• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.27-32
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• 2013

According to the composition of LTCC material, though it was thought that bulk defect which was made in forming process effects on the densification during the sintering, it was not reported systemically. In this study, we evaluated crystal structure, 3 point bending strength, hardness and microstructure of the samples by uniaxial pressing and tape casting using the commercial powders of the crystallizing glass and the glass/ceramic composite. In the case of glass/ceramic composite, Viox-001 powder with residual glass in the sintering, 3 point bending strength was similar regardless of forming process due to fill the bulk defect by residual glass. In the case of crystallizing glass, MLS-22, because glass phase was small in the sintering, glass did not fill the pore in the sample by uniaxial pressing process, therefore, the 3 point bending strength of it was 167 MPa. However, the 3 point bending strength of the sample by tape casting was 352 MPa and much higher. Meanwhile, crystal structure and hardness were similar regardless of forming process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.169-172
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• 2002

This study demonstrated the feasibility of using tape-casting followed by sintering as a low-cost alternative for coating glass-ceramic or glass film on a metal substrate. The process has been successfully used to fabricate a glass-on-stainless steel and a glass-ceramic-on-molybdenum electrostatic chuck(ESC) with the insulating layer thickness about $150{\mu}{\textrm}{m}$. Electrical resistivity data of the coaling were obtained between room temperature and 55$0^{\circ}C$; although the resistivity values dropped rapidly with increasing temperature in both coatings, the glass-ceramic still retained a high value of $10^{10}$ ohm-cm at $500^{\circ}C$. Clamping pressure measurements were done using a mechanical apparatus equipped with a load-cell at temperatures up to $350^{\circ}C$ and applied voltages up to 600V; the clamping behavior of all ESCs generally followed the voltage-squared curve as predicted by theory. Based on these results, we believe that we have a viable technology for manufacturing ESCs for use in reactive-ion etch systems.

• Ceramist
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• v.22 no.4
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• pp.429-451
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• 2019

Quartz glass is a key material for making semiconductor process components because of its purity, low thermal expansion, high UV transmittance and relatively low cost. Domestic quartz glass has a market worth about 500 billion won in 2018, and the market power of Japanese materials is very high. Quartz glass for semiconductor process can be divided into general process and exposure. For general process, molten quartz glass is mainly used, but synthetic quartz glass with higher purity is preferred. Synthetic quartz glass is used as the photomask for the exposure process. Recently, as semiconductors started the sub-nm process, the transition from the transmission type using ArF ultraviolet (194 nm) to the reflection type using EUV ultraviolet (13.5 nm) began. Therefore, the characteristics required for the synthetic quartz glass substrates used so far are also rapidly changing. This article summarizes the current technical trends of quartz glass and recent technical issues. Lastly, the present situation and development possibility of quartz glass technology in Korea were diagnosed.

• Journal of the Korean Ceramic Society
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• v.50 no.1
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• pp.75-81
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• 2013

We fabricated translucent opal glass to replace the polycarbonate diffuser in LED lighting systems in order to solve the durability problem. Batch materials of opal glass with a composition of calcium phosphate were created and melted at $1550^{\circ}C$, and the effect of opaqueness was identified by an addition of 1~7% calcium phosphate as an opacifier raw material. As a result, translucent opal glass was obtained by the melting of the mixed batch materials with a composition of more than 5% calcium phosphate glass at $1550^{\circ}C$ for 2 hrs, which had excellent optical properties for the diffuser of a LED lighting system with no dazzling from direct light by a high haze value exceeding 90% and a low parallel transmittance value of about 5%. For the thermal properties, the thermal expansion coefficient was found to be $5.6{\sim}5.9{\times}10^{-6}/^{\circ}C$ and the softening point was $874{\sim}884^{\circ}C$. In addition, good thermal properties such as good thermal shock resistance and feasibility for use with a general manufacturing process during the forming of glass tubes and bulbs were noted. Therefore, it is concluded that this translucent opal glass can be used as a glass diffuser material for LED lighting due to its high heat resistance and high durability as a replacement for a polycarbonate diffuser.

• Korean Journal of Materials Research
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• v.27 no.1
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• pp.39-42
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• 2017

E-glass (electrical glass) fiber is the widely used as a reinforced composite material of PCBs (printed circuit boards). However, E-glass fiber is not stable because it has a dielectric constant of 6~7. On the other hand, D-glass (dielectric glass) fiber has a low dielectric constant of 3~4.5. Thus, it is adaptable for use as a reinforcing material of PCBs. In this study, we fabricated D-glass compositions with low dielectric constant, and measured the electrical and optical properties. In the glass composition, the boron content was changed from 9 to 31 wt%. To confirm the dependence of the dielectric constant on melting properties, D-glass with 22 wt% boron was melted at $1550^{\circ}C$ and $1650^{\circ}C$ for 2hrs. The glass melted at $1650^{\circ}C$ had a lower dielectric constant than the glass melted at $1550^{\circ}C$. Therefore, the D-glass with boron of 9~31 wt% was fabricated by melting at $1650^{\circ}C$ for 2hrs, and transparent clear glass was obtained. We identified the non-crystalline nature of the glass using an XRD (x-ray diffractometer) graph. The visible light transmittance values depending on the boron contents were measured and found to be 88.6 % ~ 82.5 %. Finally, the dielectric constant of the D-glass with 31 wt% boron was found to have decreased from 4.18 to 3.93.

