• Title/Summary/Keyword: Capacitively

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The Fabrication and Properties of Ito Transparent Conducting Film for PDP by the Discharge Plasma Analysis (방전플라즈마 해석을 통한 PDP용 ITO 투명전도막의 제작 및 특성)

  • 곽동주;조문수;박강일;임동건
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.10
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    • pp.902-907
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    • 2003
  • In this paper, the ITO thin film, which is considered as one of the most currently used material for the high performance transparent conducting films for the PDP cell, was made in a parallel-plate, capacitively coupled DC magnetron sputtering system. Some electrical and optical properties of ITO films were investigated and discussed on the basis of glow discharge characteristics. The optimized thin film fabricating conditions of Ar gas pressure and substrate temperature were derived from the Paschen curve and glow discharge characteristics. The maximum transmittance of 89.61 % in the visible region and optical band gap of 3.89 eV and resistivity of 1.67${\times}$10$\^$-3/ $\Omega$-cm were obtained under the conditions of 300 C of substrate temperature and 10∼15 mtorr of pressure, which corresponds nearly to that of Paschen minimum.

듀얼 Freuqency가 인가된 자화된 ICP에서, RF 바이어스 파워가 플라즈마의 밀도에 미치는 영향

  • Kim, Hyeok;Lee, U-Hyeon;Park, Wan-Jae;Hwang, Gi-Ung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.486-486
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    • 2012
  • 반도체 식각 공정에서 이온의 플럭스와 충돌 에너지를 각각 조절하고자 Dual frequency RF source가 사용된다. 듀얼 freuqnecy RF가 인가된 Capacitively coupled plasma (CCP) 의 경우, 기판에 걸린 Low freuqency (LF) RF 소스에 의하여 이온의 에너지를 조절하고, High frequency (HF) 소스를 조절하여 이온의 플럭스를 조절하는 것이 일반적이다. 그러나 LF의 세기가 증가함에 따라서, 플라즈마의 밀도가 오히려 감소하는 문제점이 있었다. 이 경우, 약한 자장을 플라즈마에 걸어줌으로써 밀도가 감소되는 문제를 해결할 수 있다고 알려져 왔다. Inductively coupled plasma (ICP) 에서는 HF를 안테나에 가하여 이온의 플럭스를 조절하고, LF를 기판에 가하여 이온의 충돌 에너지를 조절하는 것이 일반적인데, 위와 동일한 문제가 이 경우에도 발생하는 것을 확인 하였다. CCP와 마찬가지로, 바이어스에 걸린 파워의 세기가 증가함에 따라서 플라즈마의 밀도가 감소하고 전자의 온도가 증가하는 현상을 확인하였다. 또한 이때에도, 약한 자장을 걸어줌으로써 플라즈마의 밀도가 감소하지 않고 유지될 수 있으며, 전자의 온도 또한 유지될 수 있음을 발견하였다.

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Graphene Cleaning by Using Argon Inductively Coupled Plasma

  • Im, Yeong-Dae;Lee, Dae-Yeong;Ra, Chang-Ho;Yu, Won-Jong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.197-197
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    • 2012
  • Device 제작에 사용된 graphene은 일반적인 lithography 공정에서 resist residue에 의한 오염을 피할 수 없으며 이로 인하여 graphene의 pristine한 성질을 잃어버린다. 본 연구에서는 graphene을 저밀도의 argon inductively coupled plasma (Ar-ICP)를 통해 처리함으로서 graphene based back-gated field effect transistor (G-FET)의 특성변화를 유도한 결과에 대해서 보고한다. Argon capacitively coupled plasma (Ar-CCP)은 에 노출된 graphene은 강한 ion bombardment energy로 인하여 쉽게 planar C-C ${\pi}$ bonding (bonding energy: 2.7 eV)이 breaking되어 graphene의 defect이 발생되었다. 하지만 우리의 경우 저밀도의 Ar-ICP가 적용될 때 graphene의 defect이 제한되며 이와 동시에 contamination 만을 제거할 수 있었다. 소자의 전기적 측정 (Gsd-Vbg)을 통하여 contamination으로 인하여 p-doping된 graphene은 pristine 상태로 회복되었으며 mobility도 회복됨이 확인되었다. Ar-ICP를 이용한 graphene cleaning 방법은 저온공정, 대면적 공정, 고속공정을 모두 만족시키며 thermal annealing, electrical current annealing을 대체하여 graphene 기반 소자를 생산함에 있어 쉽고 빠르게 적용할 수 있는 강점이 있다.

