• 대한기계학회논문집A
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• 제25권6호
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• 마이크로전자및패키징학회지
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• 제30권4호
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• pp.98-104
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• 2023

대기 중 구리-구리 플립칩(flip-chip) 접합을 위해 제안된 효율적 공정의 실현 가능성을 평가하고자 구리(Cu) 필라(pillar) 상 다공성 구리층의 형성 및 액상 환원제 투입 후 열압착 접합을 실시하였다. 구리 필라 상 다공성 구리층은 아연(Zn) 도금-합금화 열처리-선택적 아연 에칭(etching)의 3단계 공정으로 제조되었는데, 형성된 다공성 구리층의 두께는 평균 약 2.3 ㎛였다. 본 플립칩 접합은 형성 다공성 구리층에 환원성 용제를 침투시킨 후, 반건조 과정을 거쳐 열압착 소결접합으로 진행하였다. 용제로 인한 구리 산화막의 환원 거동과 함께 추가 산화가 최대한 억제되면서 열압착 동안 다공성 구리층은 약 1.1 ㎛의 두께로 치밀해지며 결국 구리-구리 플립칩 접합이 완수되었다. 그 결과 10 MPa의 가압력 하에서 대기 중 300 ℃에서 5분간 접합 시 약 11.2 MPa의 접합부 전단강도를 확보할 수 있었는데, 이는 약 50% 이하의 필라들만이 접합된 결과로서, 공정 최적화를 통해 모든 필라들의 접합을 유도할 경우 20 MPa 이상의 강도값을 쉽게 얻을 수 있을 것으로 분석되었다.

• 한국산림과학회지
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• 제63권1호
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• pp.12-20
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• 1984

본(本) 연구(硏究)는 국산낙엽송재(國産落葉松材)를 이용(利用)한 압체온도(壓締温度)와 시간(時間)에 따른 파티클보오드의 특성(特性)들을 조사(調査)하였다. 결론(結論)을 요약(要約)하면 다음과 같다. 1) 길이와 두께의 비율(比率)이 1:1~35인 비교적(比較的) 불리(不利)한 조건하(條件下)의 chip임에도 불구하고 chip의 표면(表面)이 비교적(比較的) 매끈하게 접착제(接着劑)의 도포(塗布)가 고르게 되고, 공시재(供試材)의 좋은 접착특성(接着特性)이 물리적(物理的) 성질(性質)에 좋은 영향(影響)을 주었다. 2) MOR, MOE, SHA에서 압체시간(壓締時間)이 10분(分)일 때 더욱 좋은 기계적(機械的) 특성(特性)을 보여주고 있다. 3) MOR, IBS, SHA에서 압체시간(壓締時間)이 20분(分)인 경우에 온도(温度)에 따른 그 유의성(有意性)이 인정(認定)되지 않았다. 이는 공시재(供試材)의 노화작용(老化作用)과 수지(樹脂)의 연화작용(軟化作用)이 상호작용(相互作用)하여 일어나는 현상(現狀)으로 보인다. 4) 박리저항(剝離抵抗)에서 압체시간(壓締時間)이 10분(分)일 때 온도(温度)에 따른 내부저항(內部低抗) 값이 증가(增加)되고 있는 것은 중층(中層)에 수지(樹脂)의 적정(適定) 경화온도(硬化温度)가 형성(形成)되는 시간(時間) 때문이다. 5) 흡수(吸水) 팽창(膨脹)에서 압체온도(壓締温度)와 압체시간(壓締時間)에 큰 영향(影響)을 주는데, 이는 열처리(熱處理) 효과(效果)에 따른 공시재(供試材)의 흡수성(吸水性), 이방성(異方性), 불균일성(不均一性) 등(等)이 감소(減)少되어 치수 안전성(安定性)을 유지(維持)시키는데 큰 역할(役割)을 하기 때문이다. 따라서 압체시간(壓締時間)과 압체온도(壓締温度)가 증가(增加)할수록 보다 좋은 치수 안전성(安定性)을 보여 준다.

