Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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A Study on Fluxless Solder Flip Chip Bonding Using Plasma & Ultrasonic Wave

플라즈마와 초음파를 이용한 무플럭스 솔데 플립칩 접합에 관한 연구

  • 홍순민 (서울대학교 재료공학부) ;
  • 강춘식 (서울대학교 재료공학부) ;
  • 정재필 (서울시립대학교 금속재료공학부)
  • Published : 2001.11.01
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Abstract

Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

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