• The Journal of Korean Physical Therapy
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• v.9 no.1
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• pp.147-156
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• 1997

The purpose of this study is to determine the difference of reduction in lactic acid of blood in the course of time 1)whoa applying the blood cleaning therapy during recovery after anaerobic exercise, 2)when applying the massage during recovery after anaerobic exercise, and 3)while taking a rest during recovery after anaerobic exercise, respectively. The subject of this study consists of 30 men who are divided into three groups such as group 1(n=10) for the blood cleaning therapy, group 2(n=10) for the massage and group 3(n=10) for rest. The blood-gathering was performed over four times ; during rest, immediately after unaerobic exercise, and at 10 and 15 minutes during recovery. The results were summarized as fellows. 1. There was reduction in lactic acid when applying the blood cleaning therapy during recovery after anaerobic exercise. And remarkable differences were shown from immediately after exercise to at 10 and 15 minutes during recovery(p<0.01 and p<0.001, respectively). 2. There was also reduction in lactic acid when applying the massage during recovery after anaerobic exercise. No difference wan shown from immediately after exercise to at 10 minutes during recovery. However a remarkable difference was shown from immediately after exercise to at 15 minutes during recovery(p<0.05). 3. The rest group which took a rest during recovery after anaerobic exercise did not show any difference from immediately after exercise to at 10 and 15 minutes during recovery.

• Particle and aerosol research
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• v.9 no.3
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• pp.139-147
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• 2013

The performances of indoor air cleaners including particle cleaning capacity and collection efficiency are usually tested at the condition of the maximum air flow rate of the air cleaners. However, the power consumption of the air cleaners is highly dependent on the air flow rate of the individual air cleaners. Therefore, there seems to be an optimized air flow rate for the air cleaning capacity considering power consumption. In this study, clean air delivery rate(or standard useful area as suggested room size) and power consumption have been investigated for different maximum air flow rates of 15 air cleaners and then compared those for different air flow rate modes of the individual 5 air cleaners selected from the 15 cleaners. For the maximum air flow rate conditions of 15 air cleansers, the power consumption per unit area was less related to the maximum air flow rate. However, for the different air flow rate modes of the selected 5 air cleaners, the lower power consumption per unit area was corresponding to the lower air flow rate mode of the individual air cleaners. When considering the operation time to the desired particle concentrations, there was an optimized one in the medium air flow rate modes for the individual air cleaners. Therefore, not only the maximum air flow rate but also lower air flow rates of individual air cleaners should be considered for estimating air cleaning capacity based on energy consumption per unit area.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1450-1452
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• 1996

In order to optimize the characteristics of gate insulator for FED(field emission device), we investigated the effect of wet-etching process on the gate insulator for fabrication of FED. We used the general three types of etchants for fabrication of the metal tip FEA(field emitter array), they are MO and oxide etchants to form the gate hole, and Al etchant to remove the release layer. In the result of the breakdown field of the insulator by the measure of the current-voltage characteristics, the breakdown field of insulator for immersing in oxide etchant was rapidly lowering with increasing etching time, but that for immersing in Al etchant was slow lowering. Also, in comparing cleaning with non-cleaning samples, the breakdown field of the cleaning samples was higher than that of non-cleaning samples.

• Proceedings of the KAIS Fall Conference
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• 2004.11a
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• pp.99-102
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• 2004

Display process has adopted RCA clean, being applied to large area and coped with environmental issue for last ten years. However, the approaching concept of ozonized, hydrogenised, or electrolyzed water cleaning technologies is within RCA clean paradigm. In this work, only electrolyzed anode water was applied to clean particles and organics as well as metals based on Pourbaix concept, and as a test vehicle, MgO particles were introduced to prove the new concept. The electrolyzed anode water is very oxidative with high oxidation reduction potential(ORP) and low in pH of more than 900mV and 3.1, respectively. MgO particles were immerged in the anode water and its weight losses due to dissolution were measured with time. Weight losses were in the ranges of 100 to 500 micrograms in 250m1 anode waters depending on their ORP and pH. Therefore it was concluded that the cleaning radicals in the anode water was at least in the range of 1 to 5E20 ea per 250 ml anode water equivalent to IE18 ea/cm3. Hence it can be assumed that the anode water be applied to display cleaning since 1E10 to IE15 ea/cm3 ranges of contaminants are being treated. In addition, it was observed that anode water does not develop micro-roughness on hydrophobic surface while it does on the native silicon oxide.

