• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.8
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• pp.22-26
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• 2012

This paper introduces a 2.5-Gb/s optical receiver implemented in a standard 1P4M 0.18um CMOS technology for the applications of active optical HDMI cables. The optical receiver consists of a differential transimpedance amplifier(TIA), a five-stage differential limiting amplifier(LA), and an output buffer. The TIA exploits the inverter input configuration with a resistive feedback for low noise and power consumption. It is cascaded by an additional differential amplifier and a DC-balanced buffer to facilitate the following LA design. The LA consists of five gain cells, an output buffer, and an offset cancellation circuit. The proposed optical receiver demonstrates $91dB{\Omega}$ transimpedance gain, 1.55 GHz bandwidth even with the large photodiode capacitance of 320 fF, 16 pA/sqrt(Hz) average noise current spectral density within the bandwidth (corresponding to the optical sensitivity of -21.6 dBm for $10^{-12}$ BER), and 40 mW power dissipation from a single 1.8-V supply. Test chips occupy the area of $1.35{\times}2.46mm^2$ including pads. The optically measured eye-diagrams confirms wide and clear eye-openings for 2.5-Gb/s operations.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.6
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• pp.591-600
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• 2010

In this paper, three kinds of 24 GHz low-power CMOS cross-coupled voltage controlled oscillators are designed and fabricated for a short-range radar applications using TSMC 0.13 ${\mu}m$ CMOS process. The basic CMOS crosscoupled voltage controlled oscillator is designed for oscillating around a center frequency of 24.1 GHz and subthreshold oscillators are developed for low power operation from it. A double resonant circuit is newly applied to the subthreshold oscillator to improve the problem that parasitic capacitance of large transistors in a subthreshold oscillator can push the oscillation frequency toward lower frequencies. The fabricated chips show the phase noise of -101~-103.5 dBc/Hz at 1 MHz offset, the output power of -11.85~-15.33 dBm and the frequency tuning range of 475~852 MHz. In terms of power consumption, the basic oscillator consumes 5.6 mW, while the subthreshold oscillator does 3.3 mW. The subthreshold oscillator with the double resonant circuit shows relatively lower power consumption and improved phase noise performance while maintaining a comparable frequency tuning range. The subthreshold oscillator with double resonances has FOM of -185.2 dBc based on 1 mW DC power reference, which is an about 3 dB improved result compared with the basic oscillator.

• Journal of Satellite, Information and Communications
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• v.10 no.2
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• pp.80-85
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• 2015

In this paper, we present, an indstrial RFID layered microstrip patch antenna is designed using an inset feed method in order to improve recognition rates in a long distance as tags are attached to metal object by improving a problem of feeding power in fabricating metal tags and reducing effects of metallic object. The inset feed shows a distinctive characteristic that has no separation between emitters and feed lines differing from a structure with the conventional inductive coupling feed. This structure makes possible to produce a type that presents a low antenna height and enables impedance coupling for tag chips. Although it shows a difficulty in the impedance coupling due to increases in the parasite capacitance between a ground plane and an emitter in an antenna according to decreases in the height of a tag antenna, it may become a merit in designing the tag antenna because the antenna impedance can be determined as an inductive manner if a shorted structure is used for feeding power. Therefore, in this paper the microstrip patch antenna is designed as a modified type and applies the inset feed in order to reduce effects of metallic objects where the antenna is be attached. Also, the antenna uses a multi-layer structure that includes a metal plate between radiator and ground instead of using a single layer.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.10
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• pp.80-86
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• 2014

A low-noise readout circuit is studied for 2-D capacitive microbolometer focal plane arrays (FPAs). In spite of the merits of the integration method, a simple and effective pixelwise readout circuit without integration is used for input circuit because of a small pixel size and narrow noise bandwidth. To reduce the power consumption and the kT/C noise, which is the dominant noise of the capacitive microbolometer FPAs with small capacitance, a new correlated double sampling (CDS) is used for columnwise circuit. The proposed circuit has been designed using a $0.35-{\mu}m$ 2-poly 4-metal CMOS process for a microbolometer array with a pixel size of $50{\mu}m{\times}50{\mu}m$. The proposed circuit effectively reduces the kT/C noise and the other low-frequency noise of microbolometer, and the noise characteristics of the fabricated chip have been verified by measurements. The rms noise voltage of the proposed circuit is reduced from 30 % to 55 % compared to that of the simple readout input circuit, and the noise equivalent temperature difference (NETD) of the proposed circuit is very low value of 21.5 mK.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.961-966
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• 2003

