasers and beam projectors. Second, interactive high-tech fashion often appears as variable fashion. The work of Hussein Chalayan, which was combined with advanced technology, set up a base for variable type interactive high-tech fashion in the 2000s. As bioengineering technology has developed, fashion that interacts with the environment without an energy source has appeared and the interaction among fashion, people, and the environment can be seen. Third, diverse forms of expressiveness in virtual reality such as 3D CLO shows a great difference with past high-tech fashion. Simple and diverse attempts made through virtual fittings reduce the limitations of time and space, permit interaction, and add a sense of reality through speed and dynamic physical beauty. Fourth, 3D printed fashion expresses complex and detailed clothing material that is different from those before with the development of computer 3D modeling technology. Modeling that can imitate geometric and bio-engineered structures is possible and mysterious feelings are passed on to people through creative expressions.