• Vacuum Magazine
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• v.4 no.3
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• pp.16-20
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• 2017

Graphene has emerged as a promising material for optoelectronic applications including as ultrafast and broadband photodetector, optical modulator, and nonlinear photonic devices. Graphene based devices have shown the feasibility of ultrafast signal processing for required for photonic integrated circuits. However, on-chip monolithic nanoscale light source has remained challenges. Graphene's high current density, thermal stability, low heat capacity and non-equilibrium of electron and lattice temperature properties suggest that graphene as promising thermal light source. Early efforts showed infrared thermal radiation from substrate supported graphene device, with temperature limited due to significant cooling to substrate. The recent demonstration of bright visible light emission from suspended graphene achieve temperature up to ~3000 K and increase efficiency by reducing the heat dissipation and electron scattering. The world's thinnest graphene light source provides a promising path for on-chip light source for optical communication and next-generation display module.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.83-87
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• 2003

본 논문에서는 안테나의 이득을 극대화하기 위해서 Bluetooth PCB Layout 위에 내장형 마이크로 칩 안테나를 직접 설계하여 Bluetooth의 주요 사양인 2.4~2.4835GHz에서 동작할 수 있도록 Bluetooth용 내장형 마이크로 칩 안테나를 설계하였다. Bluetooth PCB Layout 크기는 실제 크기와 같은 54mm$\times$19mm$\times$2.4mm로 설계하고 마이크로 칩 안테나 크기는 11mm$\times$4mm$\times$l.6mm로 설계하여 상용화 된 프로그램인 HFSS에 의해 3.616dBi의 이득을 얻었다. 설계 제작된 Bluetooth용 내장형 마이크로 칩 안테나는 2.45GHz의 중심주파수에서 넓은 대역폭 10.71%을 확인하였다. 또한, 마이크로 칩안테나에서 용량의 변화와 용량의 위치 변화, 급전점의 위치 변화에 따른 공진주파수, 대역폭, 이득 등의 특성을 비교하였고, 제작된 칩안테나의 측정된 방사패턴에서 E-면과 H-면을 비교 분석했다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.4
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• pp.798-804
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• 2003

In this paper, We have designed an advanced circuits for controlling the Ink Nozzle of Printer Head We can fully increase the number of nozzle by reducing the number of Input/Output PADs using the proposed new circuit. The proposed circuit is tested with only 20 nozzles to evaluate functional test using FPGA sample chip. The new circuit architecture can be estimated. Full circuit for controlling 320 nozzles was designed and simulated from ASIC full custom methodology, then the circuit was fabricated by applying 3${\mu}{\textrm}{m}$ CMOS process design rule.

• Journal of information and communication convergence engineering
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• v.14 no.2
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• pp.106-114
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• 2016

Differential sensing methods are more effective in alleviating panel noise than single-line sensing, and thus have been increasingly used in the touch screen industry. However, they have a drawback: they tend to cancel out multiple touches and need touch position recovery algorithms. This paper introduces a novel algorithm of touch position recovery for differential sensing, which is a low-complexity but high-accuracy approach for determining multiple touch positions. We have implemented the proposed method in a touch screen controller system on a chip. In the simulation experiments using realistic touch screen models and a differential sensing circuit, the algorithm exhibited a high detection performance of a signal-to-noise ratio gain of up to 52.21 dB. Therefore, we can conclude that the proposed method is substantially more accurate than the previous method. Further, the proposed method incurs little or no overhead in terms of the detection speed and the chip size.

• Journal of the Korean Ceramic Society
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• v.36 no.6
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• pp.583-589
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• 1999

In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

• Journal of information and communication convergence engineering
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• v.7 no.2
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• pp.215-218
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• 2009

In this paper, temperature stable current and voltage references using simple CMOS bias circuit are proposed. To obtain temperature stable characteristics of bias circuit a bandgap reference concept is used in a conventional circuit. The parasitic bipolar transistors or MOS transistors having different threshold voltage are required in a bandgap reference. Thereby the chip area increase or the extra CMOS process is required compared to a standard CMOS process. The proposed reference circuit can be integrated on a single chip by a standard CMOS process without the extra CMOS process. From the simulation results, the reference current variation is less than ${\pm}$0.44% over a temperature range from - $20^{\circ}C$ to $80^{\circ}C$. And the voltage variation is from - 0.02% to 0.1%.

• Journal of information and communication convergence engineering
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• v.8 no.5
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• pp.534-538
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• 2010

Efficient control of a marine engine requires an engine control unit (ECU) system that handles fast and precise signal processes for in-coming and out-going signals from fast running engines. In order to handle these roles, the sequential control has been adapted in the ECU system in small and medium size ship engines, which has caused high production cost and complexity of the system. Hence, this paper is focused on developing an distributed ECU system for high speed and high precision control of a marine engine by efficiently combining a CPLD chip and a microprocessor. By sharing load at the MCU with the designed CPLD chip, we could achieve in driving a marine engine with high speed and precise control so that the ECU board has been simplified and its production cost has been reduced.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.449-450
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• 2008

In this paper, we present the design of a system on a chip(SoC) based on Powerline Communication for Power-IT. The SoC deals with power information obtained from analog to digital converter and transmits this data via powerline. We integrate main processor, ADC and PLC function into a chip. Also a FPGA-based emulation system is introduced to evaluate a proposed SoC architecture.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1141-1144
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• 2003

For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.3
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• pp.66-76
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• 1995

In this research, a mesh connected VLSI structure is proposed for the real time computation of the generalized Hough transform(GHT). The purpose of the research is to design a generalized Hough transformer that can be realized as a single chip processor. The GHT has been modified to yield a highly parallel structure consisting of simple processing elements(PEs) and communication networks. In the proposed structure, the GHT can be computed by first assigning an image pixel to a PE and performing shift and add operations. The result of the CAD circuit simulation shows that it can be computed in the time proportional to the number of pixels in the pattern. In addition to the Hough transformer, the peak detector has been designed to reduce 1)the number of the I/O operations between the transformer and the host computer and 2) the host computer's burden for peak detection by transmitting only the local peaks detected from the transformed accumulator. It is expected that the proposed single chip Hough transformer with peak detector makes a fast and inexpensive edge based object recognition systems possible for many industrial and military applications.