• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.711-712
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• 2009

MCP 기술을 이용한 반도체 칩에서 문제가 되는 방열문제를 해결하기 위한 방법으로 열전 냉각 소자를 이용하여 열을 방출 시키는 방법에 관하여 연구를 수행하였다. 시뮬레이션을 통하여 열전 소자가 작동할 때, 흡수하는 열량을 계산할 수 있었으며, 열전 소자의 냉각 성능도 평가 할 수 있었다. 이러한 열 해석 및 열전 해석을 통하여 적층 구조의 MCP 모듈을 위한 열 설계 및 효율적 냉각을 가능하게 할 수 있을 것이다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.8
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• pp.973-982
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• 1997

Effect of vortex generator on the heat transfer enhancement of electronic chips is investigated using naphthalene sublimation technique. Experiments are performed for a single chip and chip arrays, and shape of vortex generator, position of vortex generator, stream wise chip spacing and air velocity are varied. Local and average heat transfer coefficients are measured on the top surface of simulated electronic chips, and compared with those obtained without vortex generator. In case of a single chip, heat transfer augmentation is seen only on the upstream portion of chip surface, while heat transfer enhancement is found on the whole surface for chip arrays. Rectangular wing type vortex generator is found to be more effective than delta wing.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.546-552
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• 2001

The heat transfer and flow measurements on a pedestal encountered in chip cooling. A uniform wall temperature boundary condition at the plate surface and on a pedestal was created using shroud method. Liquid crystal was used to measure the plate surface temperature. The jet Reynolds number (Re) ranges from 11,000 to 50,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, and the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.0. The results show that the Nusselt number distributions at the near the pedestal exhibit secondary maxima at $r/d{\cong}1.0\;and\;1.5$. The formation of the secondary maxima is attributed to an create in the vortex by the pedestal.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.640-645
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• 2007

An experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler is developed. The spot heating in very small area is achieved by the applying CO$_2$ laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.365-368
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• 2001

입사면에서 발생하는 열을 효율적으로 제거하기 위하여 Yb:YAG 결정의 표면에 sapphire 창을 부착하여 레이저를 발진 시켰다. Yb:YAG 결정에서 발생하는 열이 sapphire 창을 통하여 구리판으로 전달되는 경우 와 Yb:YAG 결정의 측면에서 냉각하는 경우의 레이저 출력을 측정하여 각각의 레이저 발진 특성을 비교하여 보았다. 여기면을 sapphire 창으로 냉각하는 micro-chip Yb:YAG 레이저의 레이저 에너지 전환 효율은 38%였으며 레이저 발진 문턱값은 4 kw/mm$^2$, slope efficiency는 56%로 측정되었다. Sapphire 창을 사용하는 경우 표면에서의 열전달도는 10 W/mm$^2$이상으로 관측되었다. Yb:YAG의 도핑율, 출력경의 반사율 등을 레이저 변수를 최적화할 경우 같은 구조에서 50 W급 레이저도 발진 가능할 것으로 예상된다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.3
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• pp.53-59
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• 2011

In this study, a two-phase closed loop cooling system is desinged and tested for a laptop computer using a FC-72. The cooling system is characterized by a parametric study which determines the effects of existence of a boiling enhancement microstructure, initial system pressure, volume fill ratio of coolant and inclination angle of condenser on the thermal performance of the closed loop. Experimental data show the optium condition when the volume ratio of working fluid is 70%, the pump flowing is 6ml/min, and the inclination angle of condenser is $0^{\circ}$. This research shows the maximum values which can dissipate 33W of chip power with a chip temperature maintained at $95^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.667-668
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• 2010

• Proceedings of the Safety Management and Science Conference
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• 2002.05a
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• pp.221-225
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• 2002

Machinability improvement by the use of liquid nitrogen in cryogenic machining has been reported in various studies. This has been mostly attributed to the cooling effect of liquid nitrogen. However, No study has been found in discussion on whether liquid nitrogen possesses lubrication effect in cryogenic cutting. This paper presents lubrication mechanism related to chip microstructure. The friction reduction was further reflected In larger shear angle and less secondary deformation in the chip microstructures.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.27-31
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• 2015

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.