• JSTS:Journal of Semiconductor Technology and Science
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• 제14권6호
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• pp.733-740
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• 2014

A resistive micro Pirani gauge using amorphous silicon (a-Si) thin membrane is proposed. The proposed Pirani gauge can be easily integrated with the other process-compatible membrane-type sensors, and can be applicable for in-situ vacuum monitoring inside the vacuum package without an additional process. The vacuum level is measured by the resistance changes of the membrane using the low noise correlated double sampling (CDS) capacitive trans-impedance amplifier (CTIA). The measured vacuum range of the Pirani gauge is 0.1 to 10 Torr. The sensitivity and non-linearity are measured to be 78 mV / Torr and 0.5% in the pressure range of 0.1 to 10 Torr. The output noise level is measured to be $268{\mu}V_{rms}$ in 0.5 Hz to 50 Hz, which is 41.2% smaller than conventional CTIA.

• 정보통신설비학회논문지
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• 제8권2호
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• pp.90-95
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• 2009

All-optical fiber-type gain flattening filer (GFF) for an EDFA (Erbium doped fiber amplifier) were fabricated by using a FBT (fiber biconical tapered) process and the performance of the GFF was tested and athermal package was proposed. Historically, the chief contributor to gain unevenness has been the EDFA. Due to the inherent gain response of the EDFA's operation, there is always a modest imbalance in the gain applied as a function of wavelength. FBT methods have been used to make fiber type couplers and WDM filter since 1980. Attractivity of this methods was simple, cost effective and thermal stability. Simulation program tool is made to design target GFF profile for this paper. Fiber coupler manufacturing machine is modified for the GFF process. The final GFF is obtained by cascading 4 unit filter that has 6 taper stage. Test result shows 1 dB of wavelength flatness in the C band. Polarization dependent loss is under 0.15dB. The center wavelength variation is below ${\pm}$0.35nm at the temperature range of $20^{\circ}C$ to $70^{\circ}C$.

• 산경연구논집
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• 제15권3호
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• pp.31-46
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• 2024

Purpose: Employees in the beauty industry, where emotional labor is essential, are exhausted due to stress from excessive working hours and low pay, and ultimately consider changing jobs. This study analyzed the structural relationship of turnover intention according to job stress of beauty industry employees. We tried to present implications by verifying the methods necessary for conflict management in the beauty industry from an empirical point of view. Research design, data and methodology: This study selected 518 workers in the beauty industry as a sample. Frequency analysis, validity and reliability analysis, factor analysis, correlation analysis, and regression analysis were performed using SPSS (Statistical Package for Social Science) WIN23.0. Results: The moderating effect of work experience, a moderating variable, was found to be significant in the effect of job stress of beauty industry employees following changes in the employment environment on the dependent variable, turnover intention. Conclusion: This study revealed that changes in the employment environment negatively affect the job stress of beauty workers. To reduce the job stress of employees in the beauty industry, a systematic response at the organizational level will be necessary. In addition, it is expected that it will help establish differentiated strategies such as compensation system, service training, and service management to reduce job stress.

• 한국콘텐츠학회논문지
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• 제19권7호
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• pp.478-488
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• 2019

본 연구는 치과위생사의 직무만족도에 영향을 미치는 요인을 확인하기 위하여 시행된 조사연구이다. 부산 경남 지역의 치과의료기관에 근무하는 224명의 치과위생사를 대상으로 조사하였다. 수집된 자료를 SPSS(Statistical Package for Social Science) Ver.19.0으로 분석한 결과는 다음과 같다. 연구대상자의 의사소통능력은 $3.32{\pm}0.49$점, 대인관계능력은 $3.45{\pm}0.48$점, 직무만족도는 $3.19{\pm}0.44$점으로 나타났다. 일반적 특성에 따른 의사소통능력은 기혼이 미혼보다 높았고, 임상경력이 많을수록 높았다. 일반적 특성에 따른 대인관계능력은 학력이 높을수록, 임금이 많을수록, 경영 및 직원관리 담당자가 높게 나타났다. 일반적 특성에 따른 직무만족도는 경영 및 직원관리 담당자가 높게 나타났다. 연구대상자의 직무만족도에 영향을 미치는 요인 파악하기 위해 다중회귀 분석한 결과 임상경력이 낮을수록, 의사소통능력과 대인관계능력이 높을수록 직무만족도가 높게 나타났다. 이상의 결과를 바탕으로 치과위생사의 직무만족도를 높이기 위해 적절한 보상체계가 이루어져야 하며, 의사소통능력과 대인관계능력을 향상시켜야 할 것이다.

• 산업경영시스템학회지
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• 제40권3호
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• pp.59-65
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• 2017

The purpose of this study is to investigate the factors and effects of job stress of construction workers on construction accidents and turnover intention in order to improve the field work environment of construction industry which shows higher industrial accidents than other industries. To this end, research models and hypotheses were established based on previous research, and the questionnaire was distributed to 10 construction companies in Daejeon, Sejong, and Chungcheong provinces. The 301 data collected were performed statistical analysis such as basic statistical analysis, factor analysis, reliability analysis, correlation analysis, regression analysis, and logistic regression analysis using the statistical package (IBM SPSS 22). The results of this study are summarized as follows. First, job stress has a significant effect on accident occurrence. Among the sub-factors of job stress, there was positive (+) influence on work culture and relationship conflict between peers, and organizational system had negative influence. Job demands, compensation incompetence, and job instability were not statistically significant. Therefore, it is necessary to concentrate on the factors of work culture, organizational system, and relationship conflict in the construction site. Second, job stress has positive effect on turnover intention. Job stress, inadequacy of compensation, and work culture were positively related to turnover intention. Third, job demands have a slightly greater impact than compensatory inadequacies. The factors that make the job turnover more important are the excessive job burdens such as respect, internal motivation, responsibility rather than expectation non-conformity, time pressure, increase of work load. Therefore, in order to reduce the turnover intention of the construction worker, it is necessary to pay attention to improvement of the job requirement. Fourth, the worker's job stress could overcome by exercise and fatigue elimination, work environment management, and self-opening for others. It is necessary to establish a work environment management system for counseling and intimacy formation to open up the exercise and fatigue relief program of the workers at the construction site and to open themselves between the workers and the supervisors.

