• 제목/요약/키워드: Cleaning time

검색결과 619건 처리시간 0.022초

유동층을 이용한 열처리부품의 세정 시스템 설계 및 개발 (I) -유동층 이용 세정 실험장치 설계, 개발 및 실험 - (Design and Development of Fluidized Bed Cleaning System for on Heat Treatment Parts (I) - Design and Development the Experimental Fluidized Bed Cleaner and Experiments on its Cleaning Efficiency -)

  • 김찬수;김기대
    • Journal of Biosystems Engineering
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    • 제31권4호
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    • pp.376-384
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    • 2006
  • This study was conducted to perform for comparative analysis of the cleaning efficiency on 3 kinds of cleaning liquid state, 3 steps of cleaning temperature $(45^{\circ}C,\;60^{\circ}C,\;70^{\circ}C,\;)$ and 6 steps of cleaning time (2.5, 5, 7.5, 10, 12.5, 15 minute). 3 kinds of cleaning liquid state are the non fluidized bed, liquid fluidized bed and liquid/solid fluidized bed. UV spectrophotometer was used in estimation of cleaning efficiency, which it is experimental equipment using the absorptiometric analysis method. Cleaning efficiency by cleaning time was increase from 2.5 minutes to 15 minutes, liquid/siolid fluidized bed was indicated the highest cleaning efficiency among the 3 kinds of cleaning liquid state and $70^{\circ}C$ of cleaning temperature at liquid/solid fluidized bed was indicated the highest cleaning efficiency as 98% among the 3 steps of cleaning temperature.

오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning (Post Sliced Cleaning of Silicon Wafers using Ozone and Ultrasound)

  • 최은석;배소익
    • 한국재료학회지
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    • 제16권2호
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    • pp.75-79
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    • 2006
  • The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.

해수용 역삼투막을 이용한 $1,000,000m^3/day$ 규모의 플랜트에서 오염된 막의 화학세정 효율 평가 (Evaluation on Chemical Cleaning Efficiency of Fouled in $1,000,000m^3/day$ Sea Water Reverse Osmosis Membrane Plant)

  • 박준영;김지훈;정우원;남종우;김영훈;이의종;이용수;전민정;김형수
    • 상하수도학회지
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    • 제25권3호
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    • pp.285-291
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    • 2011
  • Membrane fouling is an unavoidable phenomenon and major obstacle in the economic and efficient operation under sea water reverse osmosis (SWRO). When fouling occurs on the membrane surface, the permeate quantity and quality decrease, the trans-membrane pressure (TMP) and operation costs increase, and the membrane may be damaged. Therefore, chemical cleaning process is important to prevent permeate flow from decreasing in RO membrane filtration process. This study focused on proper chemical cleaning condition for Shuaibah RO plant in Saudi Arabia. Several chemical agents were used for chemical cleaning at different contact time and concentrations of chemicals. Also autopsy analysis was performed using LOI, FT-IR, FEEM, SEM and EDX for assessment of fouling. Specially, FEEM analysis method was thought as analyzing and evaluating tool available for selection of the first applied chemical cleaning dose to predict potential organic fouling. Also, cleaning time should be considered by the condition of RO membrane process since the cleaning time depends on the membrane fouling rate. If the fouling exceeds chemical cleaning guideline, to perfectly remove the fouling, certainly, the chemical cleaning is increased with membrane fouling rate influenced by raw water properties, pre-treatment condition and the point of the chemical cleaning operation time. Also choice of cleaning chemicals applied firstly is important.

