• The Magazine of the IEIE
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• v.29 no.9
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• pp.1020-1020
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.12
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• pp.100-107
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• 1994

This article describes the hardware design scheme of Hamming MAXNET algorithm which is appropriate for binary pattern classification with minimum HD measurement between stimulus vector and storage vector. Circuit integration is profitable to Hamming MAXNET because the structure of hamming network have a few connection nodes over the similar neuro-algorithms. Designed hardware is the two-layered structure composed of hamming network and MAXNET which enable the characteristics of low power consumption and fast operation with biline volgate sensing scheme. Proposed Hamming MAXNET hardware was designed as quantize-level converter for simulation, resulting in the expected binary pattern convergence property.

• The Magazine of the IEIE
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• v.29 no.9
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• pp.18-30
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology and from them forecasts technology trends in the near future.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.38-45
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• 2010

A new readout circuit involving a pixel-level reset control was studied for 2-D long wavelength infrared focal plane arrays. The integration time of each pixel can be optimized individually and automatically. Hence, the readout circuit has a wide dynamic range and good signal-to-noise ratio characteristics. The readout circuit was fabricated with a $0.35{\mu}m$ 2-poly 4-metal CMOS process for a $128{\times}128$ long wavelength infrared HgCdTe array with a pixel size of $50{\mu}m{\times}50{\mu}m$. The smart reset control with two-step background suppression improves the signal-to-noise ratio to 87dB and the dynamic range to 95.8dB.

• Journal of the Korea Computer Industry Society
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• v.3 no.1
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• pp.57-66
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• 2002

In this study, Multi-Values Logic processor was designed using the basic circuit of the electric current mode CMOS. First of all, binary FFT(Fast Fourier Transform) was extended and high-speed Multi-Valued Logic processor was constructed using a multi-valued logic circuit. Compared with the existing two-valued FFT, the FFT operation can reduce the number of transistors significantly and show the simplicity of the circuit. Moreover, for the construction of amount was used inside the FFT circuit with the set of redundant numbers like ［0,1,2,3］. As a result, the defects in lines were reduced and it turned out to be effective in the aspect of normality an regularity when it was used designing VLSI(Very Large Scale Integration). To multiply FFT, the time and size of the operation was used as LUT(Look Up Table) Finally, for the compatibility with the binary system, multiple-valued hybrid-type FFT processor was proposed and designed using binary-four valued encoder, four-binary valued decoder, and the electric current mode CMOS circuit.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.7
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• pp.49-59
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• 2014

Effects of the dielectric constant and thickness of a feed substrate on the bandwidth and radiation characteristics of an aperture coupled microstrip patch antenna (ACMPA) are investigated. The optimized return loss bandwidth of an ACMPA increases without the degradation of radiation characteristics as the feed substrate dielectric constant increases for the same feed substrate thickness. The optimized return loss bandwidth of an ACMPA with the dielectric constant of a feed substrate of 10, which is compatible with the high dielectric constant monolithic microwave integrated circuit (MMIC) materials, increases without the degradation of radiation characteristics as the thickness of a feed substrate decreases. The ACMPA configuration is suitable for integration with MMICs.

• Composites Research
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• v.35 no.3
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• pp.182-187
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• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• The KIPS Transactions:PartB
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• v.15B no.3
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• pp.189-196
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• 2008

In this paper, a CMOS digital image sensor, which consists of A/D conversion, motion estimation circuits, and an attention module for ROI (Region of Interest) detection is presented. The functions of A/D conversion and motion estimation are implemented by $0.6{\mu}m$ CMOS processing circuit as hardware, and the attention module is implemented outside the circuit as software currently. Attention modules are taken to improve limited applications of the smart image sensor. The current smart image sensor responses to the changes of intensity, and uses the integration time to estimate motion. Therefore it is limited in its applications. To make up for inherent property of the sensor from circuit design and extend its applications we decide to introduce perception solutions to the image sensor. Attention modules for still and moving images are employed to achieve such purposes. The suggested approach makes the smart image sensor available with additional functions for such cases that motion estimation or intensity changes are not observed. Experimental result shows the usefulness and extension of the image sensor.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.12-24
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• 2001

The key advantage of LTCC(low temperature co-fired ceramics) technology is the ability to integrate passive components such as resistors, capacitors, and inductors. More compact circuits with an increased scale of integration are needed with the development for advanced telecommunication system such as IMT-2000. LTCC technology can be obtained by removing these elements from the substrate surface to inside of ceramic body. And it can miniaturize the wireless phone through integration of planar patch antenna, duplexer, band pass filter, bias line, circuit of impedance matching and RF choke etc. Futhermore, with the multilayer chip process and its outstanding electrical material characteristics, LTCC is predestined for highly-integrated, cost effective wide band applications. This paper focuses on the general description of LTCC MCM technologies and the fabrication of the multilayer VCO module.

• Pediatric Gastroenterology, Hepatology & Nutrition
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• v.19 no.4
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• pp.221-228
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• 2016

The gastrointestinal exposome represents the integration of all xenobiotic components and host-derived endogenous components affecting the host health, disease progression and ultimately clinical outcomes during the lifespan. The human gut microbiome as a dynamic exposome of commensalism continuously interacts with other exogenous exposome as well as host sentineling components including the immune and neuroendocrine circuit. The composition and diversity of the microbiome are established on the basis of the luminal environment (physical, chemical and biological exposome) and host surveillance at each part of the gastrointestinal lining. Whereas the chemical exposome derived from nutrients and other xenobiotics can influence the dynamics of microbiome community (the stability, diversity, or resilience), the microbiomes reciprocally alter the bioavailability and activities of the chemical exposome in the mucosa. In particular, xenobiotic metabolites by the gut microbial enzymes can be either beneficial or detrimental to the host health although xenobiotics can alter the composition and diversity of the gut microbiome. The integration of the mucosal crosstalk in the exposome determines the fate of microbiome community and host response to the etiologic factors of disease. Therefore, the network between microbiome and other mucosal exposome would provide new insights into the clinical intervention against the mucosal or systemic disorders via regulation of the gut-associated immunological, metabolic, or neuroendocrine system.