• 제목/요약/키워드: Chip Thickness

검색결과 274건 처리시간 0.03초

볼엔드밀 가공의 칩두께 모델 해석 (Analysis of Chip Thickness Model in Ball-end Milling)

  • 심기중;문상돈
    • 한국공작기계학회논문집
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    • 제15권2호
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    • pp.73-80
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    • 2006
  • This paper describes a analysis on the chip thickness model required for cutting force simulation in ball-end milling. In milling, cutting forces are obtained by multiplying chip area to specific cutting forces in each cutting instance. Specific cutting forces are one of the important factors for cutting force predication and have unique value according to workpiece materials. Chip area in two dimensional cutting is simply calculated using depth of cut and feed, but not simply obtained in three dimensional cutting such as milling due to complex cutting mechanics. In ball-end milling, machining is almost performed in the ball part of the cutter and tool radius is varied along contact point of the cutter and workpiece. In result, the cutting speed and the effective helix angle are changed according to length from the tool tip. In this study, for chip thickness model analysis, tool and chip geometry are analyzed and then the definition of chip thickness and estimation method are described. The resulted of analysis are verified by compared with geometrical simulation and other research. The proposed chip thickness model is more precise.

2날 엔드밀 슬롯 가공시 칩두께 모델의 개선 (Improvement of Chip Thickness Model in 2-flutes Slot End Milling)

  • 이동규;이기용;이근우;오원진;김정석
    • 한국정밀공학회지
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    • 제22권1호
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    • pp.32-38
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    • 2005
  • Generally, cutting force models use a sin function method to calculate chip thickness. In slot end milling, the error from a sin function method is much bigger than other machining because a tool rotation angle in cutting is much larger. Thus in this paper, a new method to calculate chip thickness was suggested and evaluated. In a new method, tool position data according to tool rotation are checked and stored so that it is possible correct chip thickness is calculated. Cutting force waveforms simulated from a sin function method and a new method and measured waveforms from experiments were compared and error percentages were obtained. Finally, a new method had good results for simulating cutting force in slot end milling.

무연솔더 적용한 0402 칩의 공정제어 (Processing Control of 0402 Chip used Pb-free Solder in SMT process)

  • 방정환;이창우;이종현;김정한;남원우
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.218-221
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    • 2007
  • The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

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플립칩의 매개변수 변화에 따른 보드레벨의 동적신뢰성평가 (Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips)

  • 김성걸;임은모
    • 한국생산제조학회지
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    • 제20권5호
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    • pp.559-563
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    • 2011
  • Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

칩브레이커의 형상과 절삭조건이 칩 절단과 표면거칠기에 미치는 영향 (Effect of Chip Breaker Shape and Cutting Condition on the Chip Breaking and Surface Roughness)

  • 나기철;태순호;이병곤
    • 한국안전학회지
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    • 제9권4호
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    • pp.17-28
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    • 1994
  • Chip breaking is important in lathe work for maintaining good surface of the products and safety of operator. The purpose of this study is to investigate the performance of chip breaking and chip shape resulted from the carbide inserts with grooved type and obstruction type chip breaker. Experiments have been performed under the following cutting conditions, (1) constant cutting speed with variable depth of cut and feed rate, (2) constant depth of cut with variable cutting speed and feed rate. Also, the flying distance of chip and it's distribution have been investigated. As a results, good performance of chip breaking can be obtained for small radius of curvature and land width of grooved type chip breaker. And the thickness of chip increase with the increase of feed rate and decrease of cutting speed, and the chip breaking becomes easier with the increase of chip thickness due to the large deformation rate. Obstraction type chip breaker shows better performance of surface roughness than the grooved type. The flying distance of the chips over 90% are less than 1 meter, and the distance decreases as the feed rate decreases.

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경화 열처리강의 정밀연삭가공 (Precision Grinding Characteristics of Hardened Steel)

  • 최원식;배대원
    • 열처리공학회지
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    • 제18권6호
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    • pp.355-361
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    • 2005
  • In this study, the effects of the maximum undeformed chip thickness on grinding characteristics of hardened steel in down-grinding have been investigated. The meaured grinding forces become larger as the workpiece velocity increases. The specific energy, e decreases as the maximum undeformed chip thickness increase. When the maximum undeformed chip thickness is the same, the specific energy, e decreases as the grain size increases.

