• Title/Summary/Keyword: Ceramic deposition

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Surface Modification Using CVD-SiC (화학증착 탄화규소에 의한 표면 개질)

  • 김한수;최두진;김동주
    • Journal of the Korean Ceramic Society
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    • v.33 no.7
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    • pp.761-770
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    • 1996
  • Silicon carbide (SiC) films were deposited by low pressure chemical vapor deposition (LPCVD) using MTS (CH3SICl3) in a hydrogen atmosphere onto graphite substrates. Depletion effects of reactants which usually occur in the hot wall horizaontal reactor were increased with deposition temperature and pressure. Below 50 torr of total pressure (111) plane was preferenctially grown irrespectrive of deposition temperature and deposition site. Over 50 torr of total pressure however (220) plane was preferentially deposited under 130$0^{\circ}C$ and at inlet site. The surface morphologies of SiC films were uniform at all deposition sites under low pressure but greatly changed with pressure. It shows that a facet structure which was formed above 125$0^{\circ}C$ played an important role in the changed of preferred orientation and surface roughness.

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A Review on Ultrathin Ceramic-Coated Separators for Lithium Secondary Batteries using Deposition Processes (증착 기법을 이용한 리튬이차전지용 초박막 세라믹 코팅 분리막 기술)

  • Kim, Ucheol;Roh, Youngjoon;Choi, Seungyeop;Dzakpasu, Cyril Bubu;Lee, Yong Min
    • Journal of the Korean Electrochemical Society
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    • v.25 no.4
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    • pp.134-153
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    • 2022
  • Regardless of a trade-off relationship between energy density and safety, it is essential to improve both properties for future lithium secondary batteries. Especially, to improve the energy density of batteries further, not only thickness but also weight of separators including ceramic coating layers should be reduced continuously apart from the development of high-capacity electrode active materials. For this purpose, an attempt to replace conventional slurry coating methods with a deposition one has attracted much attention for securing comparable thermal stability while minimizing the thickness and weight of ceramic coating layer in the separator. This review introduces state-of-the-art technology on ceramic-coated separators (CCSs) manufactured by the deposition method. There are three representative processes to form a ceramic coating layer as follows: chemical vapor deposition (CVD), atomic layer deposition (ALD), and physical vapor deposition (PVD). Herein, we summarized the principle and advantages/disadvantages of each deposition method. Furthermore, each CCS was analyzed and compared in terms of its mechanical and thermal properties, air permeability, ionic conductivity, and electrochemical performance.

Deposition of Indium Tin Oxide films on Polycarbonate substrates by Ion-Assisted deposition (IAD)

  • Cho, Jn-sik;Han, Young-Gun;Park, Sung-Chang;Yoon, Ki-Hyun;Koh, Seok-Keun
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.98-98
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    • 1999
  • Highly transparent and conducting tin-doped indium oxide (ITO) films were deposited on polycarbonate substrate by ion-assited deposition. Low substrate temperature (<10$0^{\circ}C$) was maintained during deposition to prevent the polycarbonate substrate from be deformed. The influence of ion beam energy, ion current density, and tin doping, on the structural, electrical and optical properties of deposited films was investigated. Indium oxide and tin-doped indium oxide (9 wt% SnO2) sources were evaporated with assisting ionized oxygen in high vacuum chamber at a pressure of 2$\times$10-5 torr and deposition temperature was varied from room temperature to 10$0^{\circ}C$. Oxygen gas was ionized and accelerated by cold hallow-cathode type ion gun at oxygen flow rate of 1 sccm(ml/min). Ion bea potential and ion current of oxygen ions was changed from 0 to 700 V and from 0.54 to 1.62 $\mu$A. The change of microstructure of deposited films was examined by XRD and SEM. The electrical resistivity and optical transmittance were measured by four-point porbe and conventional spectrophotometer. From the results of spectrophotometer, both the refractive index and the extinction coefficient were derived.