• 산업진흥연구
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• 제2권2호
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• pp.31-44
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• 2017

본 연구는 조직구성원인 인식하는 조직 내 커뮤니케이션 유형과 학습전이 풍토 간의 영향관계를 알아보기 위한 연구로 독립변인으로 설정한 조직 내 커뮤니케이션 유형은 상사와 커뮤니케이션, 매체 질 커뮤니케이션, 동료와 커뮤니케이션, 조직 전망 커뮤니케이션의 4개 변수로 제시하였으며, 종속변인인 학습전이풍토는 상사지원, 동료지원, 전이기회, 조직보상 인식의 4개 하위변수로 구성하였다. 본 연구목적을 달성하기 위해 2015년 중소기업 핵심직무역량 교육과정에 참여한 후 3개월 이상 경과한 참가자 150명을 대상으로 통계상 무의미한 설문을 제외 한 116부를 최종 활용하였다. 한편, 수집된 자료는 SPSS 20.0의 통계패키지 프로그램을 사용하여 빈도순석, 요인분석(Factor Analysis), 신뢰도 검증, 기술통계분석, 단순 다중회귀분석을 통해 연구가설을 검증하였다. 본 연구 결과 첫째, 조직 내 커뮤니케이션 유형과 학습전이 풍토인 상사의 지원 간의 영향관계에서 조직 내 커뮤니케이션 유형의 상사와 커뮤니케이션, 매체의 질 커뮤니케이션, 동료와 커뮤니케이션, 조직전망에 대한 커뮤니케이션은 모두 상사의 지원에 정(+)의 유의한 영향관계를 나타내었다. 둘째, 조직 내 커뮤니케이션 유형은 학습전이 풍토의 동요의 지원에는 모두 영향을 미치지 않는 것으로 나타났다. 셋째, 조직 내 커뮤니케이션 유형과 학습전이 풍토의 전이기화 간의 영향관계에서는 동료와 커뮤니케이션을 제외한 상사와 커뮤니케이션, 매체의 질 커뮤니케이션, 조직전망에 대한 커뮤니케이션이 전이기회에 정(+)의 영향관계를 나타내었다. 마지막으로 조직 내 커뮤니케이션 유형과 학습전이 풍토의 조직보상 인식에 대한 영향관계에서는 상사와 커뮤니케이션과 조직전망에 대한 커뮤니케이션이 정(+)의 영향관계를 나타냈다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 전자공학회논문지D
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• 제35D권10호
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• pp.22-28
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• 1998

플라스틱 패키지 재료가 본딩와이어의 혼신에 미치는 영향을 모멘트법 (Method of Moments)을 이용하여 주파수 영역에서 해석하고, fast Fourier transform을 적용하여 시간 영역에서의 전송 및 혼신 펄스 응답을 구하였다. 해석결과, 본딩와이어가 플라스틱 패키지 내부에 있을 때, 전송 특성은 유전효과로 인하여 개선되나 혼신은 증대된 방사효과로 인하여 크게 증가하며, 이러한 혼신 증가는 시간영역에서의 혼신 펄스 왜곡 현상을 현저하게 함을 관찰하였다. 한편, 정적 해석 방법을 이용한 플라스틱 패키지에 묻힌 본딩와이어의 해석 결과로부터, 모멘트법 결과와는 달리 방사효과에 의하여 증대되는 혼신현상을 계산하지 못하므로 본딩와이어 초고속 펄스 혼신 예측에는 적합하지 않음을 확인하였다. 또한, 본딩와이어 구조를 변화시키면서 혼신 펄스 응답을 살펴 본 결과, 방사효과에 의한 혼신의 우세함으로 인하여 본딩와이어간의 단순한 사이 간격 증가는 혼신감소에 효과적이지 않음을 관찰하였다. 본 해석 결과는 고속 디지털 IC 및 초고주파 소자의 플라스틱 패키지 설계시 유용하게 사용될 수 있으리라 기대된다.

• 한국치위생학회지
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• 제19권2호
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• pp.287-295
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• 2019

Objectives: The purpose of this study was to investigate the factors affecting subjective oral symptoms according to the gender of youth from multi-cultural families in Korea using data from the 14th (2018) Korean Youth Health Behavior Survey. Methods: The independent variables used in this study consisted of gender and sweet drink intake. The dependent variable was experience of subjective oral symptoms. Compensation variables consisted of general characteristics of school type, academic performance, economic status, drinking status, smoking status, and number of tooth brushings day before. The subjects of the study were 835 children of multi-cultural families whose parents were foreigners. All statistical analyses were performed by complex samples cross-tabulation analysis and complex samples logistic regression analysis. Statistical analysis was performed using the PASW statistical package 21.0 (Statistical Packages for Social Science Inc., Chicago, IL, USA). A significance level of 0.05 was used for statistical significance. Results: The composite sample logistic regression analysis showed that there was a statistically significant difference between gender and intake of sweet drinks in experience of subjective oral symptoms. Conclusions: These results suggest that factors influence subjective oral symptoms in Korean multi-cultural adolescents. Therefore, I hope that they will be used as basic data for the introduction and development of a customized oral health education program for improving oral health of multi-cultural adolescents.