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T. Yoon and T. S. Kim, "Thermo-Mechanical Reliability of TSV based 3D-IC (in Korean)", J. Microelectron. Packag. Soc., 24(1), 35 (2017).
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A. V. Mazur and M. M. Gasik, "Thermal Expansion of Silicon at Temperatures up to 1100 C", Journal of materials processing technology, 209(2), 723 (2009).
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S. Lee, J. H. Kim, Y. S. Kim, T. Ohba, and T. S. Kim, "Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers", IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(2), 296 (2019).
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S. Gao, Z. Dong, R. Kang, B. Zhang, and D. Guo, "Warping of Silicon Wafers Subjected to Back-Grinding Process", Precision Engineering, 40, 87 (2015).
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H. Shimizu, T. Watanabe, and Y. Kakui, "Warpage of Czochralski- Grown Silicon Wafers as Affected by Oxygen Precipitation", Japanese journal of applied physics, 24(7R), 815 (1985).
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S. Cho and S. E. Kim, "Effect of Si Grinding on Electrical Properties of Sputtered Tin Oxide Thin Films. (in Korean)", J. Microelectron. Packag. Soc., 25(2), 49 (2018).
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Y. L. Dong and B. Pan, "A Review of Speckle Pattern Fabrication and Assessment for Digital Image Correlation", Experimental Mechanics, 57(8), 1161 (2017).
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T. I. Lee, M. S. Kim, and T. S. Kim, "Contact-Free Thermal Expansion Measurement of Very Soft Elastomers using Digital Image Correlation", Polymer Testing, 51, 181 (2016).
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T. C. Chiu and E. Y. Yeh, "Warpage Simulation for the Reconstituted Wafer used in Fan-Out Wafer Level Packaging", Microelectronics Reliability, 80, 14 (2018).
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J. H. Lau, M. Li, D. Tian, N. Fan, E. Kuah, W. Kai, M. Li, J. Hao, Y. M. Cheung, Z. Li, K. H. Tan, R. Beica, T. Taylor, C. T. Ko, H. Yang, Y. H. Chen, S. P. Lim, N. C. Lee, J. Ran, C. Xi, K. S. Wee, and Q. Yong, "Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging", IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(10), 1729 (2017).
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L. Shi, L. Chen, D. W. Zhang, E. Liu, Q. Liu, and C. I. Chen, "Improvement of Thermo-Mechanical Reliability of Wafer- Level Chip Scale Packaging", Journal of Electronic Packaging, 140(1), 011002 (2018).
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P. Chen, Z. Ji, Y. Liu, C. Wu, N. Ye, and H. Takiar, "Warpage Prediction Methodology of Extremely Thin Package", Proc. 67th Electronic Components and Technology Conference (ECTC), 2080, IEEE (2017).
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C. Kim, T. I. Lee, M. S. Kim, and T. S. Kim, "Mechanism of Warpage Orientation Rotation due to Viscoelastic Polymer Substrates During Thermal Processing", Microelectronics Reliability, 73, 136 (2017).
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C. Kim, T. I. Lee, M. S. Kim, and T. S. Kim, "Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates", Polymers, 7(6), 985 (2014).
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P. Y. Lin and S. Lee, "Warpage Modeling of Ultra-Thin Packages Based on Chemical Shrinkage and Cure-Dependent Viscoelasticity of Molded Underfill", IEEE Transactions on Device and Materials Reliability, 20(1), 67 (2019).
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J. B. Pyo, T. I. Lee, C. Kim, M. S. Kim, and T. S. Kim, "Prediction of Time-Dependent Swelling of Flexible Polymer Substrates Using Hygro-Mechanical Finite Element Simulations", Soft matter, 12(18), 4135 (2016).
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T. I. Lee, C. Kim, J. B. Pyo, M. S. Kim and T. S. Kim, "Effect of Anisotropic Thermo-Elastic Properties of Woven-Fabric Laminates on Diagonal Warpage of Thin Package Substrates", Composites Structures, 176, 973 (2017).
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Y. Okada and Y. Tokumaru, "Precise Determination of Lattice Parameter and Thermal Expansion Coefficient of Silicon Between 300 and 1500 K", Journal of Applied Physics, 56, 314 (1984).
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