• Biotechnology and Bioprocess Engineering:BBE
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• 제9권2호
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• pp.132-136
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• 2004

The LAL (Limulus amebocyte lysate) test for the detection and quantification of endotoxin is based on the gelation reaction between endotoxin and LAL from a blood extract of Limulus polyphemus. The test is labor intensive, requiring dedicated personnel, a relatively long reaction time (approximately 1 h), relatively large volumes of samples and reagents and the detection of the end-point is rather subjective. To solve these problems, a miniaturized LOC (lab-on-a-chip) prototype, 62mm (L) ${\times}$ 18 mm (W), was fabricated using PDMS (polydimethylsiloxane) bonded to glass. Using this prototype, in which 2mm (W) ${\times}$ 44.3mm (L) ${\times}$ 100 $\mu\textrm{m}$ (D) microfluidic channel was constructed, turbidometric and chromogenic assay detection methods were compared, and the chromogenic method was found the most suitable for a small volume assay. In this assay, the kinetic-point method was more accurate than the end-point method. The PDMS chip thickness was found to be minimized to around 2 mm to allow sufficient light transmittance, which necessitated the use of a glass slide bonding for chip rigidity. Due to this miniaturization, the test time was reduced from 1 h to less than 10 min, and the sample volume could be reduced from 100 to ca. 4.4 ${\mu}$L. In summation, this study suggested that the LOC using the LAL test principle could be an alternative as a semi-automated and reliable method for the detection of endotoxin.

• 한국염색가공학회지
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• 제21권1호
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• pp.1-9
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• 2009

A lot of research has been made over the recent decade to develop testing packages with antimicrobial properties to improve food safety. In this study, a new method, experimental device and technology for environmental corresponding packages of polypropylene (PP) film has been developed to provide effective temperature buffering during the transport/long-term storage of grains or foodstuffs from the supplier to the market. This quantitatively optimized mixing system enabled to produce PP films with the 700$\sim$1,400d (width;1.5$\sim$3mm, thickness;0.01$\sim$0.5mm). In the whole mixing systems, the finely-granulated inorganic illite and PP virgin chip for master batch (M/B) chip was calculated by digital measurement methods, and then the M/B chip for PP film was adapted through a air jet and PP grinding method. The prepared PP film was characterized with tensile strength and elongation, far infrared radiation (FIR) emissivity, antimicrobial activity and deodorization properties. The results revealed that the two differently grain-sized illite could be show homogeneously dispersed on PP chip surface, and as the increasing of illite content, the FIR emissivity and the anion emission rate of film was increasingly improved. In both of 325 and 1,500 mesh-sized illite contained PP chip, of course the antimicrobial activity was good. But the ultimate deodorization rate for ammonia gas of PP film were found to be approximately the same.

• 한국생산제조학회지
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• 제24권1호
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• pp.117-123
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• 2015

The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.

• 대한기계학회논문집A
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• 제24권7호
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• pp.1681-1688
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• 2000

A dynamic model for the prediction of surface topography in high speed end milling process is developed. In this model the effect of tool runout, tool deflection and spindle vibration were taken in to account. An equivalent diameter of end mill is obtained by finite element method and tool deflection experiment. A modal parameter of machine tool is extracted by using frequency response function. The tool deflection, spindle vibration chip thickness and cutting force were calculated in dynamic cutting condition. The tooth pass is calculated at the current angular position for each point of contact between the tool and the workpiece. The new dynamic model for surface predition are compared with several investigated model. It is shown that new dynamic model is more effective to predict surface topography than other suggested models. In high speed end milling, the tool vibration has more effect on surface topography than the tool deflection.

• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.31-36
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• 2002

PBGA에 비해 상대적으로 큰 칩을 실장하는 고속 SRAM용 153 FC-BGA을 대상으로 2차 솔더접합부의 신뢰성을 평가하였다. 실험은 열사이클 시험에서 발생하는 단면과 양면 실장, 패키지 구조, 언더 필 재료, 기판의 종류와 두께, 솔더 볼의 크기에 따른 영향을 분석하였다. BT기판의 두께가 0.95mm에서 1.20mm로 증가하고, 낮은 영률 의 언더 필 재료에서 솔더접합부의 피로 수명이 30% 향상됨을 확인하였다. 또한 솔더 볼의 크기가 0.76 mm에서 0.89mm로 증가하면, 솔더접합부에서 균열에 대한 저항성은 2배 정도 증가하였다.

• 대한기계학회논문집A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.