평균입자 연삭모델에 의한 최대미변형칩두께의 예측 (Estimation of the Maximum Undeformed Chip Thickness Using the Average Grain Model)

  • 이영문;최원식;손재환;배대원;손성필;황근식
    • 한국공작기계학회논문집
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    • 제16권2호
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    • pp.30-36
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    • 2007
  • In order to estimate the maximum undeformed chip thickness in grinding operation, it is necessary to obtain the successive cutting point spacing. In the past it was obtained by experiments. In this paper, the average successive cutting point spacing has been obtained using the given grinding input conditions and it is possible to estimate the maximum undeformed chip thickness without using any experimentally obtained data. The validity of the proposed analysis has been verified based on two sets of grinding scratch tests using WA and CBN grinding wheels.

선삭가공의 칩형상 해석 (I) -칩흐름각 해석- (Analysis of the Chip Shape in Turing (I) -Analysis of the Chip Flow Angle-)

  • 이영문;최수준;우덕진
    • 대한기계학회논문집
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    • 제15권1호
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    • pp.139-144
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    • 1991
  • 본 연구에서는 절삭가공시 생성되는 칩의 형상해석의 일환으로 2차원 절삭시 칩은 절삭날에 수직한 방향으로 공구경사면을 흘러간다는 기본적인 전제조건과 Kluft 등의 칩흐름각 예측에 대한 제안중 노으즈반경(nose radius) 및 기울임각의 영향을 중 첩시키고, 또한 절삭날에 연하여 미변형 칩두께(undeformed chip thickness)가 달라지 는 경우 칩흐름의 세기는 이에 비례한다는 Baart등의 가정을 도입하여 칩흐름각에 대 한 새로운 해석을 시도하였다.

Shear Process and Frictional Characteristics in Down-end Milling

  • Lee, Young-Moon;Jang, Seung-Il
    • International Journal of Precision Engineering and Manufacturing
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    • 제4권4호
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    • pp.19-24
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    • 2003
  • In end milling process, which is characterized by the use of a rotating tool, the undeformed chip thickness varies periodically with phase change of the tool. Although many efforts have concentrated on the study of end milling process, the analysis of shear and chip-tool friction behaviors has not been reported. Recently, a model has been proposed to simulate the shear and friction characteristics of an up-end milling process in terms of the equivalent oblique cutting. In the current study, the varying undeformed chip thickness and the cutting forces in a down-end milling process are replaced with the equivalent ones of oblique cutting. Then it is possible to simulate the shear and the chip-tool friction characteristics of a down-end milling process. The proposed model has been verified through two sets of cutting tests i.e., down-end milling and the equivalent oblique cutting tests. The experimental results show that the proposed model is suitable to analyze the shear and chip-tool frictional characteristics of down-end milling process. The specific cutting energy decreases with increase in equivalent undeformed chip thickness in a down-end milling process.

최대 칩두께를 이용한 쏘블레이드에서 칩핑과정의 역학적 모델링 (Kinematics Modeling of the Chipping Process at Saw Blade using the Maximum Chip Thickness)

  • 김경우;김우순;최현민;김동현
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 춘계학술대회 논문집(한국공작기계학회)
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    • pp.101-106
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    • 2001
  • In order to establish the optimum process parameters and diamond saw blade composition for machining natural stone, the chip formation process and the wear process must be understood. Diamond saw blade is one of the most effective, versatile, and extensively used methods of processing rock and other hard materials, such as granite, marble, concrete and asphalt. For many years, it has been known that chip thickness is one of the most significant in the understanding of the sawing process, and other variables such as force and power have been correlated with it. In this study, mathematical relations of a material chipped by a single grit of the saw blade will be undertaken. The material chipping geometries have been mathematically defined and derived as maximum chip thickness.

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