해수전해설비의 화학세정 최적화 방안에 관한 연구 (A Study on Chemical Cleaning of Electrolytic Facilities with Sea Water)

  • 이한철;이창우;현성호
    • 한국안전학회지
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    • 제14권4호
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    • pp.114-119
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    • 1999
  • When NaOCl was generated and put into sea-water cooling machine in order to overcome the biological hindrances against sea-water cooling machine, it was converted into metallic ion, particularly Ca and Mg, as a hydrate in sea-water and is to stick to electrolyte as a side reaction. This phenomena make the distance between the electrolytes narrow to decrease the flow rate, which induces the local vortex flow which erodes the pole plate. Moreover, this increases the resistance of the electrolyte as well as voltage to decrease the electrolytic efficiency, which has curtailed a chlorine yield and caused a pole plate cut. We are able to overcome these problems by chemical cleaning and intend to extend the life-time of electrolyte and to increase output of the sea-water electrolysis facilities by studying optimal policy regarding chemical cleaning of electrolytic cell. Cleaning time of electrolytic facilities is determined when both increase in electrolytic efficiency and decrease in pole-plate voltage are 10%. At this time as operating current of electrolytic facilities is high, operating time is diminished. Whereas, parameter of end point determination according to cleaning is Mg ionic concentration in solution. When we use Cleaner as a 7wt% HCl, cleaning time is about 80min proper. We are able to maintain pole plate performance by protecting against pole plate cut by means of electrolytic by-product, improve operating rate of facilities, and cut down on maintenance expenditure after acidic cleaning.

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고속도로 노면 청소에 따른 강우시 유출오염부하 저감 효과 분석 (Effect of Road Sweeping on the Abatement of Runoff Pollution Loads from in the Highway)

  • 강희만;이두진;윤현식
    • 상하수도학회지
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    • 제26권6호
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    • pp.851-860
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    • 2012
  • In this study, to evaluate the abatement of runoff pollution loads by the road sweeping(cleaning), various investigations are implemented at the sample area of the highway. As the results of evaluating the removal efficiency of pollutants along road cleaning, TSS showed about 78 % of the removal efficiency and COD showed 49 % of removal efficiency through the operation of cleaning vehicle of vacuum suction method. In case of TN and TP, they showed the relatively-lower removal efficiency by 30~35 %. TSS removal efficiency along the number of cleaning appeared about 60 % in case of one time of cleaning and the additional removal effect did not appear though the number of cleaning increased to two times. With running speed of cleaning vehicle, TSS removal ratio is lessened from 60 % to 20 % when cleaning vehicle speed up to 20 km/hr from 6 km/hr. It seems that the reasons why the removal efficiencies are inversely proportional to its speed are related to the lower vacuum efficiencies and the disturbed particles on the road. In the pollutant build-up analysis, it is showed that it takes more time to the critical pollutant build-up in the shoulder than the center of the road. It is also showed that the proper cleaning cycle is recommended as 4~6 dry weather days without rainfall events.

가상지도를 이용한 청소로봇 경로계획 (Path Planning for Cleaning Robots Using Virtual Map)

  • 김형일
    • 한국컴퓨터정보학회논문지
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    • 제14권11호
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    • pp.31-40
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    • 2009
  • 가장 많이 활용하는 청소로봇의 청소기법은 크게 랜덤기법과 바둑판식기법으로 나눌 수 있다. 랜덤기법을 이용한 청소로봇은 장애물을 만날 때까지 직진 방향으로 청소를 수행하며, 장애물을 만나면 일정한 각도로 회전한 후 다시 직진 방향으로 청소를 수행한다. 랜덤기법은 중복적인 청소를 수행하는 문제가 빈번히 발생하며, 청소를 완료하는 데 오래 시간이 소요되는 단점이 있다. 바둑판식기법을 이용한 청소로봇은 장애물을 만날 때까지 직진 방향으로 청소를 수행하며, 장애물을 만나면 직진과 회전을 이용하여 청소가 수행되지 않은 위치로 이동하고, 이전에 청소를 수행한 방향의 반대로 청소를 수행한다. 바둑판식기법은 청소공간을 조밀하게 청소하며 진행하기 때문에 장애물이 없거나 작은 공간에서 작업 성능이 뛰어나다. 그러나 바둑판식기법으로 장애물이 있거나 복잡한 공간을 청소할 때는 청소시간이 증가한다. 그러므로 청소의 효율성을 증가시키기 위해서는 작업공간을 정확히 파악하여 청소를 계획적으로 진행해야 한다. 본 논문에서 제안한 가상지도 기반 청소로봇은 작업공간을 효율적으로 청소하는 특성을 갖는다. 시뮬레이션을 통해 제안한 기법의 효율성을 측정하였다.