A Multi-Layer Ceramic (MLC) chip type Band-Pass Filter (BPF) using BiNb$\_$0.975/Sb$\_$0.025/ $O_4$ LTCC (Low Temperature Co-fired Ceramics) and MLC processing is presented. The MLC chip BPF has the benefits of low cost and small size. The BPF consists of coupled stripline resonators and coupling capacitors. The BPF is designed to have an attenuation pole at below the passband for a receiver band of IMT-2000 handset. The computer-aided design technology is applied for analysis of the BPF frequency characteristics. The attenuation pole depends on the coupling between resonators and the coupling capacitance. An equivalent circuit and structure of MLC chip BPF are proposed. The frequency characteristics of the manufactured BPF is well acceptable for IMT-2000 application.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.

• Korean Journal of Optics and Photonics
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• v.22 no.1
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• pp.46-52
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• 2011

A confocal microscope was developed utilizing a scanning sample stage based on a home-built double-compound flexure guide. A scanning sample stage with nano-scale resolution consisted of a double leaf spring based flexure, a displacement amplifying lever, a Piezo-electric Transducer(PZT) actuator and capacitance sensors. The performance of the two-axis stage was analyzed using a commercial finite element method program prior to the implementation. A single line laser was employed as the light source along with the Photo Multiplier Tube(PMT) that served as the detector. The performance of the developed confocal microscope was evaluated with a mouse ear skin imaging test. The designed scanning stage enabled us to build the confocal microscope without the two optical scanning mirror modules that are essential in the conventional laser scanning confocal microscope. The elimination of the scanning mirror modules makes the optical design of the confocal microscope simpler and more compact than the conventional system.

• Korean Journal of Materials Research
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• v.7 no.3
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• pp.175-179
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• 1997

bliniaturization oi microwave circuit components is an important issue with the development in the mobile communication. Capacitors, inductors anti hybrid devices of these are building blocks of electric circuits, and the fabrication of these devices using thin film technology will influence on the miniaturization of electronic devices In this paper, we report the successful fabrication of the inductors, capacitors and LC hybrid devices using a ferroelectric and a ferromagnetic oxide thin iilm. Au, stable at high temperatures in oxidizing ambient, is patterned by lift-off process, and oxide thin films are deposited by ion beam sputtering and chemical vapor deposition. These devices are characterized by a network analyzer in 0.5-15GtIz range We got the inductance of 5nH, capacitance oi 10, 000 pF and resonant frequencies of $10^{6}-10^{9}Hz$.

• Journal of IKEEE
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• v.23 no.1
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• pp.14-21
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• 2019

In this paper, we implemented an on-board miniaturization antenna operating 2.4 GHz using MZR(Mu Zero Resonator). It is must be operating under the constraint that the size of the small terminal PCB should be $78{\times}38{\times}0.8mm^3$ and the size of the system should be $63{\times}38{\times}0.8mm^3$ and the size of the radiating part should be $15{\times}38{\times}0.8mm^3$. The feeding structure uses a CPW structure for stable feeding and a feeding point at the upper left of the system board. A magnetic field coupling structure is used for coupling the feeding part and the antenna. The resonance frequency of the MZR is determined by the series inductance and capacitance of the cell, so the gap between the cells, the length of the cell, the length of the interdigital capacitor, and the spacing between the radiation part and the ground plane are analyzed. The antenna was designed and fabricated using the results. The total size of the antenna including the feed structure is $20.8{\times}9.0{\times}0.8mm^3$, and the electrical length is $0.1664{\lambda}_0{\times}0.072{\lambda}_0{\times}0.0064{\lambda}_0$. The measurement result for 10 dB bandwidth, gain and directivity are 440 MHz(18.3%), 0.4405 dB, and 2.722 dB respectively. It is confirmed that the radiation pattern has omnidirectional characteristics and it can be applied to ultra small terminal antenna.