• Journal of Korea Foundry Society
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• v.23 no.4
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• pp.195-203
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• 2003

Hyper-eutectic Al-Si alloy is used much to automatic parts and material for the electronic parts because of the low coefficient of thermal expansion, superior thermal stability and superior wear resistance. In this work, A390 alloy specimens were fabricated for control of the Si particle size by various processes, such as spray-casting, permanent mold-casting and squeeze-casting. To minimize the effect of microporosity of the specimens, hot extrusion was carried out under equal condition. Each specimens were evaluated tensile properties at room temperature and thermal expansion properties in the range from room temperature to 400$^{\circ}C$. Ultimate tensile strength and elongation of the spray-cast and extruded specimens which have fine and well distributed Si particles were improved greatly compare to the permanent mold-cast and extruded ones. Specimens which have finer Si particles showed higher ultimate tensile strength and elongation than those having large Si particle size, and coefficient of thermal expansion of the specimens increased linearly with Si particle size. In case of the repeated high temperature exposures, thermal expansion properties of the spray-cast and extruded specimens were found to be more stable than those of the others due to the effect of fine and well distributed Si particles.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Polymer(Korea)
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• v.36 no.3
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• pp.281-286
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• 2012

Experimental study was performed regarding the effects of disc-like filler orientation and contents on the coefficient of thermal expansion (CTE) of polypropylene composites using the three dimensional ellipsoids ($a_1$ > $a_2$ > $a_3$) analyzed by two aspect ratios(${\rho}_{\alpha}=a_1/a_3$and ${\rho}_{\beta}=a_1/a_2$). Measured data were compared with the theoretical approaches proposed by Lee et al. Mica and talc were useed as disk-like fillers in the composites. As experimental results, ${\alpha}_{11}/{\alpha}_m$ decreased down to ca. 0.56 with mica content of 20 wt% and the aspect ratios, ${\rho}_{\alpha}=13.5$, ${\rho}_{\beta}=1.8$. However, ${\alpha}_{33}/{\alpha}_m$ increased to more than 1. In the case of talc, ${\alpha}_{11}/{\alpha}_m$ decreased to ca. 0.63 with 20 wt% and ${\rho}_{\alpha}=3.7$, ${\rho}_{\beta}=1.4$. Finally, the longitudinal CTEs (${\alpha}_{11}$) of polypropylene composites decreased as filler contents increased, but normal CTE (${\alpha}_{33}$) increased in the low filler contents like the theory.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Polymer(Korea)
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• v.29 no.5
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• pp.451-456
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• 2005

In the field of designing of nano-fillers of polyimide nanocomposites, the two strategic points are the heat-resistance and compatibility with polyimide, a matrix polymer. In this study, we designed oligo(amic acid) having alkyl side chains and terminal amine groups to satisfy previous requirements and studied the modification of surface of layered silicates. Oligo(amic acid)s were prepared by the reaction of diamine monomers and PMDA and their molecular weight was controlled in about 2000g/mol. After that, acidification and ion exchange reaction led to the high-temperature organophilic layered silicate (OLS). XRD pauerns of OLS showed the more increased gallery spacing by $4{\AA}$ than that of the pristine layered silicate and the initial decomposition temperatures of OLS were in above $280^{\circ}C$. The polyimide nanocomposite films based on heat resistant OLS showed that the OLSs were well dispersed through the matrix and their CTEs showed a decrease of $26\%$ compared with pristine polyimide films.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.3
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• pp.116-126
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• 2021

Diesel particulate filter (DPF) is a typical application field of cordierite (Mg₂Al₄Si₅O₁₈) honeycomb. Green body for DPF honeycomb was extruded using slurry paste and sintered at the temperature range of 980~1450℃. Quantitative crystal phase analysis was carried out by using Rietveld refinement method for powder XRD data. In conjunction with the quantitative Rietveld analysis, SEM-EDS analysis was carried for the crystal phases (indialite, cordierite, cristobalite, alumina, spinel, mullite, pro-enstatite). After removing amorphous phase on the sintered surfaces by chemical etching method, the shape and composition of the crystal phases can be clearly identified by SEM-EDS method. By combining the Rietveld refinement method and SEM-EDS analysis, crystal phase evolution process in DPF cordierite ceramics could be clarified. In addition, the coefficient of thermal expansion (CTE) of the DPF honeycombs were measured and compared with the calculated CTEs based on the quantitative crystal phase analysis results.