• 한국기계가공학회지
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• 제14권4호
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• pp.126-133
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• 2015

To enhance the productivity and quality of the compound process of progressive dies and transfer dies, the semi-progressive method is applied in the material supply step to produce blanks, and then the transfer method is applied. Parts are transferred among processes by means of the finger and transfer bar in the transfer die, and the final seat cushion panel is produced. The main challenge in the current study is how to deform a seat cushion panel while meeting the design specifications without any defects. In order to obtain this technology, a sheet metal-forming simulation and die forming of the seat cushion panel were adopted; as a result, a compound die-forming technology for the automotive seat cushion panel, combining both semi-progressive die and transfer die for continuous production, was successfully developed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.559-562
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• 2000

Bending is one of the most common cold-stamping operations, recently it is many used to produce structural frame. Depending on the shape and dimensions of complex structural frame, a successive bending operation with simple dies may be economic. But, in this paper, it has been focused to reduce the bending operations by a successive-action compound die. Designed compound-die consists of blank-holder, cam, wedge and etc. In the result, this compound-die for structural frame enabled that it makes seven bending processes into one process, and improved productivity.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.182-186
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• 1996

In this work, a method is described to investigate the progressive and compound process in the coining and piercing operation for given conditions and parameters, using the FEM simulation and model experiment. The effect of the die shape on the compound process is established, and the die shape depends on the position of coining die and the width of the part coined. It is found that Progressive process is better than compound process, since material's filling into the die is not completed and the higher stress acts on the edge of the punch according to width being increased.

• Design & Manufacturing
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• 제6권2호
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• pp.37-41
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• 2012

Usually compound dies are used in clinch washer production. However, in this study, a fine blanking die is designed and manufactured, and clinch washers are produced by the die. Clinch washers are for electric exhaust gas recirculation (EEGR) and they recirculate some of exhaust gas to reduce harmful substances. Fine blanking automation production eliminates difficulties operators face on conventional press.

• 한국해양공학회지
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• 제16권2호
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• pp.38-43
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• 2002

Die-less forming is a cold forming process which is to bend thick flat plates into compound curved plates using two asymmetric rollers. This forming method has several advantages compared with line heating which is widely used to fabricate compound curved pieces in shipyards. The die-less forming, however, has scarcely been studied. Even the deformation mechanism in this forming process has not been understood clearly. So, in this paper, the deformation characteristics of die-less forming is investigated analytically and numerically. for the analytic investigation, slab method based on equilibrium equation is applied. And the mechanism of curvature generation is derived for the asymmetry in roller applied. And three dimensional numerical analyses are performed with realistic modeling of interactions between the rollers and work-piece using finite element program, ABAQUS. It is shown that curvature generation is mainly due to the difference of normal positive strain distribution between the top and bottom surface of the work-piece. And a convex-type curved plate is formed if the center region of the work-piece is rolled with asymmetric rollers of which the lower is larger than the upper in diameter.

• 한국정밀공학회지
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• 제13권9호
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• pp.156-164
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• 1996

Tool interference is one of the most critical problems in machining die cavities and punches. When machining concave or convex regions of cavities with large radius tool in rough cutting, the tool easily overcuts or undercuts the portions of the surface, which result in machining inaccuracy. So the generation of interference-free tool path must be required for more efficient rough cutting. In this paper, we present a method for modeling die cavities which consist of simple surface or analytic compoyund surfaces and present an algorithm for checking and removing the tool interference occurred in machining the die cavities. Using these algorithms, we can represent a die cavity, and check the interfer- ence regions, and then remove these interferences. Especially we focus on the side interference in the sides of analytic elements and base surface boundary.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.202-207
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• 2003

This paper is focused on a compound forging technology of the blower blade and the process flow in the production of the blade. It shows this compound technology is reliable and economical for the production of big blades.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Elastomers and Composites
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• 제46권1호
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• pp.54-59
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• 2011

점탄성 흐름의 특성은 압출시 다이 스웰 현상에서 확인 할 수 있다. 본 연구는 이러한 점탄성 특성을 갖는 고무 컴파운드를 모세관 다이에서 비선형 점탄성 모델인 PTT 모델과 간략화된 점탄성 모델을 이용하여 압출현상을 모사하고 다이 스웰을 실험과 비교 하였다. 실험은 Fluidity Tester를 이용하였고 해석은 상용화된 CFD Code인 Polyflow를 이용하였다. 두 모델에 의해 예측된 다이 스웰은 실험과 유사한 결과를 보였다. 그러나 PTT 모델에서는 압력과 속도분포, 레저버의 모서리에서의 와류현상을 예측할 수 있었지만 간략화된 점탄성 모델에서는 예측할 수 없었다. 간략화된 점탄성 모델은 다이 내부의 세밀한 흐름현상을 예측하지는 못하지만 다이 스웰은 잘 예측할 수 있으며 PTT모델보다 해석시간이 매우 짧아서 이의 응용에 큰 장점을 갖고 있다고 판단된다.

• 한국지능정보시스템학회:학술대회논문집
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• 한국지능정보시스템학회 2001년도 The Pacific Aisan Confrence On Intelligent Systems 2001
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.