Round Jet Impingement Heat Transfer on a Pedestal Encountered in Chip Cooling

원형 충돌제트를 이용한 Pedestal 형상의 핀이 부착된 Chip 냉각

The heat transfer and flow measurements on a pedestal encountered in chip cooling. A uniform wall temperature boundary condition at the plate surface and on a pedestal was created using shroud method. Liquid crystal was used to measure the plate surface temperature. The jet Reynolds number (Re) ranges from 11,000 to 50,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, and the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.0. The results show that the Nusselt number distributions at the near the pedestal exhibit secondary maxima at $r/d{\cong}1.0\;and\;1.5$. The formation of the secondary maxima is attributed to an create in the vortex by the pedestal.