• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.7-15
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• 2008

본 논문에서는 ACF를 이용한 CCM용 COF 어셈블리의 실장 기술을 연구하고 COF 어셈블리의 신뢰성 분석을 수행하였다. 열팽창계수, 모듈러스, 유리전이온도 등 경화 후 ACF의 열-기계적 물성들을 분석하였으며, ACF의 경화거동 결과를 바탕으로 COF 접합공정 온도 및 시간을 최적화하였으며, 도전입자의 변형 관찰 및 전기적 접촉 저항 측정을 통해 본딩 압력에 대한 최적화를 수행하였다. 또한 ACF 물질 특성이 COF어셈블리의 신뢰성에 미치는 영향을 알아보기 위해 열-싸이클 시험, 고온 유지 시험, 고온고습 시험을 수행하였다. 신뢰성 시험 수행 후 ACF를 이용한 COF 어셈블리의 신뢰성에 가장문제가 되고 있는 점은 열-싸이클 신뢰성 시험에서 나타난 ACF joint의 접촉 저항 증가 문제였고, 이는 ACF 자체의 열-기계적 물성과 밀접한 관계가 있음을 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전기물성,응용부문
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• pp.286-289
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• 2003

We investigated the influence of the properties of substrate material on the separation efficiency in microchip electrophoresis. We fabricated the various microchips and studied separation efficiency in microchannels composed of a single material such as quartz, glass, polydimethylsiloxane (PDMS), and polymethylmetha crylate (PMMA), as well as hybrid micro channels composed of different materials. New fabrication process for glass chip was suggested and some treatment is added to improve fabrication process in other chip. Separation efficiency was compared by measuring migration times and bandwidths of EOF and analytes in each microchip. The efficiency is the function of migration time, which is affected by the electroosmotic flow (EOF), and bandwidth of an analyte. EOF is highly dependent upon the characteristics of a microchannel wall surface. Migration time was more reproducible in silica chips than that of PDMS chip and more band broadening was observed in the microchip composed of hybrid material due to non-uniformity of surface charge density at the walls of the channel.

• Current Optics and Photonics
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• 제4권1호
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• pp.44-49
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• 2020

In this paper, a new method is presented to measure the refractive index of single plain glass or multilayered materials, based on a laser frequency-shifted confocal feedback microscope. Combining the laser frequency-shifted feedback technique and the confocal effect, the method can attain high axial-positioning accuracy, stability and sensitivity. Measurements of different samples are given, including N-BK7 glass, Silica plain glass, and a microfluidic chip with four layers. The results for N-BK7 glass and Silica plain glass show that the measurement uncertainty in the refractive index is better than 0.001. Meanwhile, the feasibility of this method for multilayered materials is tested. Compared to conventional methods, this system is more compact and has less difficulty in sample processing, and thus is promising for applications in the area of refractive-index measurement.

• 한국정보통신학회논문지
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• 제9권6호
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• pp.1282-1287
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• 2005

수 마이크로 단위로 계측되는 반도체 COG의 불량 검사에 있어서 칩 얼라인은 검사의 정확성을 높이는데 매우 중요한 역할을 한다. 본 논문에서는 칩 얼라인의 정확성을 높이기 위해서 영역분할 패턴매칭 방법을 제안한다. 영역분할 패턴매칭 방법은 세분화 된 영역 내의 특징치들과 영역들 간의 상관관계를 비교하여 매칭된다. 그리고 불량 패턴으로 인한 매칭오류를 최소화 하기 위해서 패턴 주위의 3영역을 학습시킨다. 제안된 방법은 분할 된 영역에서 특징치를 찾기 때문에 매칭 시간을 단축시키는 효과와 정확성을 높일 수 있는 이점을 가지고 있다.

• Journal of Microbiology and Biotechnology
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• 제16권8호
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• pp.1229-1235
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• 2006

A lab-on-a-chip (LoC) was designed for simultaneous monitoring of microorganisms, antibiotic residues, somatic cells, and pH in raw milk. The LoC was fabricated from polydimethylsiloxane (PDMS) using microelectromechanical system (MEMS) technology, which consisted of two parts; a protein array and microchannel. The protein array was fabricated by immobilizing five types of antibodies corresponding to two microorganisms, two antibiotic residues, and somatic cells. A sol-gel film was deposited on a glass substrate to immobilize the antibodies. The target analytes in raw milk could be bound with the corresponding antibody by an immunoreaction, and the antigen-antibody complex was detected using fluorescence microscopy. SNARF-dextran was used as a pH indicator, and the SNARF-entrapped hydrogel was attached to the microchannel in the chip. After injecting the milk sample into the channel, the pH was measured by monitoring the change in fluorescence intensity by fluorescence microscopy. The on-chip simultaneous assay of two microorganisms (E. coli O157:H7 and Streptococcus agalactiae), two antibiotic residues (penicillin G and dihydrostreptomycin), and neutrophils was successfully accomplished using the proposed LoC system.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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• pp.677-680
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• 2006

Tensile as well as flexural strengths of concrete can be substantially increased by introducing closely spaced fibers that would obstruct the propagation of microcracks, therefore delaying the onset of tension cracks and increasing the tensile strength of the material. Fibers of various shapes and sizes produced from steel, plastic, glass and natural materials are being used. In this study, we used cellulose chip fiber to decrease the shrinkage crack in mortar and concrete. Specially, we have studied the dispersion characteristic of cellulose chip fiber. As a result, it was assumed that the slurry type of cellulose chip fiber is very effective to disperse the fiber in mortar and concrete.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 한국산업안전학회:학술대회논문집
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• 한국안전학회 2000년도 춘계 학술논문발표회 논문집
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• pp.52-57
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• 2000

This paper discusses frequency analysis based on frequency spectrum in orthogonal cutting of fiber-matrix composite materials. A glass reinforced polyester (GFRP) was used as workpiece. Analysis method employs a force sensor and the signals from the sensor are processed using a fast Fourier transform (FFT) technique. The experimental correlation between the different chip formation mechanisms and model coefficients are then established. (omitted)

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권5호
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• pp.286-292
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• 2004

In this study, an integrated microelectrode array was fabricated on glass slide using microfabrication technology. Probe DNAs consisting of mercaptohexyl moiety at their 5-end were spotted on the gold electrode using micropipette or DNA arrayer utilizing the affinity between gold and sulfur. Cyclic voltammetry in 5mM ferricyanide/ferrocyanide solution at 100 ㎷/s confirmed the immobilization of probe DNA on the gold electrodes. When several DNAs were detected electrochemically, there was a difference between target DNA and control DNA in the anodic peak current values. It was derived from specific binding of Hoechst 33258 to the double stranded DNA due to hybridization of target DNA. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic System.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.138-140
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• 2001

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.