• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.9
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• pp.4138-4146
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• 2011

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.53-59
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• 2013

Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

• Journal of Mechanical Science and Technology
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• v.16 no.12
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• pp.1664-1672
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• 2002

Gantry mechanisms have been widely used for precision manufacturing and material handling in electronics, nuclear, and automotive industries. Dual-drive servo mechanism is a way to increase control bandwidth, in which two primary axes aligned in parallel are synchronously driven by identical servo motors. With this mechanism, a flexible coupling (compliance mechanism) is often introduced in order to avoid the damage by the servo mismatch between the primary drives located at each side of gantry. This paper describes the design guidelines of the dual-drive servo mechanism with focus on its dynamic characteristics and control ramifications. That is, the effect on the system bandwidth which is critical on the system performance, the errors and torques exerted on guide ways in case of servo mismatch, the vibration characteristics concerned with dynamic error and settling time, and the driving force required at each axis for control are thoroughly investigated.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.9
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• pp.930-935
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• 2009

This paper describes a miniaturezed metamaterial BT chip antenna for mobile devices. The size of the proposed antenna is $3.0\;mm(W){\times}2.0\;mm(L){\times}1.2\;mm(H)$. And it is fabricated by chip type. The zeroth-order resonant properties are analyzed by magnitude and phase distributions of the surface current using surface current scanning system. The antenna offers omni-directional radiation patterns and measured 3D average gain is over - 1.7 dBi.

• Proceedings of the KOSOMBE Conference
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• v.1995 no.05
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• pp.164-166
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• 1995

The objectives of study are to develop a peripheral device on the endoscopic surgery system. These systems are consist of the following units. They are a color monitor of high resolution, light source, computer system and endoscopic camera with a C-mount head, irrigator, color video printer, Super VHS recorder and a system rack. The color monitor is a NTSC monitor for monitoring the image projected of the surgical section. The lightsource is necessary to irradiate the interior of a body via an optic fiber, The light projector will adapt the brightness in accordance with changing distance from the object. A miniature camera using a color CCD chip and computer system is used to capture and control an image of the surgical section[1]. The video printer is a 300 DPI resolution using thermal sublimation methods, which is developed by Samsung Electronics Co., Ltd. The specification of the endoscopic data management system is consist of storage of a captured image and pathological database of patients [2-4].

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.