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Stability of Sputtered Hf-Silicate Films in Poly Si/Hf-Silicate Gate Stack Under the Chemical Vapor Deposition of Poly Si and by Annealing

  • Kang, Sung-Kwan;Sinclair, Robert;Ko, Dae-Hong
    • Journal of the Korean Ceramic Society
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    • v.41 no.9
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    • pp.637-641
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    • 2004
  • We investigated the effects of SiH$_4$ gas on the surface of Hf-silicate films during the deposition of polycrystalline (poly) Si films and the thermal stability of sputtered Hf-silicate films in poly Si/Hf-silicate structure by using High Resolution Transmission Electron Microscopy (HR-TEM) and X-ray Photoelectron Spectroscopy (XPS). Hf-silicate films were deposited by using DC-mag-netron sputtering with Hf target and Si target and poly Si films were deposited at 600$^{\circ}C$ by using Low Pressure Chemical Vapor Deposition (LPCVD) with SiH$_4$ gas. After poly Si film deposition at 600$^{\circ}C$, Hf silicide layer was observed between poly Si and Hf-silicate films due to the reaction between active SiH$_4$ gas and Hf-silicate films. After annealing at 900$^{\circ}C$, Hf silicide, formed during the deposition of poly Si, changed to Hf-silicate and the phase separation of the silicate was not observed. In addition, the Hf-silicate films remain amorphous phase.

The Effect of Chemical Vapor Infiltrated SiC Whiskers on the Change in the Pore Structure of a Porous SiC Body

  • Joo, Byoung-In;Park, Won-Soon;Choi, Doo-Jin;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
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    • v.43 no.4 s.287
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    • pp.199-202
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    • 2006
  • In this study, SiC whiskers were grown on a porous SiC diesel particulate filter for nanoparticle filtering. To grow the whiskers at the inner pore without closing the pores, we used chemical vapor infiltration with a solution source and a dilute. As the deposition time increased, the whiskers grew and formed a network structure. After 180 min of deposition, the mean diameter of the whiskers was 174 nm and the compressive strength was 58.4 MPa. The pores shrank from $10{\mu}m\;to\;0.4{\mu}m$ and, because the whiskers filed the inner pores, the gradient of permeability decreased as the deposition time increased. However, by using the network structure of whiskers deposited for 120 min and 180 min, we obtained a diesel particulate filter with pores of $0.98{\mu}m\;and\;0.4{\mu}m$, respectively. Furthermore, the filter shows better permeability than a porous body with pores of $1{\mu}m$. In short, by filtering the nanoparticulate materials, the network structure of whiskers improves the strength, reduces the pore size and minimizes the permeability drop.

Thermal Durability of 4YSZ Thermal Barrier Coating Deposited by Electron Beam PVD (전자빔을 이용한 물리기상증착법으로 제조된 열차폐용 4 mol% YSZ 코팅의 내열특성)

  • Park, Chanyoung;Yang, Younghwan;Kim, Seongwon;Lee, Sungmin;Kim, Hyungtae;Lim, Daesoon;Jang, Byungkoog;Oh, Yoonsuk
    • Journal of Powder Materials
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    • v.20 no.6
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    • pp.460-466
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    • 2013
  • 4 mol% Yttria-stabilized zirconia (4YSZ) coatings with $200{\mu}m$ thick are fabricated by Electron Beam Physical Vapor Deposition (EB-PVD) for thermal barrier coating (TBC). $150{\mu}m$ of NiCrAlY based bond coat is prepared by conventional APS (Air Plasma Spray) method on the NiCrCoAl alloy substrate before deposition of top coating. 4 mol% YSZ top coating shows typical tetragonal phase and columnar structure due to vapor phase deposition process. The adhesion strength of coating is measured about 40 MPa. There is no delamination or cracking of coatings after thermal cyclic fatigue and shock test at $850^{\circ}C$.

Effect of the Deposition Temperature on the Transmittance & Electrical Conductivity of In1.6Zn0.2Sn0.2O3-δ Thin Films Prepared by RF-magnetron Sputtering (RF-마그네트론 스퍼터링에 의해 제조된 In1.6Zn0.2Sn0.2O3-δ 박막의 투과율 및 전기 전도성에 미치는 증착 온도의 영향)

