• Title/Summary/Keyword: Cleaning equipment

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The Development Measuring System of Temperature Effect to Produce Electric Power of Solar Cell

  • Sadmai, Ong-art
    • International journal of advanced smart convergence
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    • v.4 no.1
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    • pp.104-113
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    • 2015
  • This paper focuses on a temperature effects on a PV panel which has been installed in Thailand. The main objective is cleaning PV panels and reduce temperature of PV panel by water injects from waterway and experimental results of PV power what it is difference. This project is designed by PLC control system which water injects and control PV temperature, In addition, this project consists of hardware and software such as water pump, water injection and PLC control has been automatically and it can be control system manually. The automatic control system is working when PV temperature rises up over 45 degree Celsius after that the pumping machine would inject water to the surface of PV panels and it must be stop when the PV panel temperature comes down less than 45 degree Celsius. The result of actual experimental found that the control system has been done correctly under specify condition. The experimental has been shown electrical data before and after water injects on PV system found that the electrical power a bit increases and The energy has been taken from PV panel less than energy consumption equipment of control system which taken to operate the water injecting system.

Empirical Modeling of Fouling Rate of Milk Pasteurization Process : A case study

  • Budiati, Titik;Wahyono, Nanang Dwi;Hefni, Muh.
    • International journal of advanced smart convergence
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    • v.4 no.1
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    • pp.11-17
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    • 2015
  • Fouling in heat exchanger becomes a major problem of dairy industry and it increases the production cost. These are lost productivity, additional energy, additional equipment, chemical, manpower, and environmental impact. Fouling also introduces the risk of food safety due to the improper heating temperature which allow the survival of pathogenic bacteria in milk, introducing biofilm formation of pathogenic bacteria in equipments and spreading the pathogenic bacteria to milk. The aim of this study is to determine the fouling rate during pasteurization process in heat exchanger of pasteurized milk produced by Village Cooperative Society (KUD) "X" in Malang, East Java Indonesia by using empirical modeling. The fouling rate is found as $0.3945^{\circ}C/h$ with the heating process time ranged from 0 to 2 hours and temperature difference (hot water inlet temperature and milk outlet temperature) ranged from 0.654 to $1.636^{\circ}C$. The fouling rate depends on type and characteristics of heat exchangers, time and temperature of process, milk type, age of milk, seasonal variations, the presence of microorganism and more. This results will be used to plan Cleaning In Place (CIP) and to design the control system of pasteurization process in order to maintain the milk outlet temperature as standard of pasteurization.

Assessment of Conscious Coginition Degree and Survey on Oxyen Generators using the Indoor Environment (실내환경중의 산소발생기 사용에 대한 인식도 평가)

  • 손종렬;조윤수;이규현;황상용
    • Journal of environmental and Sanitary engineering
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    • v.18 no.4
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    • pp.64-69
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    • 2003
  • Recently, Indoor air quality(IAQ) in workplace, residential environments and office has been concern of people, scientists and related the public. The oxygen in air was very important and essential element in every aspect of life. This study was performed on a questionnaire survey of 400 people about their awareness of indoor air quality, oxygen generators and measured of oxygen concentration in indoor environment. The results obtained were as follows; As respondents are having their 90% of daytime indoors a day, and 80% of them can feel indoor air pollutions degrees directly by particle matters. The control of most important problems of IAQ was the poor ventilation. We know that 22% of the respondents was recognized the oxgen generator. And for the installation of indoor pollution control equipment, 20% of all respondents installed oxygen generators because almost respondents was not satified the trust of ability purified indoor air pollutants. In the experimental results, it was found that the oxygen concentration of sampling sites were in the range of 20~23.5%. Therefore, it was recommended that the government related IAQ was suggested the guideline and control of oxygen generators. Finally, it appeared that the oxygen generators using indoor environment can be applied to new technology for cleaning of indoor air.

ICT Fusion Type Plasma Waste Heat Ventilation System for Improvement of Indoor Air Quality (실내 공기질 개선을 위한 ICT 융복합형 플라즈마 폐열 환기 시스템)

  • Kim, Eung-Kon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.6
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    • pp.1215-1220
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    • 2019
  • Currently, each farm bears both the outbreak of foot-and-mouth disease and the damage caused by AI. In addition, complaints about odors in the livestock industry are constantly being recovered and are expected to occur in the future. The purpose of this study is to improve the indoor air quality of enclosed facilities such as barns, houses, pigsty, and etc. This paper develops low-temperature plasma waste heat ventilation system to be installed in ventilation unit location and standardizes heat exchange element, low-temperature plasma lamp, and ballast for enhanced air cleaning function. In addition, this study intends to develop a new control system so that the farmers can connect with existing weather systems, flow fans, and other facility equipment by incorporating ICT.

