The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
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Effects of Deposition Conditions on Properties of CuNi thin Films Fabricated by Co-Sputtering of Dual Targets

이중 타겟의 동시 스퍼터링을 이용한 CuNi 박막 제작시 증착변수가 박막의 물성에 미치는 영향

  • 서수형 (한양대 전자재료 및 부품 연구센터) ;
  • 이재엽 (한양대 전자재료 및 부품 연구센터) ;
  • 박창균 (한양대 전기공학과 대학원) ;
  • 박진석 (한양대 전기공학과)
  • Published : 2001.01.01
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Abstract

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

Keywords

References

  1. J.A. Thornton, J.Tabock, and D.W. Hoffman, 'Internal stresses in metallic films deposited by cylindrical magnetron sputtering,' Thin Solid Films, Vol.64, pp.111-119, 1979 https://doi.org/10.1016/0040-6090(79)90550-9
  2. J.A. Thornton and D.W.Hoffman, 'Stress-related effects in thin films,' Thin Solid Films, Vol.17, pp.5-13, 1989 https://doi.org/10.1016/0040-6090(89)90030-8
  3. K.Wasa and S.Hayakawa, Handbook of sputter deposition technology : Principles, Technology and Applications (Noyes Pub., pp.110-111, 1992)
  4. F.O. Adurodija, J.S. Song, S.D. Kim, S.K. Kim, and K.H. Yoon, 'Characterization of $CuInS_2$thin films grown by close-spaced vapor sulfurization of co-sputtered Cu-In alloy precursors,' Jpn. J. Appl. Phys., Vol.37, pp.4248-4253, 1988 https://doi.org/10.1143/JJAP.37.4248
  5. A.Picos-Vega, M.Becerril, O.Zelaya-Angel, R.Ramirez-Bon, F.J.Espinoza-Beltran, J.G.Hernandez, S.J.Sandoval, and B.Chao, 'Cd self-doping of CdTe polycrystalline films by co-sputtering of CdTe-Cd targets,' J. Appl. Phys., Vol.83, No.2, pp.760-763, 1998 https://doi.org/10.1063/1.366640
  6. J.Dudonis, R.Brucas, and A.Miniotas, 'Synthesis of amorphous Zr-Cu alloys by magnetron co-sputtering,' Thin Solid Films, Vol.275, pp.164-167, 1996 https://doi.org/10.1016/0040-6090(95)07033-8
  7. B.D.Cullity, Elements of X-ray diffraction (2nd ed., Addison-Wesley Pub., p.102, 1994)
  8. R.F.Bunsh, Handbook of deposition technologies for film and coating (2nd ed., Noyes Pub., p.706, 1994)
  9. 용윤중, 'RF reactive sputtering법으로 제조한 탄성표면파 소자용 AlN:H 박막과 ZnO/AlN 이층박막의 특성에 관한 연구', 한국과학기술원 박사학위논문, p.15, 1997
  10. K.Wasa and S.Hayakawa, Handbook of sputter deposition technology : Principles, Technology and Applications (Noyes Pub., p.56, 1992)
  11. H.Konishi, T.Suzuki, and M.Utsunomiya, 'Constantan thin film strain gauge load cell,' Technical Digest of the 9th Sensor Symposium, pp.149-152, 1990