• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1450-1452
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• 1996

In order to optimize the characteristics of gate insulator for FED(field emission device), we investigated the effect of wet-etching process on the gate insulator for fabrication of FED. We used the general three types of etchants for fabrication of the metal tip FEA(field emitter array), they are MO and oxide etchants to form the gate hole, and Al etchant to remove the release layer. In the result of the breakdown field of the insulator by the measure of the current-voltage characteristics, the breakdown field of insulator for immersing in oxide etchant was rapidly lowering with increasing etching time, but that for immersing in Al etchant was slow lowering. Also, in comparing cleaning with non-cleaning samples, the breakdown field of the cleaning samples was higher than that of non-cleaning samples.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2004년도 추계학술대회
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• pp.99-102
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• 2004

Display process has adopted RCA clean, being applied to large area and coped with environmental issue for last ten years. However, the approaching concept of ozonized, hydrogenised, or electrolyzed water cleaning technologies is within RCA clean paradigm. In this work, only electrolyzed anode water was applied to clean particles and organics as well as metals based on Pourbaix concept, and as a test vehicle, MgO particles were introduced to prove the new concept. The electrolyzed anode water is very oxidative with high oxidation reduction potential(ORP) and low in pH of more than 900mV and 3.1, respectively. MgO particles were immerged in the anode water and its weight losses due to dissolution were measured with time. Weight losses were in the ranges of 100 to 500 micrograms in 250m1 anode waters depending on their ORP and pH. Therefore it was concluded that the cleaning radicals in the anode water was at least in the range of 1 to 5E20 ea per 250 ml anode water equivalent to IE18 ea/cm3. Hence it can be assumed that the anode water be applied to display cleaning since 1E10 to IE15 ea/cm3 ranges of contaminants are being treated. In addition, it was observed that anode water does not develop micro-roughness on hydrophobic surface while it does on the native silicon oxide.

• 한국농림기상학회:학술대회논문집
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• 한국농림기상학회 2013년도 추계 학술발표논문집
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• pp.28-29
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• 2013

We have been measuring $CH_4$ flux in a rice paddy in Gimje using the eddy covariance method since July 2011. In order to measure the fast fluctuations of $CH_4$ concentration, an innovative LI-7700 open-path laser spectrometer is used. This high-precision, low power, light weight, low maintenance sensor enables us to operate it on a continuous and long-term basis. One particular feature, among other things, is the self-cleaning lower mirror which decreases maintenance requirements while ensuring more robust, continuous, high-quality dataset. Its cleaning is initiated at user-specified time intervals or a signal strength threshold, and its status is recorded as a diagnostic index. We have noticed that the operation of LI-7700 at Gimje site is quite challenging particularly due to its frequent mirror cleaning requirement and the associated sensitivity of the instrument. In this presentation, we present some field observation data regarding the mirror cleaning and their analysis, thereby suggesting the pertinent operation options for high-quality, maximum data retrieval in the field.

• 산업진흥연구
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• 제4권1호
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• pp.21-27
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• 2019

본 연구는 화장실에서 사용자가 좌변기에 앉아 대소변을 본 후, 항문과 국부를 세정하는 비데(bidet)에 관한 기술로서, 각종 세균과 오물로부터 오염되는 비데의 세정기를 세척수로 깨끗이 세척하여 청결하게 유지할 뿐만 아니라 다수가 사용하는 비데를 위생적으로 유지 관리하는 비데 세정기의 세척장치에 기술에 관한 것이다. 비데의 분사로드와 분사헤드에 세척수를 분사하여 자동으로 세척하는 세척노즐을 포함하여 구현되게 하는 비데 노즐을 개발 하고 연구한 결과, 노즐의 청결도 상태는 수압 분사 후 가장 효율 적인 적정 분사 시간은 1초에서 10초까지 시험 결과 평균 5초의 노즐 청결도가 100% 유지되는 것이 확인 되었다. 후속 개발로서 제품의 내구성과 수압 $5kg/mm^2$ 에서의 세척 안전성 부분의 후속 연구가 필요하다. 화장실 비데는 국민의 안전과 생명에 밀접한 제품이면서도 아직 다양한 기술개발이 미미한 실정이다. 따라서 본 연구를 통해 지속적으로 비데를 연구 개발하여 국민의 삶의 질에 도움을 주었다는데 그 의미가 있다.