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The Properties of Ar RF Plasma Using 1- and 2-dimensional Model (1,2차 모델링을 이용한 Ar RF 플라즈마의 응답 특성)

  • 박용섭;정해덕
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.8
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    • pp.622-628
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    • 2001
  • We developed 1- and 2-dimensional fluid model for the analysis of a capacitively coupled Ar RF(Radio Frequency) glow discharge. This discharge is in pure Ar gas at the pressure 100[mTorr], frequency 13.56[MHz] and voltage amplitude 120[V}. This model is based on the equations of continuity and electron energy conservation coupled with Poison equation. 2-dimensional model is simulated on the condition of GEC(Gaseous Electronic Conference cell). The geometry of the discharge chamber and the electrodes used in the model is cylindrically simmetric; tow cylinders for the electrodes are surrounded by the grounded chamber. It is shown that 1-dimensional model is very useful on the understanding of RF glow discharge property and of the movement of charged particles. 2-dimensional model predicts off-axis maximum structure as in the experiments and has the results in qualitatively and quantitatively good agreement with the experiments. Effects of dc self-bias voltage, guard ring and reactor geometry is discussed.

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Design of a Flexible Planar RFID Tag Antenna with Low Performance Degradation from Nearby Target Objects

  • Choo, Jae-Yul;Ryoo, Jeong-Ki;Choo, Ho-Sung
    • Journal of electromagnetic engineering and science
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    • v.11 no.1
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    • pp.1-4
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    • 2011
  • In this letter, we propose a novel tag antenna that has low performance degradation with nearby dielectric material. We obtained a stable reading performance and a broad matching bandwidth on nearby dielectric materials by employing a T-matching network with thick line width and capacitively slot-loaded arms. We then built the proposed antenna and measured the tag sensitivity to examine the reading characteristics with nearby dielectric materials. The measured results clearly demonstrate stable tag sensitivity with various nearby dielectric materials, such as foam, acrylic-plastic, glass, and ceramic plates. To more closely observe the antenna characteristics with nearby dielectric materials, we also examined the impedance variation and surface current distribution with respect to the dielectric constant of nearby target objects, which ranged from $1{\times}{\varepsilon}_0$ to $16{\times}{\varepsilon}_0$.

Residual stress on nanocrystalline silicon thin films deposited with substrate biasing at low temperature

  • Lee, Hyoung-Cheol;Kim, In-Kyo;Yeom, Geun-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1568-1570
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    • 2009
  • Nanocrystalline silicon thin films were deposited using an internal-type inductively coupled plasma-chemical vapor deposition at room temperature by varying the bias power to the substrate and the structural characteristics of the deposited thin film were investigated. The result showed that the crystalline volume fraction was decreased with the increase of bias power. At the low bias power range of 0~60 W, the compress stress in the deposited thin film was in the range of -34 ~ -77 Mpa which is generally lower than the residual stress observed for the nanocrystalline silicon thin films deposited by capacitively coupled plasma.

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Nanometer Scale Vacuum Lithography using Plasma Polymerization and Plasma Etching (플라즈마 중합과 플라즈마 에칭을 이용한 나노미터 단위의 진공리소그래피)

  • 김성오;박복기;김두석;박진교;육재호;이덕출
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.131-134
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    • 1998
  • This work was carried out to develop a pattern on the nanometer scale using plasma polymerization and plasma etching. This study is also aimed at developing a resist for the nano process and a vacuum lithography process. The thin films of plasma polymerization were fabricated by the plasma po1ymerization of inter-electrode capacitively coupled gas flow system. After delineating the pattern at accelerating voltage of 30[kV]. ranging the dose of 1∼500[${\mu}$C/$\textrm{cm}^2$], the pattern was developed with dry tree and formed by plasma etching. By analysing of the molecule structure using FT-lR, it was confirmed that the thin films of PPMST contains the functional radicals of the MST monomer. The thin films of PPMST had a highly crosslinked structure resulting in a higher molecule weight than the conventional resist.

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Modeling of CCP plasma with H2/N2 gas (H2/N2 가스론 이용한 CCP 플라즈마 모델링)

  • Shon, Chae-Hwa
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.158-159
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    • 2006
  • The resistance-capacitance (RC) delay of signals through interconnection materials becomes a big hurdle for high speed operation of semiconductors which contain multilayer interconnection layers. In order to reduce the RC delay, low-k materials will be used for inter-metal dielectric (IMD) materials. We have developed self-consistent simulation tool that includes neutral-species transport model, based on the relaxation continuum (RCT) model. We present the parametric study of the modeling results of a two-frequency capacitively coupled plasma (2f-CCP) with $N_2/H_2$ gas mixture that is known as promising one for organic low-k materials etching. We include the neutral transport model as well as plasma one in the calculation. The plasma and neutrals are calculated self-consistently by iterating the simulation of both species till a spatiotemporal steady state profile could be obtained.

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