• Proceedings of The Korean Society of Agricultural and Forest Meteorology Conference
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• 2013.11a
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• pp.28-29
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• 2013

We have been measuring $CH_4$ flux in a rice paddy in Gimje using the eddy covariance method since July 2011. In order to measure the fast fluctuations of $CH_4$ concentration, an innovative LI-7700 open-path laser spectrometer is used. This high-precision, low power, light weight, low maintenance sensor enables us to operate it on a continuous and long-term basis. One particular feature, among other things, is the self-cleaning lower mirror which decreases maintenance requirements while ensuring more robust, continuous, high-quality dataset. Its cleaning is initiated at user-specified time intervals or a signal strength threshold, and its status is recorded as a diagnostic index. We have noticed that the operation of LI-7700 at Gimje site is quite challenging particularly due to its frequent mirror cleaning requirement and the associated sensitivity of the instrument. In this presentation, we present some field observation data regarding the mirror cleaning and their analysis, thereby suggesting the pertinent operation options for high-quality, maximum data retrieval in the field.

• Industry Promotion Research
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• v.4 no.1
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• pp.21-27
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• 2019

This study is about the bidet which is used to clean the anal and local parts after the user seated on the left side of the toilet in the toilet. The cleaner of the bidet which is contaminated from various bacteria and dirt is washed clean with clean water to keep it clean The present invention relates to a cleaning device for a bidet cleaner that hygienically maintains a bidet used by a plurality of users. As a result of developing and studying a bidet nozzle that can be implemented with a bidet nozzle and a washing nozzle for automatically washing the jetting head of the bidet and the jetting head, the optimum jetting time of the nozzle after the hydraulic jetting is 1 second To 10 seconds, it was confirmed that the nozzle cleanliness of an average of 5 seconds was maintained at 100%. Subsequent studies will require further study of the durability of the product and the cleaning safety at a pressure of $5kg/mm^2$. Toilet bidet is a product that is closely related to the safety and life of the people, but the development of various technologies is still insufficient. Therefore, it is meaningful that this study contributed to the quality of life of the people by continuously researching and developing the bidet.

• Korean Journal of Materials Research
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• v.31 no.1
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• pp.8-15
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• 2021

Transparent, photocatalytic, and self-cleaning TiO2 thin film is developed by TiO2 sol-gel coating on glass and polycarbonate (PC) substrates. Acetyl acetone (AcAc) suppresses the precipitation of TiO2 by forming a yellowish (complex) transparent sol-gel. XPS analysis confirms the presence of Ti2p and O1s in the thin films on glass and PC substrates. The TiO2-sol is prepared by stabilizing titanium (IV) isopropoxide (TTIP) with diethylamine and methyl alcohol. The addition of AcAcsilane coupling solution to the TiO2-sol instantaneously turns to yellowish color owing to the complexing of titanium with AcAc. The AcAc solution substantially improves the photocatalytic property of the TiO2 coating layer in MB solutions. The coated TiO2 film exhibits super hydrophilicity without and with light irradiation. The TiO2 thin film stabilized by adding 8.7 wt% AcAc shows the highest photo-degradation for methylene blue (MB) solution under UV light irradiation. Also, the optimum photocatalytic activity is obtained for the 8.7 wt% AcAc-stabilized TiO2 coating layer calcined at 450 ℃. The thin-films on glass exhibit fast self-cleaning from oleic acid contamination within 45 min of UV-light irradiation. The appropriate curing time at 140 ℃ improves the anti-fogging and thermal stability of the TiO2 film coated on PC substrate. The watermark-free PC substrate is particularly beneficial to combat fogging problems of transparent substrates.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.612-618
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• 2020

In recent years, the demand for external window cleaning has increased, but the process is a very dangerous manpower-dependent operation. In addition, it is difficult to clean at the desired frequency in a business that values cleanliness. Therefore, there is a need to automate this work. This paper presents the concept of a device that can be attached to a specific window and clean the window continuously. The economic feasibility of this device was analyzed. The estimated manufacturing cost of the equipment was approximately 10 million won, but the possible investment cost was at least 9.8 million won for five years of endurance and 103 million won for 10 years of endurance. Therefore, the expected savings well exceed the equipment cost, and it was evaluated as having economic feasibility. Since this study analyzed only quantitative indicators, the expected cost reduction due to a reduction in safety accidents, productivity improvement, construction time reduction, and quality improvement was not considered. Therefore, it is expected that the calculated economic feasibility will be more accurate if the cost reduction effect by the automation equipment is calculated by adding the expected values not considered in this study.