• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.443-446
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• 2003

This paper implement Remote Meter Reading System which is used Bluetooth and SMS in CDMA. This System propose system which tan detect a total amount of gas, electricity or water without a meterman, at home BlueTooth is a close range wireless communication technology which uses a wireless frequency 2.4GHz and has a high trust and self error correction technology according to a low power consumption quality and a high-speed frequency hopping. This makes get a high trust concerning a data transmission than an existing modem. In addition, though wireless modem is restricted by a minimal of a wireless terminal, it will be possible to coincide with the function of the portable with the low power consumption quality by using Bluetooth. And as the system on a chip of module progresses, the possibility of the small size is present. Nowadays, SMS Protocol in CDMA for have a network function based on PPP in CDMA Phone. The proposed Remote Meter Reading System to get more nobility, efficiency, and have good function. SMS Protocol in CDMA have profits which is low power, low cost, and low microwave output.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.125-130
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• 2002

An attempt was made for the application of porous reticular metal to a heat dissipation material in semiconductor process. For this aim, the electrodeposition of Fe/Ni alloy on the porous reticular Cu has been performed to minimize the thermal expansion mismatch between Cu skeleton and electronic chip. Preliminary tests for the electrodeposition of Fe/Ni alloy layer were conducted by using standard Hull Cell to examine the effect of current density on the composition of alloy layer. It seemed that mass transfer affected significantly the composition of Fe/Ni layer due to anomalous codeposition in the electrodeposition of Fe/Ni alloy. A paddle type stirring bath, which was employed to control the mass transfer of electrolyte in the work, was found to allow the electrodeposition Fe/Ni with a precise composition. result showed that the thermal expansion of Fe/Ni alloy layer was much lower than that of pure copper. From the tests of heat dissipation by using the apparatus designed in the work the heat dissipation material fabricated in the work showed the excellent heat dissipation capacity, namely, more than two times as compared to that of pure copper plate.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Journal of rehabilitation welfare engineering & assistive technology
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• v.10 no.3
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• pp.237-242
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• 2016

The major advantage of slip-ring technology in Spiral CT is that it facilitates continuous rotation of the x-ray tube, so that volume data can be acquired from a patient quickly. Not only for such a fast scan, but also for the dose reduction purpose, high signal-to-noise ratio and fast data acquisition system is required. In this study, we have built a multi-channel photodetector and multi-channel data acquisition system for CT application. The detector module consisted of CdWO4 crystal and Si photodiode in 16 channels. For the performance test of the preamplifier stage, both the transimpedance and switched integrator types are optimized for the photodetector modules. Switched integrator showed better noise performance in the limited bandwidth which is suitable for the current CT application. The control sequence for data acquisition and 20 bit ADC is designed with VHDL(Very High Speed Integrated Circuit Hardware Description Language) and implemented on FPGA(Field Programmable Gate Array) chip. Our Si photodiode detector module coupled to CdWO4 crystal showed comparable signal with other commercially available photodiode for CT. Switched integrator type showed higher SNR but narrower bandwidth compared to transimpedance preamplifier. Digital hardware is designed by FPGA, so that the control signal could be redesigned without hardware alteration.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of Animal Science and Technology
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• v.52 no.5
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• pp.357-366
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• 2010

The emergence of next-generation sequencing technologies has lead to application of new computational and statistical methodologies that allow incorporating genetic information from entire genomes of many individuals composing the population. For example, using single-nucleotide polymorphisms (SNP) obtained from whole genome amplification platforms such as the Ilummina BovineSNP50 chip, many researchers are actively engaged in the genetic evaluation of cattle livestock using whole genome relationship analyses. In this study, we estimated the genomic relationship matrix (GRM) and compared it with one computed using a pedigree relationship matrix (PRM) using a population of Hanwoo. This project is a preliminary study that will eventually include future work on genomic selection and prediction. Data used in this study were obtained from 187 blood samples consisting of the progeny of 20 young bulls collected after parentage testing from the Hanwoo improvement center, National Agriculture Cooperative Federation as well as 103 blood samples from the progeny of 12 proven bulls collected from farms around the Kyong-buk area in South Korea. The data set was divided into two cases for analysis. In the first case missing genotypes were included. In the second case missing genotypes were excluded. The effect of missing genotypes on the accuracy of genomic relationship estimation was investigated. Estimation of relationships using genomic information was also carried out chromosome by chromosome for whole genomic SNP markers based on the regression method using allele frequencies across loci. The average correlation coefficient and standard deviation between relationships using pedigree information and chromosomal genomic information using data which was verified using a parentage test andeliminated missing genotypes was $0.81{\pm}0.04$ and their correlation coefficient when using whole genomic information was 0.98, which was higher. Variation in relationships between non-inbred half sibs was $0.22{\pm}0.17$ on chromosomal and $0.22{\pm}0.04$ on whole genomic SNP markers. The variations were larger and unusual values were observed when non-parentage test data were included. So, relationship matrix by genomic information can be useful for genetic evaluation of animal breeding.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.742-750
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• 2018

