• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.128-131
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• 2007

As the minimum feature size decrease, control of contamination by nanoparticles is getting more attention in semiconductor process. Cleaning technology which removes nanoparticles is essential to increase yield. A reference wafer on which particles with known size and number are deposited is needed to evaluate the cleaning process. We simulated particle trajectories in the chamber by using FLUENT. Charged monodisperse particles are generated using scanning mobility particle sizer (SMPS) and deposited on the wafer by electrostatic force. The experimental results agreed with the simulation results well. We calculate the particles loss in pipe flow theoretically and compare with the experimental results.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.11b
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• pp.300-315
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• 2005

Recently plasma surface-cleaning or surface-etching techniques have been focused in the respect of decontamination of spent or used nuclear parts and equipment. In this study decontamination rate of metallic cobalt surface was experimentally investigated via its surface etching rate with a $CF_4-O_2$ mixed gas plasma and metallic surface wastes of cobalt oxides were simulated and decontaminated with $NF_3$ - Ar mixed gas plasma. Experimental results revealed that a mixed etchant gas with about $80{\%}\;CF_4-20{\%}\;O_2$ gives the highest reaction rate of cobalt disk and the rate reaches with a negative 300 DC bias voltage up to $0.43\;{\mu}m$/min at $380^{\circ}C$ and $20{\%}\;NF_3-80\%$ Ar mixed gas gives $0.2\;{\mu}m$/min of reaction rate of cobalt oxide film.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.157-162
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• 2005

The wafer's size has been increased up to 300mm according as the devices have been integrated sophisticatedly. For this process to make 300mm-wafer, it is required strict level which removes the particulates on the surface of wafer. Therefore we need new type wet-station which can reduce DI water and chemical in the cleaning process. Moreover, it is very important to control the temperature and the concentration of chemical wet-stat ion. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical in cleaning process, but also it is difficult to make fit quantity and temperature. We propose new chemical supply system, which overcomes the problems via analysis of fluid and thermal transfer on chemical supply system,

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.3
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• pp.285-288
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• 2020

The demand for coating technology on electric power equipment that has arisen from such issues regarding the attaching of illegal advertisements and posters to electric power distribution boxes such as TR, SW, etc. in down town areas seeks to produce functional coating surfaces using polymers and nano-materials that will result in improvements in self-cleaning performance and greater stability even under harsh environmental conditions. KEPCO-coatings consist of copolymerized acrylic resin and methacryl-modified reactive silicone that are able to chemically combine, which results in performance improvement without any leakage of of silicone, thus contributing to its properties of high-stability. Thus, the research team has also started long-term on-site testing on 9 electric power distribution spots around a city center in cooperation with the KEPCO Daeduck-yusung branch. The KEPCO-coating technology could advance the best coating materials and processes to meet appropriate circumstances for a variety of outdoor damage environment. It is also predicted that KEPCO could be possible to expand international electric maintenance markets and to arrange business platforms if KEPCO would achieve its original technology (IPs) by the means of upgrading in self-cleaning coating technology and obtaining long-term on-site test records from nationwide electric facilities.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.11
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• pp.971-975
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• 2013

In general, the solar photovoltaic power increases with higher solar insolation. However, the solar cell generation efficiency reduces because the solar cell surface is heated by solar insolation. According to advanced research, with a $1^{\circ}C$ increase in the solar cell surface temperature, the generation efficiency decreases by ~0.5%. To solve this problem, we conducted experiments in which we attempted to reduce the solar cell surface temperature using a water jet spray. In this study, we found the long-term experimental results of increases in solar power generation. The experimental results show a comparison of the site with and without cooling and cleaning equipment being installed. The results of the long-term experiments show that solar photovoltaic power generation is increased by at least 13% up to 19% with cooling and cleaning.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1999.07a
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• pp.91-96
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• 1999

농업구조개선의 일환으로 추진된 시설원예현대화사업으로 1990년의 25,450㏊이던 시설원예면적은 1992년부터 급격히 증가하여 1997년 말 47,264㏊로 늘어났다. 이 가운데 경질 및 유리 온실은 372㏊(0.2%)이고 플라스틱 피복온실이 46,892㏊ (99.8%)로 거의 대부분을 차지하고 있다. (중략)

• Journal of Environmental Health Sciences
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• v.18 no.2
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• pp.1-2
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• 1992

실험기구의 청결도는 실험 및 분석에 있어서 생명과 같이 중용한 것으로 실험실에서 초자기구와 그외 기구, 그리고 장비 등을 사용하는 연구자와 실험요원들이 원하는 바는 이 기구들이 완전히 청결한 상태를 유지하는 것이다. 눈에 보이지 않는 찌꺼기들은 시료분석의 오차를 유발하고, 분리속도를 증가 또는 감소시키며, 미생물 실험에 있어서는 2차 감염이나 배양물 성장저해 그리고 신속성이 낮아지는 결과 등 많은 문제점을 초래하게 된다. 이러한 문제점을 해결하기 위하여 실험기구는 청결히 세척되어야 하며 어떠한 방해물질도 완전히 제거되어야 한다. 이는 바로 적절한 세척제를 선택하고 또한 효과적인 세척방법이 병행되어야 함을 뜻한다. 본 고에서는 세척제의 선택과 세척방법에 대하여 간략히 논해보고자 한다.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.79-81
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• 2001

저압 기상 영역에서 Anhydrous HF 가스와 Methanol vapor를 사용하는 산화막 식각공정을 수행하기 위하여 (1) 반응기 부피의 최소화, (B) 공정압력의 최소화, (3) 고순도 알루미나 Reactor 적용, (4) Cluster화의 개념을 적용한 VPC 장치를 제작하였다. Wafer의 온도, HF의 분압 및 Working Pressure 등의 공정변수에 따른 Oxide Wafer의 식각특성의 변화를 확인하였다. 또한 Etch Uniformity를 향상시키기 위하여 Shower Head 구조를 변경시켜서 실험하였으며, CFD Simulation을 이용하여 Reactor내에서의 HF gas 및 Methanol vapor의 분율을 예측하였다.

• Proceedings of the KSR Conference
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• 2008.11b
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• pp.561-566
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• 2008

The EMU of maintenance technique or system is changing on a large scale. To subway operation beginning the breakdown was born and every that time after the fact repaired. But, recently before the breakdown of the subway occurs, repairs in advance with the preventive maintenance concept which was exchanged. However, the preventive maintenance is to readjust, cleaning, tighten and the oil the repetition by the worker simple experience. This study on introduces the EMU of maintenance method which applies a automatic inspection equipment from the study contributing which develops the preventive maintenance system.