• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.141-144
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• 2003

This paper proposes an analytical model of off-line feed rate scheduling to obtain an optimum feed rate for high speed machining. Off-line feed rate scheduling is presented as an advanced technology to regulate cutting forces through change of feed per tooth, which directly affects variation of uncut chip thickness. In this paper, the feed rate scheduling model was developed using a mechanistic cutting force model using cutting-condition-independent coefficients. First, it was verified that cutting force coefficients are not changed with respect to cutting speed. Thus, the feed rate scheduling model using the cutting-condition-independent coefficients can be applied to set the proper feed rates for high speed machining as well as normal machining. Experimental results show that the developed fred rate scheduling model makes it possible to maintain the cutting force at a desired level during high speed machining.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.5
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• pp.49-54
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• 2004

In order to evaluate the stability of chatter vibration in turning precess, the micro-positioning cutting test with artificial tool vibration by piezoelectric actuation were carried out. In experiment, the phase lags between cutting forces and chip thickness variations were measured, and the dimensionless penetration-rate coefficient（$\overline{K^*}$） which is the most important parameter on the stability for chatter vibration was calculated. The results show that$\overline{K^*}$ can be applicable to the stability criterion for regenerative chatter vibration.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.59-64
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• 2008

Micro machining can manufacture complex shapes with high accuracy. Especially, this enables wide application of micro technology in various fields. For example, micro channels allow fluid transfer, which is a widely used technology. Therefore, liquidity research of flow in micro channels and micro channel manufacturing with use of various materials and cutting conditions has very important meaning. In this study, to find out correlation between fluid velocity in micro channels and surface roughness, we manufactured micro channels using micro end-mill and dropped ethanol into micro channels. We compared several surface roughness and fluid velocity in micro channels that were created by various processing conditions. Finally, we found out relationship between fluid velocity and surface roughness in micro channels of different materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.995-1000
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• 2000

In this paper. a mechanistic model is first constructed to predict three-dimensional cutting forces, and the uncut chip th thickness is calculated by following the movements of the position of the center of a cutter, which varies with the nominal feed, cutter deflection and runout. For general implementation to a real machining, this paper presents the method that determines constant cutting force coefficients, irrespective of the cutting conditions or cutter rotation angles. In addition, this study presents the approach which estimates runout-related parameters. the runout offset and its location angle, using only one measurement of cutting forces. For more accurate cutting force predictions, the size effect has to be considered in the cutting force model. In this paper, two approximate methods are suggested since the strict approach is practically impossible due to a measurement problem. The size effect is individually considered for narrow and wide cuts.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.58-65
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• 2000

This study is concerned about the verification and the implementation of a mechanical model for the force system in end milling. The model is based on the relationship between the cutting forces and the chip thickness. The components of the model are based on the average cutting forces which are experimentally obtained. And, both instantaneous and average force system characteristics are described as a function of cut geometry and a feed rate. This model employed two specific cutting forces, instantaneous and average specific cutting force, and the models which obtained using two cutting forces were compared and analyzed. In this study, cutter deflection with respect to the center of rotation is considered, which is a major part of the tool run-outs. The effect of run-out on the cutting forces is also discussed. The relationships among the run-out parameters, cutting parameters and the resulting force system characteristics are presented. In all cases, for the down milling with a right hand helix cutter is considered.

• Journal of Sensor Science and Technology
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• v.21 no.1
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.227-228
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• 2006

In order to calculate the maximum undeformed chip thickness in grinding operation, it is necessary to estimate the successive cutting point spacing. In the past it is obtained by experiments. In this paper, the average successive cutting point spacing has been estimated using the given grinding input conditions.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.71-71
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• 2009

Recently several LCD TV makers including Samsung, LG and Sony actively have released LED LCD TV models on market. LED LCD TV is just which applied LED BLUs so that its color contrast ratio fairly enhance up to 1 million:1 and its thickness minimize to a few mm. Even this aspect seems somewhat to be each panel maker's strategies for prior market occupations on whole TV market. Without regard to the reasons, we do obviously meet a new era of technically advanced LCD TV. However we have still lots of problems or issues which we must overcome technically including LED chip/packaging process, secondary optics treatment, heat managements and cost reduction issues. Here I would like to forecast market volume and trend of LED LCD TV first and then discuss above almost of technical issues and suggest their possible solutions. Even these solutions looks better technologies and if they may increase production cost significantly, we will not prefer to choice that technology since lower cost policy can open the market. Finally I'm trying to suggest how well LED, as future light source, can apply to future LCD TV technologies.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1510-1512
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• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.