• 제목/요약/키워드: Chip Flow

검색결과 315건 처리시간 0.024초

반도체 칩 캡슐화(encapsulation)를 위한 트랜스퍼 금형 캐비티(cavity)에서의 설계 해석 및 실험에 관한 연구 (Design Analysis in a Cavity with Leadframe during Semiconductor Chip Encapsulation)

  • 한세진;허용정
    • 한국정밀공학회지
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    • 제12권12호
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    • pp.91-99
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    • 1995
  • An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

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화상처리를 이용한 칩유동의 해석에 관한 연구 (A study on the analysis of chip flow by the image processing)

  • 백인환;이형대
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1990년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 26-27 Oct. 1990
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    • pp.811-815
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    • 1990
  • This paper describes the method on image acquisition and image processing in the turning process. The formation of discontinuous chips during high-speed oblique cutting without lubricant was observed by means of video camera recorder and stroboscope. The image processing technique for chip flow is described and the results are presented for variable feeds. It is concluded that experimental values of chip flow angle are similar to theoretical values of Stabler's rule.

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반도체 칩 캡슐화성형 유동해석 및 성형조건 최적화에 관한 연구 (Flow Analysis and Process Conditions Optimization in a Cavity during Semiconductor Chip Encapsulation)

  • 허용정
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.67-72
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    • 2001
  • 반도체 칩 캡슐화성형시 칩 캐비티에서의 유동을 보다 엄밀하게 모델링하고 해석하기 위한 연구가 이루어졌다. 리드프레임에서의 구멍부위를 통과하는 유동의 모델링을 시도하였고 리드프레임에서의 열 경계조건을 정확하게 취급하였다. 유동의 이론적 해석을 위해 헬레쇼오 모델을 채택하였고 리드프레임에 의해 아래 위로 분리된 각각의 캐비티로 가정하여 해석하였다. 리드프레임에서 구멍부위를 통과하는 유동은 헬레쇼오 모델링시에 질량 소스(source) 항으로 삽입되었다. 유동해석 프로그램과 콤플렉스 방법에 기반을 둔 최적화 프로그램을 연계하여 미성형 방지를 위한 최적 공정조건을 성공적으로 정확하게 얻어낼 수 있었다.

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체크밸브가 달린 열공압 방식의 PDMS-유리마이크로 펌프에 관한 연구 (A Study About PDMS-Glass Based Thermopneumatic Micropump Integrated with Check Valve)

  • 고용준;조웅;안유민
    • 대한기계학회논문집A
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    • 제32권9호
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    • pp.720-727
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    • 2008
  • Microfluidic single chip integrating thermopneumatic micropump and micro check valve are developed. The micropump and micorvalve are made of biocompatible materials, glass and PDMS, so as to be applicable to the biochip. By using the passive-type check valve, backward flow and fluid leakage are blocked and flow control is stable and precise. The chip is composed of three PDMS layers and a glass substrate. In the chip, flow channel and pump chamber were made on the PDMS layers by the replica molding technique and pump heater was made on the glass substrate by Cr/Au deposition. Diameter of the pump chamber is 7 mm and the width and depth of the channel are 200 and $180{\mu}m$, respectively. The PDMS layers chip and the heater deposited glass chip are combined by a jig and a clamp for pumping operation, and they are separable so that PDMS chip is used as a disposable but the heater chip is able to be used repeatedly. Pumping performance was simulated by CFD software and investigated experimentally. The performance was the best when the duty ratio of the applied voltage to the heater was 33%.

칩 말림 방지를 위한 고압 분사 노즐 설계에 관한 연구 (A Study on Design of High Pressure Injection Nozzle for Avoiding Chip Curling)

  • 이중섭;윤지훈;정인국;송철기;서정세
    • 한국생산제조학회지
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    • 제20권6호
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    • pp.793-798
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    • 2011
  • In this study, it was grasped to the flow characteristics of cutting fluid injected by nozzle installed in high pressure holder for avoiding chip curling occurred during machining process. And for avoiding chip curling, the possibility of elimination under various chip conditions was checked. Consequently, the highest discharging pressure and velocity was shown in 150 of nozzle inflow angle. Also as nozzle outlet diameter is small, the pressure and velocity of injected flow are high. Moreover, It could be confirmed that width and thickness of chip have no direct effect on chip elimination and it is achieved by torque generated by injected cutting fluid.