저잔사 플럭스를 사용한 플로우 솔더링부의 젖음성 및 결함거동에 관한 연구 (A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux)

  • 최명기;이창열;정재필;서창제;신영의
    • Journal of Welding and Joining
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    • 제16권6호
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    • pp.77-85
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    • 1998
  • Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

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복잡한 공간에서 그룹화 기반의 실용적 지능형 청소 로봇 알고리즘 (Practical Intelligent Cleaning Robot Algorithm Based on Grouping in Complex Layout Space)

  • 조재욱;노삼혁;전흥석
    • 제어로봇시스템학회논문지
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    • 제12권5호
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    • pp.489-496
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    • 2006
  • The random-based cleaning algorithm is a simple algorithm widely used in commercial vacuum cleaning robots. This algorithm has two limitations, that is, cleaning takes a long time and there is no guarantee that the cleaning will cover the whole cleaning area. This has lead to customer dissatisfaction. Thus, in recent years, many intelligent cleaning algorithms that takes into consideration information gathered from the cleaning area environment have been proposed. The plowing-based algorithm, which is the most efficient algorithm known to date when there are no obstacles in the cleaning area, has a deficiency that when obstacle prevail, its performance is not guaranteed. In this paper, we propose the Group-k algorithm that is efficient for that situation, that is, when obstacle prevail. The goal is not to complete the cleaning as soon as possible, but to clean the majority of the cleaning area as fast as possible. The motivation behind this is that areas close to obstacles are usually difficult for robots to handle, and hence, many require human assistance anyway In our approach, obstacles are grouped by the complexity of the obstacles, which we refer to as 'complex rank', and then decide the cleaning route based on this complex rank. Results from our simulation-based experiments show that although the cleaning completion time takes longer than the plowing-based algorithm, the Group-k algorithm cleans the majority of the cleaning area faster than the plowing algorithm.

셋 커버 알고리즘을 이용한 효율적인 로봇 청소 알고리즘 (Efficient Robot Cleaning Algorithm based on Set Cover Algorithm)

  • 전흥석
    • 한국컴퓨터정보학회논문지
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    • 제13권3호
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    • pp.85-90
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    • 2008
  • 본 논문에서는 가장 덜 복잡한 공간부터 청소하는 공간 효율적인 새로운 로봇 청소 알고리즘인 SetClean 알고리즘을 제안한다. 청소 완료 시간이 길어지거나, 예측하기 어려운 경우에는 전체 청소 완료시간을 최적화하기보다는 가능한 빠른 시간에 가장 넓은 공간을 최대한 청소하는 것이 유리한 경우가 있다. 이를 위해 SetClean 알고리즘에서는 전체 공간을 셋 커버 알고리즘을 이용하여 청소 가능한 공간으로 구분하고, 단위 시간 당 청소 효율이 가장 높은 공간부터 청소를 진행하게 된다. SetClean 알고리즘은 해당 청소 가능 구역의 면적뿐만 아니라 로봇의 현재위치로부터 해당 청소 구역까지의 이동 거리, 청소 구역 내에서의 로봇의 회전으로 인한 지연 시간 등을 고려하여 최적의 청소 순서를 결정한다. 실험을 통해 SetClean 알고리즘의 동작 과정 및 성능을 보여준다.

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신개념 태양전지 세정용 오존마이크로 버블에 관한 연구 (A Study on Ozone Micro Bubble Effects for Solar Cell Wafer Cleaning)

  • 윤종국;구경완
    • 전기학회논문지
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    • 제61권1호
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    • pp.94-98
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    • 2012
  • The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.