• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.3
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• pp.188-198
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• 2010

Recently, as the demand of the environmental-friendly energy storage system such as an electric double-layer condenser increases, that of the bidirectional charger/discharger for the systems also increases. However, when charging/discharging mode-change occurs, the charger/discharger employing a bi-directional DC-DC converter with a commercialized analog controller has a complex circuit scheme, and a poor transient response. On the other hand, if a single digital controller is used for the bi-directional mode, the system performances can be improved by application of an advanced power-processing algorithm. In the paper, an environmental-friendly power storage systems including an Electric Double Layer Capacitor(EDLC) banks were developed with a bi-directional buck-boost converter and a digital signal processor (TMS320F28335). A simulation test-bed was realized and tested by MATLAB Simulink, and the hardware experiment was performed which shows that the dynamic response was improved such as the simulation results.

• Biomedical Science Letters
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• v.22 no.3
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• pp.98-106
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• 2016

Investigation of human papillomavirus (HPV) in archival formalin-fixed paraffin-embedded (FFPE) material is important for understanding cervical carcinogenesis. The objective of the present study was to identify the high risk HPVs (HR-HPVs) using HPV E6/E7 mRNA testing from archival tissues in cervical cancer and the relation to HR-HPVs genotypes in paired cervical exfoliated cells. HPV E6/E7 mRNA testing and DNA chip testing were performed in 79 paired cervical FFPE tissues and exfoliated cells from women with histologically confirmed squamous cell carcinoma and adenocarcinoma. Overall agreement in HR-HPVs detection from FFPE samples and cytology samples were 98.5% in HPV 16, 100% in HPV 18, HPV 31, HPV 33, HPV 58, HPV 66, and HPV 68. Type-specific agreement between FFPE samples and cytology samples was 89.1% in HPV positive, 93.5% in HPV 16 and more than 70% in the other HR-HPVs. In conclusion, HR-HPVs were reliably detected in paired FFPE and cytology samples with some variation in type-specific detection.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.3
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• pp.251-258
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• 2010

This paper presents the technology for the design, fabrication, and characterization of a microfluidic system interface (MSI); the purpose of this technology is to enable the integration of complex microfluidic systems. The MSI technology can be applied in a simple manner for realizing complex arrangements of microfluidic interconnects, integrated microvalves for fluid control, and optical windows for on-chip optical processes. A microfluidic system for the preparation of genetic samples was used as the test vehicle to prove the effectiveness of the MSI technology for packaging complex microfluidic systems with multiple functionalities. The miniaturized genetic sample preparation system comprised several functional compartments, including compartments for cell purification, cell separation, cell lysis, solid-phase DNA extraction, polymerase chain reaction, and capillary electrophoresis. Additionally, the functional operation of the solid-phase extraction and PCR thermocycling compartments was demonstrated by using the MSI.

• Journal of Radiation Protection and Research
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• v.16 no.2
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• pp.1-6
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• 1991

The $HgI_2$ single crystal which can be used for the ${\gamma}-ray$ detector at room temperature was grown by Temperature Oscillation Method. The low temperature photoluminescence, specific resistivity and trap concentration of $HgI_2$ single crystal were investigated. Three main luminescence bands were observed at 2.30eV, 2.20eV and 2.00eV at 20K, related to the excitons, I-vacancies and impurities, respectively. The specific resistivity and trap concentration of $HgI_2$ single crystal were $10^{11}{\Omega}\;cm\;and\;1.8{\times}10^{14}/cm^3$ at room temperature, respectively. Also the radiation detecting system was deviced by $HgI_2$ ${\gamma}-ray$ detector, one chip microprocessor, LCD module and personal computer. The prepared $HgI_2$ ${\gamma}-ray$ detector showed a good linearity of ${\gamma}-radiation$ dose for standard ${\gamma}-ray$.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.12
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• pp.23-30
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• 2009

LEDs are increasingly used for many applications including automotive, aviation, display, transportation and special lighting applications. Generally, the RGB multichip LED luminaire applied to signboard, emotional lighting system and display device and the white LED luminaire applied to general lighting system. white LED spectra for general lighting should be designed for high luminous efficacy as well as good color rendering. This paper describes characteristics of LED luminaire white LED and RGB multichip LED. Two type of LED luminaire prototype used experiment physical, electrical and optic test and performance analyzed. RGB multi-chip and phosphor-type white LED luminaire were analyzed by experiment on their color characteristics and luminous efficacy of radiation, distribution curve, and electrical characteristics. Research work is in progress to develop an improved performance for optic and electrical works well for two type of LED luminaires.

• The KIPS Transactions:PartA
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• v.9A no.1
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• pp.1-8
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• 2002

Most of the traditional embedded web server systems have been designed for monitoring and controlling some dedicated equipments. Hence, not only they have no generality and flexibility but also they are too expensive for the lower-cost domestic equipment. To cope with these difficulty, we suggest a lower-cost ${\mu}$-embedded web server model which is suitable for monitoring and controlling the industry or house equipments by using the internet. The suggested model is based on an one-chip ${\mu}$-processor in which the ISP (In-System Programming) function and flash ROM are embedded basically to minimize the cost of H/W and S/W. Also it allows to add an new function dynamically to provide the generality and flexibility. Finally, to evaluate the feasibility of the suggested model, we have manufactured a test-board based on the ATMega103 ${\mu}$-processor and programmed the control program and tested it on the MS Explorer 5.0 environment.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.361-365
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• 2005

An absolute interferometer system with multiple point-sources is devised for tile 3-D measurement of rough surface profiles. The positions of the point sources are determined to be the system parameters that influence the measurement accuracy, so they are calibrated precisely prior to performing actual measurements. For the calibration, a CCD camera composed of a two-dimensional array of photo-detectors was used. Performing optimization of the cost function constructed with phase values measured at each pixel on the CCD camera, the position coordinates of each point source is precisely determined. Measurement results after calibration performed for the warpage inspection of chip scale packages (CSPs) demonstrate that the maximum discrepancy is 9.8 mm with a standard deviation o( 1.5 mm in comparison with the test results obtained by using a Form Taly Surf instrument.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.