• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.77-82
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• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Electronics and Telecommunications Trends
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• v.24 no.6
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• pp.86-93
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• 2009

프로세서는 더 이상 동작 주파수를 높이는 방법이 아닌 다수의 프로세서를 집적하는 멀티프로세서로 기술 발전이 이루어지고 있다. 최근 2, 4, 8개의 프로세서 코어를 넘어 64, 128개 이상의 프로세서를 집적한 대규모 데이터 처리 및 과학 연산용 고성능 프로세서들이 개발되고 있다. 본 문서는 이러한 병렬 프로세싱의 개념 및 병렬 프로세서의 기술을 정리하고 최근 동향과 함께 당면한 문제점들을 기술한다.

• Journal of Korean Society on Water Environment
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• v.23 no.1
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• pp.33-37
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• 2007

Microelectrodes for measuring nitrogenous compounds (${NH_4}^+$, ${NO_3}^-$) that were applied into the microfluidics chips was investigated, and the effect of temperature was especially examined. In this specific research, microelectrodes were first calibrated to check the function, and then microsensor that was combined microelectrode with microfluidic chip was re-calibrated. Experimental results showed that there are no change in the function between microelectrode and microfluidic chip. The electro motive force (EMF) for the ${NH_4}^+$ microsensor was similar to the one theoretically calculated from Nernst equation, but the EMF for ${NO_3}^-$ showed minor change.

• ETRI Journal
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• v.30 no.6
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• pp.783-789
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• 2008

A bio-inspired vision chip for edge detection was fabricated using 0.35 ${\mu}m$ double-poly four-metal complementary metal-oxide-semiconductor technology. It mimics the edge detection mechanism of a biological retina. This type of vision chip offer several advantages including compact size, high speed, and dense system integration. Low resolution and relatively high power consumption are common limitations of these chips because of their complex circuit structure. We have tried to overcome these problems by rearranging and simplifying their circuits. A vision chip of $160{\times}120$ pixels has been fabricated in $5{\times}5\;mm^2$ silicon die. It shows less than 10 mW of power consumption.

• Journal of Sensor Science and Technology
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• v.18 no.1
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• pp.42-47
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• 2009

In this paper we propose a microfluidic chip that measures the mechanical stiffness of cell membrane using impedance measurement. The microfluidic chip is composed of PDMS channel and a glass substrate with electrode. The proposed device uses patch-clamp technique to capture and deform a target cell and measures impedance of deformed cells. We demonstrated that the impedance increased after the membrane stretched and blocked the channel.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.463-467
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• 2004

This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated b micro-heater under pulse heating. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, he middle plate, the upper plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The middle plate includes the chamber and diaphragm d the upper plate is the micro-heater. The Micropump is fabricated by bonding process of the three layer. This paper resented the possibility of the PCR chip operation by the fabricated micropump.

• Journal of Sensor Science and Technology
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• v.18 no.2
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• pp.160-167
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• 2009

In this study, secondary antibody-containing quartz crystal microbalance(QCM) sensor chip was prepared and utilized for the detection of human and bovine haptoglobin. Anti-goat immunoglobulin G antibody, which is a secondary antibody capable of capturing primary antibodies raised in goat, was immobilized through the reaction between hydrazide and aldehyde group prepared on the QCM surface and antibody respectively. The resulting sensor chip showed higher stability in the repeated surface regeneration with acidic dissociation solution as well as requiring lower amount of primary antibody when compared to the protein G sensor chip. The secondary antibody sensor chip was applied for the estimation of bovine and human haptoglobin.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.279-284
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• 2000

The object of this paper is to evaluate the chip breakability using the experimental equation of surface roughness, which is developed in turning by an orthogonal array method. L$\sub$9/(3$^4$) orthogonal array method, one of fractional factorial design has been used to study effects of main cutting parameters such as cutting speed, feed rate and depth of cut, on the surface roughness. The evaluation of chip breakability is used the chip breaking index(C$\sub$B/), non-dimensional parameter. And the analysis of variance (ANOYA)-test has been used to check the significance of cutting parameters. Using the result of ANOYA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed. The coefficient of determination of this equation is 0.866.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.302-307
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• 2002

In end milling process, the undeformed chip section area and cutting forces vary periodically with phase change of the tool. However, the real undeformed chip section area deviates from the geometrically ideal one owing to cutter runout and tool shape error. In this study, a method of estimating the real undeformed chip section area which reflects cutter runout and tool shape error was presented during up-end milling of Inconel 718 using measured cutting forces. The specific cutting resistance, K. and $K_t$ are defined as the radial and tangential cutting forces divided by the modified chip section area. Both of $K_r$, and $K_t$ values become smaller as the helix angle increases from $30^\circ$ to $40^\circ$ Whereas they become larder as the helix angle increases from $40^\circ$ to $50^\circ$. On the other hand, the $K_r$, and $K_t$ values show a tendency to decrease with increase of the modified chip section area and this tendency becomes distinct with smaller helix angle.