• The KIPS Transactions:PartA
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• v.12A no.7 s.97
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• pp.627-636
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• 2005

This paper presents a PC cluster-based distributed video on demand (VOD) server that minimizes the load of the interconnection network by adopting channel bonding-based MVIA and the interval cache algorithm Video data is distributed to the disks of each server node of the distributed VOD server and each server node receives the data through the interconnection network and sends it to clients. The load of the interconnection network increases because of the large volume of video data transferred. We adopt two techniques to reduce the load of the interconnection network. First, an Msupporting channel bonding technique is adopted for the interconnection network. n which is a user-level communication protocol that reduces the overhead of the TCP/IP protocol in cluster systems, minimizes the time spent in communicating. We increase the bandwidth of the interconnection network using the channel bonding technique with MThe channel bonding technique expands the bandwidth by sending data concurrently through multiple network cards. Second, the interval cache reduces traffic on the interconnection network by caching the video data transferred from the remote disks in main memory Experiments using the distributed VOD server of this paper showed a maximum performance improvement of $30\%$ compared with a distributed VOD server without channel bonding-based MVIA and the interval cache, when used with a four-node PC cluster.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.10
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• pp.4034-4053
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• 2015

In order to meet various requirements for transmission quality of both primary users (PUs) and secondary users (SUs) in cognitive radio networks, we introduce a channel bonding mechanism for PUs and a channel reservation mechanism for SUs, then we propose a novel spectrum allocation strategy. Taking into account the mistake detection and false alarm due to imperfect channel sensing, we establish a three-dimensional Markov chain to model the stochastic process of the proposed strategy. Using the method of matrix geometric solution, we derive the performance measures in terms of interference rate of PU packets, average delay and throughput of SU packets. Moreover, we investigate the influence of the number of the reserved (resp. licensed) channels on the system performance with numerical experiments. Finally, to optimize the proposed strategy socially, we provide a charging policy for SU packets.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.441-449
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• 2014

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

• Journal of Sensor Science and Technology
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• v.18 no.2
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• pp.154-159
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• 2009

This paper describes two methods - stamp-to-stick bonding and microtransfer molding - to integrate microfluidic channel into an optoelectrofluidic device for in-channel microparticle manipulation. We have demonstrated the optoelectronic microparticle manipulation in the channel-integrated optoelectrofluidic device using a liquid crystal display. As injecting a liquid sample containing $15{\mu}m$-diameter polystyrene particles into the fabricated channel, trapping and transport of individual microparticles have been successfully demonstrated. This channel-integrated optoelectrofluidic device may be useful for several in-channel applications based on the optoelectrofluidics such as optoelectronic flow control, droplet-based protein assay and bead-based immunoassay.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.2
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• pp.87-93
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• 2015

Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.5
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• pp.8-18
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• 2009

CableLAB published DOCSIS 3.0 Specifications to supply broadband access to homes and small businesses. The primary technique of DOCSIS 3.0 Specification is channel bonding which provides cable operators with a flexible way to significantly increase up/downstream speeds. In this paper, we propose the upstream scheduler that serves channel bonding. Proposed scheduler consists of two sub-scheduler: bonding group scheduler and channel scheduler. Also, we propose three scheduling algorithms to allocate request bandwidth of CM to each bonding channel: equivalent scheduling algorithm, current request-based scheduling algorithm, and last grant-based scheduling algorithm. In order to evaluate the performance of these algorithms and DOCSIS 3.0 MAC protocol, we develop the DOCSIS 3.0 simulator with the network simulator, OPNET, to model DOCSIS network, CMTS, and CM. Our results show that equivalent scheduling algorithm is superior to others in the view of transmission delay and throughput and DOCSIS 3.0 protocol provides higher throughput than pre-DOCSIS 3.0 protocol.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.36 no.5A
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• pp.536-542
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• 2011

For efficient utilization of spectrum resources in TV white space after DTV transition, FCC allowed usage of the spectrum for CR system. The CR system is required to cognize channel usage state for utilizing the unused spectrum in TV white space which coexists various primary and secondary systems. In the meantime, as a demand for high throughput communication had been increased recently, CR systems also consider to adopt channel bonding technology, thus spectrum sensing for channel bonded system is essentially required. In this paper, we propose a novel spectrum sensing algorithm for channel bonding system using a single channel receiver. For IEEE 802.l1af signal, the proposed algorithm provide detection probability of 90% with false alarm probability 10% at SNR -18dB for single channel system and at SNR -7dB for 8 channel bonded system, respectively. Utilizing the proposed scheme, we can detect channel bonded signal using only a single receiver, therefore system overhead for spectrum sensing can be reduced significantly.

• Journal of the Korea Society for Simulation
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• v.17 no.4
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• pp.21-27
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• 2008

In this paper, we design and implement the upstream packet bandwidth allocation algorithm on OPNET-based DOCSIS 3.0 simulator including channel-bonding CM (Cable Modem)s. Previous DOCSIS CM could not support channel bonding, it has problem in upstream bandwidth allocation and determine the contention area. The proposed upstream bandwidth allocation algorithm has been improved the queuing time and success rate. For the simulation, we design the MAC frame structure with channel bonding supported CM and not. And then, this paper design and implement the CMTS node model, CM node model, CMTS process model, and CM process model.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.99-105
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• 2006

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.92-98
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• 2020

In this study, an injection mold with conformal cooling channels was designed and manufactured for use in the production of a thick plastic cosmetic container that required high gloss surfaces. A cooling analysis verified the design of the conformal cooling channel for the cosmetic container, and also showed that the cooling efficiency was superior to that of the straight cooling channel. Slide cores designed with the conformal cooling channel were manufactured using the Layers Parting method and vacuum diffusion bonding. Subsequent test injection and quality inspection showed no problem in the appearance and dimensional accuracy of the produced product. The cycle time for product production was about 110 seconds, sufficient for mass production.