• Journal of Aerospace System Engineering
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• v.17 no.4
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• pp.58-66
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• 2023

The latest global issues are the Space economy and low-orbit Space communication. 3GPP announced Release 17 standardization in June 2022, and in this regard, the United States prepared a strategy to enhance the competitiveness of the low-orbit 5G-NTN Space industry, and create an ecosystem at the national level in March 2023. Global smartphone semiconductor manufacturers have announced the development and verification results of standard-based chip technology, and satellite communication operators are launching low-orbit 5G-NTN Space communication services and rate products through convergence between terrestrial communication networks. This study diagnoses the current status of Korea's low-orbit 5G-NTN space communication ecosystem. We present our ecosystem creation strategy in terms of fair competition in the market, the service legal system, and the national R&D governance system.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.131-137
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• 2016

In this paper, we analyze the impedance analysis of vertical interconnection through-silicon vias (TSV) that is being studied for the purpose of improving the degree of integration and an electric feature in 3D IC. Also, it is to improve the performance and the degree of integration of the three-dimensional integrated circuit system which can exceed the limits of conventional two-dimensional a IC. In the future, TSV technology in full-chip 3-dimensional integrated circuit system design is very important, and a study on the electrical characteristics of the TSV for high-density and high-bandwidth system design is very important. Therefore, we study analyze the impedance influence of the TSV in accordance with the distance and frequency in a multiple TSV-to-TSV for the purpose of designing a full-chip three-dimensional IC. The results of this study also are applicable to semiconductor process tools and designed for the manufacture of a full-chip 3D IC.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.2
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• pp.431-436
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• 2009

Home network is a rapidly growing area as new technologies are emerging, and new applications are being developed. The progress of home network technologies is growing the home network management technology for control and management of the digital appliances. Embodiment of these home network show marked ich have use for complicated and diversifiable processing. Design of home network system does very important stage through home network comes essential pars. In this paper, We designed and constitute Home network system which designs module using embedded system, STR710F Chip and CC2420 RF Module-Chip with the intention for using RS232C and USB.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.3
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• pp.632-638
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• 2011

This paper presents on-chip Design-for-Testability (DFT) circuit for radio frequency System-on-Chip (SoC) applications. The proposed circuit measures functional specifications of RF integrated circuits such as input impedance, gain, noise figure, input voltage standing wave ratio (VSWRin) and output signal-to-noise ratio (SNRout) without any expensive external equipment. The RF DFT scheme is based on developed theoretical expressions that produce the actual RF device specifications by output DC voltages from the DFT chip. The proposed DFT showed deviation of less than 2% as compared to expensive external equipment measurement. It is expected that this circuit can save marginally failing chips in the production testing as well as in the RF system; hence, saving tremendous amount of revenue for unnecessary device replacements.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.8
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• pp.1415-1423
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• 2007

Total efficiency of transmitter system was improved by developing combinational 2-Way Isohybrid for GSM1900 base station in this paper. The size of product was decreased and the characteristics were stabilized. The isohybrid transmitter combiner of chip coupler type and hybrid coupler type were designed and fabricated. Insertion loss for chip coupler type isohybrid was $3.17\;dB{\sim}3.47\;dB$. On the other hand, insertion loss for hybrid coupler type was $3.17\;dB{\sim}3.42\;dB$. Isolations between ANT and port were $24.23\;dB{\sim}29.98\;dB$ in case of chip coupler type Isohybrid and were $26.28\;dB{\sim}36.91\;dB$ in case of hybrid coupler type, respectively.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.19 no.6
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• pp.175-181
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• 2019

For the purpose of Application to the small radar sensor, the MMIC Chip, which is the core component of the W-band, was designed in Korea according to the characteristics of the transceiver and manufactured by 0.1㎛ GaAs pHEMT process, and compared with the MMIC chip purchased overseas. The noise figure of low noise amplifier, insertion loss of the switch and image rejection performance of the down-converted mixer MMIC chip showed better characteristics than those of commercial chips. The MMIC chip developed in domestic was applied to the transmitter and receiver through W-band waveguide low loss transition structure design and impedance matching to verify the performance after the fabrication is 9.17 dB, which is close to the analysis result. As a result, it is judged that the transceiver can be applied to the small radar sensor better than the MMIC chip purchased overseas.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1526-1531
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• 2007

Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.6
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• pp.34-42
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• 2000

Recently, there is a growing need to develope small-size RF chip inductors operating to GHz to realize high-performance, micro-fabricated wireless communication products. For the development of high-performance RF chip inductors, however, the ferrite-based chip inductors can not be used above 300MHz due to the limitation of the permeability of this material. In this work, small-size, high-performance RF chip inductors utilizing amorphous $Al_2O_3$ core material were investigated. Copper (Cu) with 40${\mu}m$ diameter was used as the coils and the chip inductor size fabricated in this work is $2.1mm{\times}1.5mm{\times}1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on the bottom edges of a core material. The composition of core materials was measured using a EDX. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The developed inductors have the self-resonant frequency (SRF) of 1 to 3.5 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

• Korean Journal of Optics and Photonics
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• v.23 no.6
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• pp.269-273
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• 2012

It is important to control the beam pattern of an LED by the design of a reflector. The optimum conditions of the structure parameters for the 2 segment LED reflector are analyzed and compared as they vary depending on the various intensity distributions of light output on the LED chip surface. It is also interesting that combining various types of reflectors is possible to give several efficient beam patterns, such as the maximum intensity profile or relatively wide controllability of beam angle.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.43 no.11 s.353
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• pp.185-191
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• 2006

DSRC((Dedicated Short Range Communication) is dedicated short range communication for wireless communications between RSE(Road Side Equipment) and OBE(On-Board Unit) within vehicle moving high speed. In this paper, we implemented 5.8GHz DSRC modem according to Korea TTA(Telecommunication Technology Association) standard and investigated implementation results and design process for SoC(System on a Chip) embedding ARM CPU which control overall signal and process arithmetic work. The SoC is implemented by 0.11um design technology and 480pins EPBGA package. In the implemented SoC ($Jaguar^{TM}$), 5.8GHz DSRC PHY(Physical Layer) modem and MAC are designed and included. For CPU core ARM926EJ-S is embedded, and LCD controller, smart card controller, ethernet MAC, and memory controller are designed as main function.