• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.3
• /
• pp.89-93
• /
• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Progress in Superconductivity and Cryogenics
• /
• v.17 no.3
• /
• pp.13-17
• /
• 2015

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with delamination problem of multi-layered CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal cycling. The CC tape might also experience cyclic loading due to the energizing scheme (on - off) during operation. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in REBCO CC tapes becomes critical. In this study, transverse tensile tests were conducted under different loading conditions using different size of upper anvils on the GdBCO CC tapes. The mechanical and electromechanical delamination strength behaviors of the CC tapes under transverse tensile loading were examined and a two-parameter Weibull distribution analysis was conducted in statistical aspects. As a result, the CC tape showed similar range of mechanical delamination strength regardless of cross-head speed adopted. On the other hand, cyclic loading might have affected the CC tape in both upper anvil sizes adopted.

• Journal of Environmental Health Sciences
• /
• v.35 no.2
• /
• pp.78-85
• /
• 2009

In this study, the hazard rate of the indoor environment of Children's Educational Facilities in Seoul was conducted, in order to determine how the indoor environments of these facilities, where infants and children spend the most time of their away from home day, can effect their health. The way of measurement and analysis were done according to the Indoor Air Quality Standard Method, and the Risk Assessment was accomplished with several significant ways - Hazard Identification, Exposure Assessment, Dose-response Assessment, Risk Characterization, which are deighed by National Research Council (NRC). On each exposure factors, documentary and questionary research such as Epidemiological study and Toxicological study were conducted. The result of the CTE (Central tendency exposure) of Formaldehyde and Benzene by Monte-Carlo simulation was $6.79{\times}10^{-6}$, $2.50{\times}10^{-7}$ which in the case of Formaldehyde exceeded the permitted standard ($10^{-6}$) of the US EPA. The RME(Reasonable maximum exposure) was $7.31{\times}10^{-5}$, $2.65{\times}10^{-6}$ which did not exceed $10^{-4}$, the maximum permitted standards in the US EPA.

• Progress in Superconductivity and Cryogenics
• /
• v.19 no.2
• /
• pp.25-28
• /
• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.12
• /
• pp.762-767
• /
• 2017

Mullite ($3Al_2O_3{\cdot}2SiO_2$) has emerged as a promising candidate for high-temperature structural materials due to its erosion resistance, chemical and thermal stabilities, relatively low thermal expansion coefficient, excellent thermal shock and creep resistances, and low dielectric constant. However, since the pure mullite sintering temperature is as high as $1,600{\sim}1,700^{\circ}C$, there is an increasing need for a sintering additive capable of improving the strength characteristics while lowering the sintering temperature. Herein we have tried to obtain the optimal sintering additive composition by adding MgO, $Cr_2O_3$, and $Y_2O_3$ to mullite, followed by sintering at $1,325{\sim}1,550^{\circ}C$ for 2 h. With additives of 2 wt% of MgO, 2 wt% of $Cr_2O_3$, 4 wt% of $Y_2O_3$, A density of $3.23g/cm^3$ was obtained for the sintered body at $1,350^{\circ}C$ upon using 2 wt% MgO, 2 wt% $Cr_2O_3$, and 4 wt% $Y_2O_3$ as additives. The three-point flexural strength of that was 275 MPa and the coefficient of thermal expansion (CTE) was $4.15ppm/^{\circ}C$.

• Composites Research
• /
• v.17 no.6
• /
• pp.52-57
• /
• 2004

In this study, mechanical tensile properties of carbon fiber reinforced polymeric (CFRP) composite cycled with thermo-mechanical loading under cryogenic temperature (CT) were measured using cryogenic environmental chamber. Thermo-mechanical tensile cyclic loading (up to 10 times) was applied to graphite/epoxy unidirectional laminate composites far room temperature (RT) to $-50^{\circ}C$, RT to $-100^{\circ}C$ and RT to $-150^{\circ}C$. Results showed that tensile stiffness obviously increased as temperature decreased while the thermo-mechanical cycling has little influence on it. Tensile strength, however, decreased as temperature down to CT while the reduction of strength showed little after CT-cycling. For the analysis of the test results, coefficient of thermal expansion (CTE) of laminate composite specimen at both RT and CT were measured and the interface between fiber and matrix was observed using SEM images.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.7
• /
• pp.745-751
• /
• 2011

This study proposes finite element modeling of dislocation punching at cooling after consolidation in order to calculate the strength of particle-reinforced aluminum composites. The Taylor dislocation model combined with strain gradient plasticity around the reinforced particle is adopted to take into account the size-dependency of different volume fractions of the particle. The strain gradients were obtained from the equivalent plastic strain calculated during the cooling of the spherical unit cell, when the dislocation punching due to CTE (Coefficient of Thermal Expansion) mismatch is activated. The enhanced yield stress was observed by including the strain gradients, in an average sense, over the punched zone. The tensile strength of the SiCp/Al 356-T6 composite was predicted through the finite element analysis of an axisymmetric unit cell for various sizes and volume fractions of the particle. The predicted strengths were found to be in good agreement with the experimental data. Further, the particle-size dependency was clearly established.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.37 no.5
• /
• pp.657-664
• /
• 2013

By using shear mixing and ultrasonication, we fabricated specimens of well-dispersed multi-walled carbon nanotube composites. To confirm the proper dispersion of the filler, we used scanning electron microscopy images for quantitative evaluation and a tensile test for qualitative assessment. Furthermore, the coefficients of thermal expansion of several specimens having different filler contents were calculated from the measured thermal strains and temperatures of the specimens. Based on the microscopy images of the well-dispersed fillers and the small deviations in the measurements of the tensile strength and stiffness, we confirmed the proper dispersion of nanotubes in the epoxy. As the filler contents were increased, the values of tensile strength increased from 58.33 to 68.81 MPa, and those of stiffness increased from 2.93 to 3.27 GPa. At the same time, the coefficients of thermal expansion decreased. This implies better thermal stability of the specimen.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.73-82
• /
• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.04a
• /
• pp.43-55
• /
• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.