• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1130-1131
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• 2006

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.1
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• pp.11-16
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• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.2
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• pp.24-28
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• 2006

Electrochemical hydrogenation/dehydrogenation properties were studied for a single particle of a Mm-based(Mm : misch metal) hydrogen storage alloy($MmNi_{3.55}Co_{0.75}Mn_{0.4}Al_{0.3}$) for the anode of Ni-MH batteries. A carbon fiber microelectrode was manipulated to make electrical contact with an alloy particle, and the cyclic voltammetry and the galvanostatic charge/discharge experiments were performed. A single particle of the alloy showed the discharge capacity of 280[mAh/g], the value being 90[%] of the theoretical capacity. Data were compared with that of the composite film consisting of the alloy particles and a polymer binder, which is more practical form for Ni-MH batteries. Additionally, pulverization of the alloy particles are directly observed. Compared with the conventional composite film electrodes, the single particle measurements using the microelectrode gave more detailed, true information about the hydrogen storage alloy.

• Korean Journal of Materials Research
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• v.28 no.10
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• pp.583-589
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• 2018

This study investigates the effect of fatigue stress on the damping capacity in a damaged Fe-22Mn-12Cr-3Ni-2Si-4Co damping alloy under fatigue stress. ${\alpha}^{\prime}$ and ${\varepsilon}-martensite$ forms by fatigue stress in the damaged Fe-22Mn-12Cr-3Ni-2Si4-Co damping alloy under fatigue stress. The ${\alpha}^{\prime}$ and ${\varepsilon}-martensite$ forms with the specific direction and surface relief, or they cross each other. With an increasing fatigue stress, the volume fraction of ${\alpha}^{\prime}-martensite$ and ${\varepsilon}-martensite$ increases. With an increasing fatigue stress, the damping capacity increases with an increase in the volume fraction of ${\varepsilon}-martensite$. The increase in the damping capacity in the damaged Fe-22Mn-12Cr-3Ni-2Si-4Co alloy under fatigue stress strongly affects the increase of ${\varepsilon}-martensite$ formed by fatigue stress, but the damping capacity of the damaged Fe-22Mn-12Cr-3Ni-2Si-4Co damping alloy under fatigue stress is strongly controlled by a large amount of ${\alpha}^{\prime}-martensite$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.77-81
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• 2017

Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

• The Journal of Korean Academy of Prosthodontics
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• v.25 no.1
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• pp.317-325
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• 1987

A study on the shear bonding strength between dental alloy and porcelain according to various kidns of sputtered metallic thin films was established by Ingtron universal testing machine, and the change of the elemental weight % at the surface of dental alloy was studied by E.D.S. The kind of metallic thin films were Al, Ni, In, Cr. Ti and Sn with $0.3{\mu}m$ thickness. The dental alloys were Verabond made by Aalba Dent. Co. and Degudent H manufactured by Degussa Co. The control groups were Verabond and Degudent H. The obtained results were as follows; 1. The shear bonding strength of Al plated sample was the strongest of all. 2. The shear bonding strength of Ni plated sample was stronger than that of Degudent H, Sn plated samples. 3. The shear bonding strength of Verabond was weaker than that of Al, Ni, In, Cr, plated samples. 4. After degassing, it is more weight % of Ni at the alloy surface of the Ni sputtered specimen than the Sn sputtered sample.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.22-22
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• 2002

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.107-109
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• 1995

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.145-145
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• 2001

• Proceedings of the Korean Magnestics Society Conference
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• 2005.06a
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• pp.138-139
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• 2005