The Micro Pirani Gauge with Low Noise CDS-CTIA for In-Situ Vacuum Monitoring |
Kim, Gyungtae
(Department of Electronics, Chungnam National University)
Seok, Changho (Department of Electronics, Chungnam National University) Kim, Taehyun (National Nanofab Center) Park, Jae Hong (National Nanofab Center) Kim, Heeyeoun (National Nanofab Center) Ko, Hyoungho (Department of Electronics, Chungnam National University) |
1 | Xiao, Bin, et al. "Integrated micro Pirani gauge based hermetical package monitoring for uncooled VO x bolometer FPAs." Microsystem technologies 17.1 (2011): 115-125. DOI |
2 | Yon, Jean-Jacques, Eric Mottin, and Jean-Luc Tissot. "Latest amorphous silicon microbolometer developments at LETI-LIR." SPIE Defense and Security Symposium. International Society for Optics and Photonics, 2008. |
3 | Kim, Y., et al. "Uncooled microbolometer arrays with high responsivity using meshed leg structure." (2013): 1-1. |
4 | Jung, Ho, et al. "Design and characteristics of a-Sibased micro-bolometers with shared-anchor structure in vacuum packaged systems." Microsystem Technologies 20.4-5 (2014): 899-905. DOI |
5 | Chae, Junseok, Brian H. Stark, and Khalil Najafi. "A micromachined Pirani gauge with dual heat sinks." Advanced Packaging, IEEE Transactions on 28.4(2005):619-625. DOI |
6 | Punchihewa, Kasun Gardiye, et al. "Comparisons between membrane, bridge and cantilever miniaturized resistive vacuum gauges. "Sensors 12.7 (2012):8770-8781. DOI |
7 | Robinson, A. M., et al. "A thermal conductivity microstructural pressure sensor fabricated in standard complementary metal-oxide semiconductor." Review of scientific instruments 63.3 (1992): 2026-2029 DOI |
8 | Kim, Gyungtae, et al. "High-uniformity post-CMOS uncooled microbolometer focal plane array integrated with active matrix circuit." Sensors and Actuators A: Physical 211 (2014): 138-144. DOI |
9 | Shie, Jin-Shown, Bruce Chou, and Yeong-Maw Chen. "High performance Pirani vacuum gauge." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 13.6 (1995): 2972-2979. DOI |
10 | Lee, S-H., et al. "A low-power oven-controlled vacuum package technology for high-performance MEMS." Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on. IEEE, 2009. |