The Promotion of Experiential Marine Sports by Developing aPlan for Fishing Village and Port (어촌·어항을 활용한 해양스포츠 체험관광 활성화 방안)

  • JI, Sam-Up;KIM, Yong-Jae;LEE, Jae-Hung
    • Journal of Fisheries and Marine Sciences Education
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    • v.17 no.1
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    • pp.86-105
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    • 2005
  • The plan of developing a fishing village and port will be indirectly funded by the government. In the short term, there will be five different multi-functional fishing village models which are based on the first industry to attach to the third industry of marine sports experience tourism. In the long run, they have to be reached gradually. The popular scenic spot of the marine sports experience tourism is made by human resources and fundamental installations considering that it must be done in unpolluted water. It is necessary to separate the fish harbor into two sides. One side is an existing fishing industry. The other side is made up of several pontoons for the marine sports equipment of the marine mooring. It is necessary to build facilities, such as the mooring facility, the storage facility, the repair-check facility, supply-cleaning facility, information booth, accommodations, education facility, and a marine culture exchange facility.

Fine-Pitch Solder on Pad Process for Microbump Interconnection

  • Bae, Hyun-Cheol;Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung
    • ETRI Journal
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    • v.35 no.6
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    • pp.1152-1155
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    • 2013
  • A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

The Introduction and Satisfaction in Outsourcing for Family Restaurants (패밀리 레스토랑의 아웃소싱 도입 현황과 만족도 분석)

  • Kim, Ki-Young;Cheon, Hee-Sook
    • Culinary science and hospitality research
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    • v.12 no.3 s.30
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    • pp.17-31
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    • 2006
  • There have not been the best method for improving the management system of an enterprise. Its management system must be changed according to new environment. Therefore, the food service industry had to accept outsourcing strategies to reduce cost and construct the core-capability of enterprise. In this respect, we studied the introduction and the satisfaction in outsourcing strategies for family restaurants, including a post of enterprise, decision on the supply-enterprises, contract preparation, cost of outsourcing, recontract items and outsourcing result estimation. The results of this study were as follows; First, 90.5% of managers for 7 family restaurants felt that outsourcing is needed. Second, the post of the outsourcing for 7 family restaurants was from 1 to 8; supply for raw food material, cleaning and equipment repair. The introduction of outsourcing for 7 family restaurants started in 1995 and it had constantly made progress up to 2003. Thirdly, the advantages of the outsourcing for 7 family restaurants were increase of benefit, improvement of controllable-power for family restaurants and improvement of employees' satisfaction. Fourthly, 42.9% of managers were satisfied and 4.8% of them were not satisfied. 36 to 40 year old vice-managers were very satisfied with the result of the outsourcing. Fifth, 90.5% of family restaurant managers found the outsourcing to be needed and especially managers in their late thirties realized the outsourcing.

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Parent Satisfaction with Inpatient Hospital Services in Children's Hospitals (아동전문병원 입원환아 부모의 병원서비스 만족도)

  • Jeong Yong Sun;Kim Jin-Sun
    • Child Health Nursing Research
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    • v.11 no.3
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    • pp.273-281
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    • 2005
  • Purposes: The purposes of this study were to evaluate parent satisfaction with inpatient hospital services in children's hospitals and to identify variables related to parent satisfaction. Method: A descriptive correlation study was conducted. Parents of 165 children who were inpatients in two children's hospitals participated in the study. Data were collected using structured questionnaire at the time of discharge. For statistical analysis, t-test, ANOVA, and Pearson correlation analysis were used. Results: The highest parent satisfaction domain was nursing service, and the lowest parent satisfaction domain was hospital service and accommodations. Parents were less likely to be satisfied with hospital facilities, equipment, noise and cleaning and less likely to be satisfied with the lack of information they received and with the lack of communication with health care professionals. Parents with longer length of stay and with older children reported higher satisfaction than their counterparts. Moreover, parent satisfaction was related to their intention to revisit and related to intention to recommend this surveyed hospital over others. Conclusions: Efforts to improve parent satisfaction in children's hospital service and accommodation are needed to improve the quality of health care. Communication by health care professionals with parents and a partnership between parents and health care professionals are necessary to improve quality of care.

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Evaluation of Grinding Characteristics in Radial Direction of Silicon Wafer (실리콘 웨이퍼의 반경 방향에 따른 연삭 특성 평가)

  • Kim, Sang-Chul;Lee, Sang-Jik;Jeong, Hae-Do;Lee, Seok-Woo;Choi, Heon-Jong
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.980-986
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    • 2003
  • As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

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Profile Simulation in Mono-crystalline Silicon Wafer Grinding (실리콘 웨이퍼 연삭의 형상 시뮬레이션)

  • 김상철;이상직;정해도;최헌종;이석우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.98-101
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    • 2003
  • As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

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