3-D 유체집속효과와 레이저 중합반응을 이용한 PDA 센서 미세섬유 제작 (On-Chip Fabrication of PDA Sensor Fiber Using Laser Polymerization and 3-D Hydrodynamic Focusing)

  • 유임성;송시몬
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2692-2695
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    • 2008
  • Polydiacetylene (PDA) is chemosensor materials that exhibit non-fluorescent-to-fluorescent transition as well as blue-to-red visible color change upon chemical or thermal stress. They have been studied in forms of film or microarray chip, so far. In this paper, we provide a novel technique to fabricate continuous micro-fiber PDA sensor using in-situ laser-polymerization technique and 3-D hydrodynamic focusing on a microfluidic chip. The flow of a monomer solution with diacetylene (DA) monomer is focused by a sheath flow on a 3-D microfluidic chip. The focused flow is exposed to 365 nm UV laser beam for in-situ polymerization which generates a continuous fiber containing DA monomers. Then, the fiber is exposed to 254 nm UV light to polymerize DA monomers to PDA. Preliminary results indicate that the fiber size can be controlled by the flow rates of the monomer solution and sheath flows and that a PDA sensor fiber successively responds to chemical and thermal stress.

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단일칩 마이크로컨트롤러를 이용한 차압식 유량제어기의 개발 (Development of Differential Exhaust Flow Controller using One Chip Microcontroller)

  • 박찬원;김현식;주용규
    • 산업기술연구
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    • 제22권A호
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    • pp.89-94
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    • 2002
  • In this paper, a Exhaust Flow Controller (EFC) technology for uniform application of film coater and developer device is introduced that spread and remove photo resister at semiconductor manufacturing process. Because developed EFC device uses differential pressure sensing method as a differential flow meter and embodied smart A/D conversion by using a one chip microprocessor and devised by feedback Servo control, It has shown excellent performance and stability evaluation, as maximum 2000L/min flow, capability of installation to actual semiconductor equipment.

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한 쌍의 전극으로 전기 삼투 유동과 세포 분쇄 기능을 동시에 구현한 연속적인 세포 분쇄기 (A Continuous Electrical Cell Lysis Chip using a DC Bias Voltage for Cell Disruption and Electroosmotic Flow)

  • 이동우;조영호
    • 대한기계학회논문집A
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    • 제32권10호
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    • pp.831-835
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    • 2008
  • We present a continuous electrical cell lysis chip, using a DC bias voltage to generate the focused high electric field for cell lysis as well as the electroosmotic flow for cell transport. The previous cell lysis chips apply an AC voltage between micro-gap electrodes for cell lysis and use pumps or valves for cell transport. The present DC chip generates high electrical field by reducing the width of the channel between a DC electrode pair, while the previous AC chips reducing the gap between an AC electrode pair. The present chip performs continuous cell pumping without using additional flow source, while the previous chips need additional pumps or valves for the discontinuous cell loading and unloading in the lysis chambers. The experimental study features an orifice whose width and length is 20 times narrower and 175 times shorter than the width and length of a microchannel. With an operational voltage of 50 V, the present chip generates high electric field strength of 1.2 kV/cm at the orifice to disrupt cells with 100% lysis rate of Red Blood Cells and low electric field strength of 60 V/cm at the microchannel to generate an electroosmotic flow of $30{\mu}m/s{\pm}9{\mu}m/s$. In conclusion, the present chip is capable of continuous self-pumping cell lysis at a low voltage; thus, it is suitable for a sample pretreatment component of a micro total analysis system or lab-on-a-chip.

반도체 칩 테스트용 챔버 형상에 따른 유동 균일성에 대한 수치적 연구 (A Numerical Study on the Flow Uniformity according to Chamber Shapes Used for Test of the Semi-Conductor Chip)

  • 이대규;마상범;김성;김정열;강채동;김진혁
    • 한국수소및신에너지학회논문집
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    • 제31권5호
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    • pp.480-488
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    • 2020
  • This study was conducted to improve the flow uniformity inside the chip tester through changing the flow path formation according to the inlet and outlet position of chamber. The internal flow and velocity distributions of the modified chamber models (Cases 1-3) were compared with the reference chamber model through three-dimensional Reynolds-averaged Navier-Stokes equations with k-ε turbulence model. The modified chamber models showed the superior flow uniformity characteristics compared to the reference chamber model. To investigate the flow uniformity in the chip tester, the standard deviation of the velocity was defined and compared. Through the internal flow analysis and assesment of the standard deviation, Case 2 among the test cases including the reference model showed the best flow uniformity generally.

신形 칩折斷具에 관한 實驗的 硏究 (제1보) (An Experimental Study on New Type Chip Brakeer(Part 1))

  • 손명환;이호철
    • 대한기계학회논문집
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    • 제16권6호
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    • pp.1121-1140
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    • 1992
  • 본 연구에서는 부착형 칩절단구의 경사면 대신에 원고면으로 형성한 형태 칩 절단구를 고찰하고, 재래형과 비교하여 더 효과적인 칩절단구를 개발 실용화하고자 한 다. 가공법으로서는 연속칩의 처리가 가장 곤란한 선삭을, 공작물로서는 연속칩이 가장 잘 생성되는 SM 20 C의 연강을, 공구재료로서는 P계열의 초경합금을 써서 저속에 서 고속절삭속도까지 시험하였다.