• 한국재료학회지
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• 제31권1호
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• pp.8-15
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• 2021

Transparent, photocatalytic, and self-cleaning TiO2 thin film is developed by TiO2 sol-gel coating on glass and polycarbonate (PC) substrates. Acetyl acetone (AcAc) suppresses the precipitation of TiO2 by forming a yellowish (complex) transparent sol-gel. XPS analysis confirms the presence of Ti2p and O1s in the thin films on glass and PC substrates. The TiO2-sol is prepared by stabilizing titanium (IV) isopropoxide (TTIP) with diethylamine and methyl alcohol. The addition of AcAcsilane coupling solution to the TiO2-sol instantaneously turns to yellowish color owing to the complexing of titanium with AcAc. The AcAc solution substantially improves the photocatalytic property of the TiO2 coating layer in MB solutions. The coated TiO2 film exhibits super hydrophilicity without and with light irradiation. The TiO2 thin film stabilized by adding 8.7 wt% AcAc shows the highest photo-degradation for methylene blue (MB) solution under UV light irradiation. Also, the optimum photocatalytic activity is obtained for the 8.7 wt% AcAc-stabilized TiO2 coating layer calcined at 450 ℃. The thin-films on glass exhibit fast self-cleaning from oleic acid contamination within 45 min of UV-light irradiation. The appropriate curing time at 140 ℃ improves the anti-fogging and thermal stability of the TiO2 film coated on PC substrate. The watermark-free PC substrate is particularly beneficial to combat fogging problems of transparent substrates.

• 한국산학기술학회논문지
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• 제21권12호
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• pp.612-618
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• 2020

최근에 외부 유리창 청소에 대한 수요는 증가하고 있으나, 이 청소는 매우 위험한 인력 의존형 작업이다. 또한 청결을 중시하는 업장에서 원하는 빈도로 자주 청소하는 것도 용이하지 않다. 따라서 이 작업을 자동화 할 필요가 있다. 본 연구에서는 특정 유리창에 부착하여, 그 유리창을 지속적으로 청소하는 장치의 개념을 제시하고, 이 장치의 경제적 타당성을 분석하였다. 분석 결과, 장비의 예상 제작비 1천만 원 수준이나, 투자 가능비용은 내구연한 5년 기준으로 최소 9.8백만 원, 내구연한 10년 기준으로 최소 103백만 원 수준이었다. 따라서 장비비 보다 예상 절감액이 충분히 커서, 경제적 타당성이 있는 것으로 평가 되었다. 본 연구에서는 정량적 지표만으로 분석하여, 안전성 향상에 의한 노무자 안전 사고 감소, 생산성 향상, 공기 단축, 품질 향상 등으로 인한 원가 절감 기대 값은 고려되지 않았다는 한계가 있다. 따라서 향후 고려되지 않은 기대 값을 추가하여 자동화 장비에 의한 원가절감 효과를 산출하면 경제성이 보다 정확하게 산정될 것으로 예상된다.

• FOCUS: LIFE SCIENCE
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• 제1호
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• pp.1.1-1.4
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• 2024

