• The Optical Journal
• /
• s.117
• /
• pp.61-65
• /
• 2008

초정밀 CMP가 없었다면 오늘날의 컴퓨터는 있을 수 없다. 초정밀 CMP 기술은 현재 옵토메카트로닉스 분야의 핵심 기술이고, 정보화 사회에서는 없어서는 안 될 IT 산업의 견인차가 되고 있다. 초정밀 가공 기술 중 CMP는 기능성 재료가 갖는 특이한 특성을 끌어낼 수 있는 무변형 평활 표면 가공법으로 3차원 초미세 가공을 하는 데 있어 기본이 될 것으로 기대되는 기술이다. 본 고에서는 현재 기술적으로 다른 예를 볼 수 없는 양산 베이스로 초정밀 가공이 실행되고 있는 초 LSI용 베어 실리콘 웨이퍼의 CMP(Chemical Mechanical Polishing) 기술에 대해 해설하고, 디바이스화 웨이퍼의 Planarization(평탄화) CMP로의 응용에 대해 설명한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.9
• /
• pp.703-703
• /
• 2001

• Proceedings of the KIEE Conference
• /
• 2006.10a
• /
• pp.95-96
• /
• 2006

ITO thin film is generally fabricated by various methods such as spray, CVD, evaporation, electron gun deposition, direct current electroplating, high frequency sputtering, and reactive DC sputtering. However, some problems such as peaks, bumps, large particles, and pin-holes on the surface of ITO thin film were reported, which caused the destruction of color quality, the reduction of device life time, and short-circuit. Chemical mechanical polishing (CMP) process is one of the suitable solutions which could solve the problems.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.05a
• /
• pp.16.1-16.1
• /
• 2006

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.11a
• /
• pp.15.1-15.1
• /
• 2006

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.11a
• /
• pp.15.2-15.2
• /
• 2006

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.11a
• /
• pp.16.1-16.1
• /
• 2006

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.05a
• /
• pp.16.2-16.2
• /
• 2006

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2006.05a
• /
• pp.17.1-17.1
• /
• 2006

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.256-259
• /
• 2004

Chemical mechanical polishing(CMP) has been adopted in processing semiconductors for more than ten years. Although some customers expressed negative opinion about CMP at the beginning of its appearance, CMP has currently been applied to a variety of fields in addition to semiconductor multi-layer wiring strategies. This report summarizes each sort of CMP skills in their development stage and introduces each type of MAT's machines optimized for CMP research and development