  • Seo, Han;Ji, Mi-Jung;An, Yong-Tea;Ju, Byeong-Kwon;Choi, Byung-Hyun
    • Journal of the Korean Ceramic Society
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    • v.49 no.6
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    • pp.663-668
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    • 2012
  • In order to reduce the indium contents in transparent conducting oxide(TCO) thin films of $In_{1.6{\sim}1.8}Zn_{0.2}Sn_{0.2{\sim}0.4}O_3$ (IZTO), $In_{1.6}Zn_{0.2}Sn_{0.2}O_{3-{\delta}}$(IZTO) was prepared by replacing indium with Zn and Sn. The TCO films were deposited via RF-magnetron sputtering of the IZTO target at various deposition temperatures and its film characteristics were investigated. When deposited in an Ar atmosphere at $400^{\circ}C$, the electrical resistivity of the film decreased to $6.34{\times}10^{-4}{\Omega}{\cdot}cm$ and the optical transmittance was 80%. As the deposition temperature increased, the crystallinity of the IZTO film was enhanced. As a result, the electrical conductivity and transmittance properties were improved. This demonstrates the possibility of replacing ITO TCO film with IZTO.

Preparation of Alumina-Silica Composite Coatings by Electrophoretic Deposition and their Electric Insulation Properties (EPD 방법을 이용한 알루미나-실리카 복합 코팅막의 제조와 전기절연 특성)

  • Ji, Hye;Kim, Doo Hwan;Park, Hee Jeong;Lim, Hyung Mi;Lee, Seung-Ho;Kim, Dae Sung;Kim, Younghee
    • Journal of the Korean Ceramic Society
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    • v.51 no.3
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    • pp.177-183
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    • 2014
  • Alumina-silica composite coating layers were prepared by electrophoretic deposition (EPD) of plate-shaped alumina particles dispersed in a sol-gel binder, which was prepared by hydrolysis and the condensation reaction of methyltrimethoxysilane in the presence of colloidal silica. The microstructure and the electrical and thermal properties of the coatings were compared according to the EPD process parameter: voltage, time and the content of the plate-shaped alumina particles. The electrical insulation property of the coatings was measured by a voltage test. The coatings were prepared by EPD of the sol-gel binder with 5-30 wt% plate alumina particles on parallel electrodes at a distance of 2 cm for 1-10 min under an applied voltage of 10-30 V. The coatings experienced increased breakdown voltage with increasing thickness. However, the higher the thickness was, the smaller the breakdown voltage strength was. A breakdown voltage as high as 4.6 kV was observed with a $400{\mu}m$ thickness, and a breakdown voltage strength as high as 27 kV/mm was achieved for the sample under a $100{\mu}m$ thickness.

Low Pressure Chemical Vapor Deposition of Silicon Carbide (탄화규소의 저압 화학증착)

  • 송진수;김영욱;김동주;최두진;이준근
    • Journal of the Korean Ceramic Society
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    • v.31 no.3
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    • pp.257-264
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    • 1994
  • The objectives of this study were to develop the low pressure chemical vapor deposition(LPCVD) process of SiC and to fabricate pure and dense SiC layer onto graphite substrate at low temperature. The deposition experiments were performed using the MTS-H2 system (30 torr) in the deposition temperature ranging from 100$0^{\circ}C$ to 120$0^{\circ}C$. The deposition rate of SiC was increased with the temperature. The rate controlling step can be classified from calculated results of the apparent thermal activation energy as follows; surface reaction below 110$0^{\circ}C$ and gas phase diffusion through a stagnant layer over 110$0^{\circ}C$. The deposited layer was $\beta$-SiC with a preferred orientation of (111) and the strongly faceted SiC deposits were observed over 115$0^{\circ}C$.

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Deposition of Diamond Thin Film Prepared by Hot-filament Chemical Vapor Deposition (Hot-filament법에 의한 Diamond 박막증착)

  • 윤석근;한상목;소명기
    • Journal of the Korean Ceramic Society
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    • v.28 no.10
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    • pp.777-784
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    • 1991
  • Diamond films have been growth by the hot-filament chemical vapor deposition (HFCVD) using CH4 and H2 gaseous mixture on the Si substrate. The experimental results indicated that the deposits were pure diamond and contained no amount of non-diamond phases such as amorphous carbon or graphite. The diamond films were deposited well at the conditions: the filament temperature of 210$0^{\circ}C$, the substrate temperature of 77$0^{\circ}C$, the CH4 concentration of 1.76%, the reactor pressure of 30 torr, and the deposition time of 7 hr. At this growth condition, the maximum deposition rate was 2 ${\mu}{\textrm}{m}$/hr. X-ray diffraction patterns and texture coefficient results showed that preferred orientation of the diamond films was {111} orientation under all experimental conditions.

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