This article provides comprehensive guidance on the maintenance, cleaning, regeneration, and storage of silica-based HPLC (High-Performance Liquid Chromatography) columns. The general considerations emphasize the importance of using in-line filters and guard cartridges to protect columns from blockage and irreversible sample adsorption. While these measures help, contamination by strongly adsorbed sample components can still occur over time, leading to an increase in back pressure, loss of efficiency, and other issues. To maximize column lifetime, especially with UHPLC (Ultra-High Performance Liquid Chromatography) columns, it is advisable to use ultra-pure solvents, freshly prepared aqueous mobile phases, and to filter all samples, standards, and mobile phases. Additionally, an in-line filter system and sample clean-up on dirty samples are recommended. However, in cases of irreversible compound adsorption or column voiding, regeneration may not be possible. The document also provides specific recommendations for column cleaning procedures, including the flushing procedures for various types of columns such as reversed phase, unbonded silica, bonded normal phase, anion exchange, cation exchange, and size exclusion columns for proteins. The flushing procedures involve using specific solvents in a series to clean and regenerate the columns. It is emphasized that the flow rate during flushing should not exceed the specified limit for the particular column, and the last solvent used should be compatible with the mobile phase. Furthermore, the article outlines the storage conditions for silica based HPLC columns, highlighting the impact of storage conditions on the column's lifetime. It is recommended to flush all buffers, salts, and ion-pairing reagents from the column before storage. The storage solvent should ideally match the one used in the initial column test chromatogram provided by the manufacturer, and column end plugs should be fitted to prevent solvent evaporation and drying out of the packing bed.

• Journal of Nutrition and Health
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• 제30권6호
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• pp.690-703
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• 1997

The purpose of this study were to analyze work function and labor productivity in school foodservice systems through work sampling methodology. Conventional foodservice were classified into 5 group depending on the number of meals served. Commissary school foodservices were also classified into 5 group by cluster analysis using the number of meals served, the number of satellite schools, and the duration of time for delivery of food. Work measurement through work sampling methodology was conducted in at 5 conventional and 21 commissary food -services during 3 consecutive days from September to October in 1995. Results from work measurement through work sampling methodology were as followed : The most prevalent work functions was cleaning (26.5%) and then processing (25.1%) in conventional while it was processing (30.9%) and then cleaning(25.2%) in commissary school foodservice. Delay was 22.9% and 19.7% respectively. Mean labor minutes per meal of conventional and commissary foodservics were 4.57 and 4.09 minutes, respectively : no significant difference in labor minutes per meal existed between the two systems. but mean labor minutes per meal of commissary foodsevices(1.79min) was significantly lower than that of conventional foodservice(2.33min) during work time before service (p<0.05). Productivity was significantly lower in foodservices which served less than 400 servings ; n significant differences existed among 401-70, 701-1,100 and 1,101-1,500 meals. The highest productivity was in conventional school foodservices which served 1,501-1,900meals. Labor minutes per meal of commissary school foodservice which served less than 400meals per day was significantly lower than those of foodservice which served 401-1,900meals (p<0.05). Labor minutes per meal, preparation and cleaning were positively correlation in two school foodservice systems.

• 방사선산업학회지
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• 제9권2호
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• pp.91-102
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• 2015

The iridium disc, generally used in industrial radiography, is examined to find the fracture morphology and fine particles remaining on the shear blank surface. Randomly selected 1,200 discs were observed under a scanning electron microscope tilted more than $45^{\circ}$. Fracture surfaces are classified into three groups: (1) surface fall-out, (2) fracture on the edge and (3) multi-step brittle fracture, which shows the mutual relationship between the fracture morphology and remaining particles. Fracture particles were removed by cleaning the discs in a ultrasonic bath with acetone and collected at the bottom. Removed number of the particles were counted for each different group of fracture surfaces. Followings are conclusions: (1) About 80.5% of discs (966/1,200), have sound plastic shear surfaces with particles remained. (2) About 2% discs accompany surface fall-out's having large particles tens of ${\mu}m$, which is stable not to be pulled out even after the considerably long time of ultrasonic cleaning. (3) About 5% discs contain the fractures on the edge and the particles are removed thoroughly within 30 minutes. (4) 234 discs out of 1,200 discs have multi-step fracture surfaces whose particles never removed in a short period of time but come out very slowly. Such a disc having multiple-step fracture is attributed to the promate cause to the 'leaker'. It is noted here that the discs having mutiple-step fractures should be treated separately with special care, and it is need to study how to treat them.