• Journal of the Korean Ceramic Society
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• v.39 no.6
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• pp.558-565
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• 2002

Coal fly ash, produced from a power plant in Korea was used for the production of glass-ceramics and the physical properties of glass-ceramics were evaluated. CaO and TiO$_2$ were added into the fly ash during the melting process to reduce the viscosity of molten glass and to induce internal crystallization of glass, respectively. Glass-ceramic was produced through a single stage heat treatment (at 950∼1050$\^{C}$ for 37∼240 min) after preparing glass (iota fly ash powder. As a result, a new tiny rod type crystals (a=7.4480, b=10.7381, c=4.3940 A, $\alpha$=94.9, $\beta$=98.6, γ=108.5°) was found in the glass-ceramics, which showed attractive mechanical properties, high hardness (7.1∼7.6 GPa) and wear resistance (by erosion test). Thus a glass-ceramic produced from thermal power plant fly ash and cell as a source for CaO exhibits a suitable treatment for the recycling and exploitation of waste materials and would be acceptable for a new application far building materials.

• Journal of the Korean Ceramic Society
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• v.42 no.12 s.283
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• pp.842-845
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• 2005

Glass composites containing ceramic fiber have been developed for Solid Oxide Fuel Cell (SOFC) seals. Effect of glass type, loading pressure and thermal cycle the leak rates of composite seals was investigated. Seal performance of two commercial glasses was compared with that of $SiO_2BaO-B_2O_3$ glass synthesized in this work. The leak rate for seals made of pyrex(R) increases from $\~0.0005\;to\;\~0.004sccm/cm$ as the gas pressure increases from 10 to 50 kPa. The soda lime silicate glass seal shows the leak rate two times higher than the one made of pyrex(R) or $SiO_2BaO-B_2O_3$ glass. The viscosity of glass at the seal test temperature is presumed to affect the leak rate of the glass seal. As the applied loading pressure increases from 0.4 to 0.8 MPa at $750^{\circ}C$, the leak rate decreases from 0.038 to 0.024 sccm/cm for composite seals. It has been found that during 50 thermal cycles between $450^{\circ}C\;to\;700^{\circ}C$ leak rates remained almost constant, ranging from 0.025 to 0.03sccm/cm. The results showed an excellent thermal cycle stability as well as sealability of the glass matrix ceramic fiber composite seals.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1218-1219
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• 2006

The shrinkage variation of Low Temperature Cofired Ceramics(LTCC) limits the size of the substrates that impose limitations on embedded passive components. This paper focuses on the method of minimizing or controlling planar shrinkage and reducing distortion during firing. The laminated sheets of alumina and glass were sintered at varying temperature, and depending on the amount of the glass ceramics. When the sintered of multi-layer structure with $Al_2O_3/Glass/Al_2O_3$, the glass infiltrated entirely into $Al_2O_3$ layer at the temperature of about $950^{\circ}C$ or higher.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.254-259
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• 2018

General D-glass(Dielectric glass) fibers are adaptable to PCBs(Printed circuit boards) because they have a low dielectric constant of about 3.5~4.5. However, very few papers have appeared on the physical characteristics of D-glass fibers. D-glass fibers were fabricated via continuous spinning process using bulk D-glass. In order to fabricate the D-glass, raw materials were put into a Pt crucible, melted at $1650^{\circ}C$ for 2 hrs, and then annealed at $521{\pm}10^{\circ}C$ for 2 hrs. We obtained transparent clear glass. The transmittance and adaptable temperature for spinning of the bulk marble glass were characterized using a UV-visible spectrometer and a viscometer. Continuous spinning was carried out using direct melting spinning equipment as a function of the fiberizing temperature in the range of $1368^{\circ}C$ to $1460^{\circ}C$, while the winder speed was between 100 rpm and 200 rpm. We investigated the physical properties of the D-glass fibers. The average diameters of the glass fibers were measured by optical microscope and FE-SEM. The average diameters of the D-glass fibers were 21.36 um at 100 rpm and 34.06 um at 200 rpm. The mechanical properties of the fibers were confirmed using a UTM(Universal materials testing machine). The average tensile strengths of the D-glass fibers were 467.03 MPa at 100 rpm and 522.60 MPa at 200 rpm.