• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.64-72
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• 1998

This paper a new approach to the design of machine vision technique with a camera modeling that accounts for major sources of geometric distortion, namely, radial, decentering, and thin prism distortion. Radial distortion causes an inward or outward displacement of a given image point from its ideal location. Actual optical systems are subject to various degrees of decentering , that is , the optical centers of lens design and manufacturing as well as camera assembly. It is our propose to develop the vision system for the pattern recognition and the automatic test of parts and to apply the line of manufacturing. The performance of proposed vision system is illustrated by simulation and experiment.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Journal of Advanced Marine Engineering and Technology
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• v.17 no.5
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• pp.86-98
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• 1993

The application of A.C. motor for servo system is rapidly increased according to the recent advance of power electronics and digital control techniques. The induction motor which has a simple structure and needs less maintenance has become to be used widely in the industrial field for the speed and position control recently. In this paper, the full-bridge resonant inverter is applied to the speed control of single phase inducting motor. The digital PID control algorithm is used and the control parameter is determined by the Zigler-Nichols transient response method. The speed control is carried out by the one chip micro-processor(intel EV 8097BH) and control program is developed by the assembly language. By the experimental result, it is confirmed that the speed of single phase induction motor driven by full bridge series inverter can be smoothly controlled by a digital PID controller.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.209.2-209.2
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• 2014

In recent years, researches about hydrophobic and hydrophilic surfaces have been executed however their other effects have not been researched enough. In this paper, the fabrication method of hierarchical structures of micro line array combined with fluorinated wax for anisotropic superomniphobic wettability is presented. We have achieved anisotropic and superomniphobic surface via simple two step methods, which are maskless photolithography and wax deposition. In order to prove how to provide those characteristics, SEM, contact angle measurement tool and X-ray diffraction are used. Fluorinated wax is crystalized self-assembly and it is subordinated on micro line array so that it is able to display anisotropic wettability. Understanding on anisotropic superomniphobic surface and simple fabrication method has been attracted to apply for lots of applications which range from self-cleaning surface, microfluidic chip, to directionally fluid control device, even in oily fluid.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.150-152
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• 2007

It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.1
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• pp.11-15
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• 2006

We propose an optical and an electrical detection methods for detecting various bio-molecules effectively with microcantilevers. The microcantilevers were fabricated employing surface micromachining technique that has attractive advantages in terms of cost efficiency, simplicity and ability of fabricating in array. The fluid cell system for injection of bio-molecular solution is fabricated using polydimethylsiloxane (PDMS) and a fused silica glass. The microcantilever is deflected with respect to the difference of the surface stress caused by the formation of self-assembled bio-molecules on the gold coated side of the microcantilever. It detected cystamine dihydrochloride and glutaraldehyde molecules and analyzed individual concentrations of the cystamine dihydrochloride solution. We confirm that the deflections of bending-up or bending-down are occurred by the bio-molecule adsorption and microcantilever can be widely used to a ${\mu}-TAS$ and a lab-on-a-chip for a potential detection of various bio-molecules.

• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.46-55
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• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.8
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.1
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• pp.58-63
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• 2016

Objectives: One major limitation encountered in retrospective exposure assessment for epidemiological study is the lack of exposure records and information maintained by companies which if they existed would allow the estimation of past exposure to hazardous operations and agents. This study developed a job-specific questionnaire(JSQ) to estimate exposure profiles among semiconductor workers, including operation and job. Methods: This JSQ can be directly applied to workers who work or have worked in a wafer fabrication or a chip packaging and assembly facility. Results and Conclusions: We used this JSQ to obtain past exposure information from semiconductor workers via face-to-face investigation. Major contents include questions on the facilities, operations and jobs to which they have been exposed since they entered employment in the semiconductor industry. The total number of questions in the JSQ is 18. Responses to this JSQ can be used not only to estimate retrospective exposure to operations and jobs in the semiconductor industry, but also to associate with the risk of all causes of death and risk of disease, including cancer.