• Title/Summary/Keyword: Complex Antenna System

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Molecular Characterization of a cDNA Encoding Chlorophyll a/b Binding Protein (Cab) from Panax ginseng C. A. Meyer (고려인삼 Chlorophyll a/b Binding Protein(Cab) 유전자의 동정 및 분자적인 특성분석)

  • In Jun Gyo;Lee Bum Soo;Youn Jae-Ho;Son Hwa;Kim Se Young;Yang Deok Chun
    • Korean Journal of Plant Resources
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    • v.18 no.3
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    • pp.441-449
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    • 2005
  • Photo system II (PSII) is one of the two photosynthetic reaction centers in the chloroplast of higher plants. The chlorophyll a/b-light harvesting complex serves primarily as an antenna for PSII. We isolated a cDNA that encodes a chlorophyll a/b-binding protein (Cab) from Panax ginseng. The small subunit consists of 935 nucleotides long and has an open reading frame of 795 bp with the deduced amino acid of 265 residues (pI 5.63), 28.6 kDa. The deduced amino acid sequence matched to the previously reported Cab genes. Their degree of amino acid identity ranged from 68 to $92\%$. Phylogenetic analysis based on the amino acid residues was showed that the ginseng Cab gene was grouped with P. persica (AAC34983), A. thaliana (AAD28771), G. hirsutum (CAA38025), G. max (AAL29886), and V. radiate (AAF89205).

Chip-level NFP Calibration and Verification Using Improved Probe for NFS Standardization (NFS 표준을 위한 개선된 프로브를 이용한 칩 수준 NFP 측정값 교정 및 검증)

  • Lee, Pil-Soo;Wee, Jae-Kyung;Kim, Boo-Gyoun;Choi, Jai-Hoon;Yeo, Soon-Il
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.6
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    • pp.25-34
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    • 2012
  • New calibration method for the near-field scanning (NFS) system is presented. The proposed calibration method consisted of a new near-field antenna (NFP) and newly devised patterns as circular patch patterns (CPPs) and meander patterns (MPs). The proposed patterns were used for improving spatial resolutions and simplifying a calibration procedure of the NFP compared to the conventional method defined in the IEC61967-3 and 6. Also, the effect of the length of NFPs on attenuation characteristics was investigated with length of 8mm and 30mm. For them, we designed and fabricated CPPs of diameter (D) = 20, 40, 60, and 100mm and MPs of various widths and spaces. We found the reverse relations between spatial resolutions and heights of measuring points by using simplified calibration procedure. The testing result shows that the spatial resolution of $120{\mu}m$ at height of $200{\mu}m$ was verified without complex correlation algorithms under 8GHz. For manufacturing cost all patterns and the NFP were realized with low-cost fabrication using PCB (FR-4) not by a conventional LTCC process. For verification of chip-level EMC from the results, near-field scanning system (NFSS) having step resolution of Sub-micron scale was produced and by using the proposed NFSS and proposed NFP measurement of chip shows accurately the shape of the resolution of $200{\mu}m$ patterns for securing a high level of chip-level EMC verification.