In this paper, in order to enable zero-layer FTP cell using only 5V MOS devices on the basis of $0.13{\mu}m$ BCD process, the tunnel oxide thickness is used as the gate oxide thickness of $125{\AA}$ of the 5V MOS device at 82A. The HDNW layer, which is the default in the BCD process, is used. Thus, the proposed zero layer FTP cell does not require the addition of tunnel oxide and DNW mask. Also, from the viewpoint of memory IP design, a single memory structure which is used only for trimming analog circuit of PMIC chip is used instead of the dual memory structure dividing into designer memory area and user memory area. The start-up circuit of the BGR (Bandgap Reference Voltage) generator circuit is designed to operate in the voltage range of 1.8V to 5.5V. On the other hand, when the 64-bit FTP memory IP is powered on, the internal read signal is designed to maintain the initial read data at 00H. The layout size of the 64-bit FTP IP designed using the $0.13-{\mu}m$ Magnachip process .is $485.21{\mu}m{\times}440.665{\mu}m$($=0.214mm^2$).

• Journal of the Korean Wood Science and Technology
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• v.36 no.1
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• pp.79-87
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• 2008

Many researchers have studied on rooftop greening that can be installed in abandoned spaces on a building roof. The most important issue in rooftop greening is the soil weight problem. The light greening materials are needed to solve this problem. Therefore, many alternative materials against the soil were investigated for rooftop greening. In this study, the waste wood chips and the waste paper slurry were evaluated as the lightweight vegetation foundation for rooftop greening. It also has a meaning for recycling of waste materials. The mixture ratio of waste wood chips to waste paper slurry for the board (the foundation of greening) was 60 to 40. The wet strength resin and the sizing agent were additionally added with different amount. After the forming of the board, physical and chemical properties were tested with the variation of wet strength resin and sizing agent. As the result of the test, the board with 15% of wet strength resin in the wet condition showed the highest strength. Futhermore, the moisture evaporation loss from the board surface with sizing agent was much lower than that from the board without sizing agent. Therefore, it was clear that the sizing agent was effective for water retention. The change of thickness in the wet condition was less than 1 mm, and it showed that the board is the predominant material on the dimensional stability. The average pH value of the board was ranged from 7.6 to 8.25.

• Journal of the Korea Organic Resources Recycling Association
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• v.8 no.3
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• pp.81-88
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• 2000

Composting of N-rich wastes such as food waste and wastewater sludges can be associated loss of with substantial gaseous N, which means loss of an essential plant nutrient but may also lead to environmental pollution. We investigated the behavior of nitrogenous materials during the first high-rate phase in composting of food waste. Air dried food waste was mixed with shredded waste paper or wood chip and reacted in a bench scale composting reactor. Samples were analyzed for pH, ammonia, oxidized nitrogen and organic nitrogen. The volatilized ammonia nitrogen was also analyzed using sulfuric acid as an absorbent solution. Initial progress of composting reaction greatly influenced the ammonification of organic nitrogen. A well-balanced composting reaction with an addition of active compost as an inoculum resulted in the promoted mineralization of organic nitrogen and volatilization of ammonia. The prolongation of initial low pH period delayed the production of ammonia. It was also found that nitrogen loss was highly dependent on the air flow supplied. With an increase in input air flow, the loss of nitrogen as an ammonia also increased, resulted in substantial reduction of ammonia content in compost. The conversion ratio of initial nitrogen into ammonia was in the range of 28 to 38% and about 77~94% of the ammonia produced was escaped as a gas. Material balance on the nitrogenous materials was demonstrated to provide an information of importance on the behavior of nitrogen in composting reaction.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.8
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• pp.54-61
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• 2001

A fully on-chip open-drain CMOS output driver was designed for high bandwidth DRAMs, such that its output voltage swing was insensitive to the variations of temperature and supply voltage. An auto refresh signal was used to update the contents of the current control register, which determined the transistors to be turned-on among the six binary-weighted transistors of an output driver. Because the auto refresh signal is available in DRAM chips, the output driver of this work does not require any external signals to update the current control register. During the time interval while the update is in progress, a negative feedback loop is formed to maintain the low level output voltage ($V_OL$) to be equal to the reference voltage ($V_{OL.ref}$) which is generated by a low-voltage bandgap reference circuit. Test results showed the successful operation at the data rate up to 1Gb/s. The worst-case variations of $V_{OL.ref}$ and $V_OL$ of the proposed output driver were measured to be 2.5% and 7.5% respectively within a temperature range of $20^{\circ}C$ to $90^{\circ}C$ and a supply voltage range of 2.25V to 2.75V, while the worst-case variation of $V_OL$ of the conventional output driver was measured to be 24% at the same temperature and supply voltage ranges.