• Composites Research
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• v.35 no.6
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• pp.431-438
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• 2022

Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users' safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.

• Journal of the Korean institute of surface engineering
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• v.53 no.4
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• pp.160-168
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• 2020

A polymer-based carbon nanomaterial composite was fabricated and characterized for the application of a thermal conductive adhesive. Low-dimensional carbon nanomaterials with excellent thermal conductivity such as carbon nanotube (CNT) and graphene were selected as a filler in the composite. Thermal, electrical and adhesive properties of the composite were investigated with respect to the morphology and content of the low-dimensional carbon nanomaterials. As a result, the composite-based adhesive fabricated by the loading of surface-treated MWCNTs of 0.4 wt% showed uniform dispersion, moderate adhesion and effective heat dissipation properties. Finally, it was confirmed through the thermal image analysis of LED module that the temperature reduction of 10℃ was achieved using the fabricated composite adhesive with MWCNT-6A. Expecially, heat dissipation performance of the optimized composite adhesive was evident at the hot spot in the module compared to other samples mixed with graphene or different MWCNT loading ratios.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.198-205
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• 2017

Thermal dissipation was investigated for poly methyl methacrylate (PMMA) composite films containing graphite and multi wall carbon nanotube(CNT) powders as filler materials. After mixing PMMA with fillers, solvent, and dispersant, the pastes were prepared by passing through a three roll mill for three times. The prepared pastes were coated $15{\sim}40{\mu}m$ thick on a side of 0.4 mm thick aluminium alloy plate and dried for 30 min at $150^{\circ}C$ in an oven. The content of fillers in dried films was varied as 1, 2, and 5 weight % maintaining the ratio of graphite and CNT as 1:1. Raman spectra from three different samples exhibited D, G and 2D peaks, as commonly observed in graphite and multi wall CNT. Among those peaks, D peak was prominent, which manifested the presence of defects in carbon materials. Thermal emissivity values of three samples were measured as 0.916, 0.934, and 0.930 with increasing filler content, which were the highest ever reported for the similar composite films. The thermal conductivities of three films were measured as 0.461, 0.523, and $0.852W/m{\cdot}K$, respectively. After placing bare Al plate and film coated samples over an opening of a polystyrene box maintained for 1 h at $92^{\circ}C$, the temperatures inside and outside of the box were measured. Outside temperatures were lower by $5.4^{\circ}C$ in the case of film coated plates than the bare one, and inside temperatures of the former were lower by $3.6^{\circ}C$ than the latter. It can be interpreted that the PMMA composite film coated Al plates dissipate heat quicker than the bare Al plate.

• Composites Research
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• v.35 no.3
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• pp.175-181
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• 2022

Due to the increasing number of wireless communication devices in mmWave frequency bands, there is a high demand for electromagnetic interference (EMI) shielding and heat dissipating materials to avoid device malfunctions. This paper proposes an EMI shielding composite film with a high heat dissipation characteristic. To achieve this, a conductive grid is integrated with a polymer-based composite layer including magnetic and heat dissipating filler materials. A high shielding effectiveness (>40 dB), low reflection shielding effectiveness (<3 dB), high thermal conductivity (>10 W/m·K), thin thickness (<500 ㎛) are simultaneously achieved with a tailored design of composite layer compositions and grid geometries in 5G communication band of 26.5 GHz.

• Composites Research
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• v.33 no.1
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• pp.7-12
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• 2020

Over the past decade, liquid crystalline epoxy (LCER) has attracted much attention as a promising matrix for the development of efficient heat dissipation materials. This study presents a comprehensive study including synthesis, preparation and chacterization of polymer/inorganic composites using typical 4,4-diglycidyloxybiphenyl (DP) epoxy among LECR. To confirm the thermal conductivity of composite materials, we have prepared composite samples composed of epoxy resin and single-wall carbon nanotube (SWCNT) as a filler. In particular, DP composites exhibit higher thermal conductivity than commercial epoxy composites that use the same type of filler due to the highly ordered microstructure of the LCER. In addition, the thermal conductivity of the DP composite can be controlled by controlling the amount of filler. In particular, the DP composite containing a SWCNT content of 50 wt% has the highest thermal conductivity of 2.008 W/mK.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.

• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.331-337
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• 2022

Manufactured thermoplastic composite materials to replace the metal materials used as battery housing materials for electric vehicles with lightweight materials. As the matrix material, nylon 6 which is a polymer material was used. Boron Nitrate(BN), which has high thermal conductivity, was used to provide heat dissipation performance. The heat dissipation characteristics of the thermally conductive polymer composite material according to the BN content and particle size were analyzed. The thermal conductivity value increased as the filler content increased, and composite materials particle size of 60 to 70㎛ and BN content of 50%, the thermal conductivity was 1.4 W/mK. The larger the particle size, the wider the inter-particle interface contact surface, which means that a thermal path was formed. wider the interfacial contact surface between the particles, and the thermal path was formed. A battery housing was manufactured using the manufactured thermally conductive polymer composite material, and the temperature change during charging and discharging of the cell was observed, and the possibility as a substitute material for the battery housing was confirmed.