• Electronics and Telecommunications Trends
• /
• v.35 no.2
• /
• pp.89-103
• /
• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
• /
• v.35 no.2
• /
• pp.120-136
• /
• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• Electronics and Telecommunications Trends
• /
• v.35 no.2
• /
• pp.104-119
• /
• 2020

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

• International Journal of High-Rise Buildings
• /
• v.1 no.1
• /
• pp.53-59
• /
• 2012

With the rise in CPU power and the generalization and popularity of computers, engineering practice also changed from hand calculations to 3D computer models, from elastic linear analysis to 3D nonlinear static analysis and 3D nonlinear transient dynamic analysis. Thanks to holistic design approach and current trends in freeform and contemporary architecture, BIM concept is no longer a dream but also a reality. BIM is not just providing a media for better co-ordination but also to shorten the round-the-clock time in updating models to match with other professional disciplines. With the parametric modeling tools, structural information is also linked with BIM system and quickly produces analysis and design results from checking to fabrication. This paper presents a new framework which not just linked the BIM system by means of parametric mean but also create and produce connection FE model and fabrication drawings etc. This framework will facilitate structural engineers to produce well co-ordinate, optimized and safe structures.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.33A no.3
• /
• pp.176-186
• /
• 1996

As the density of VLSI increases, the conventional logic testing is not sufficient to completely detect the new faults generated in design and fabrication processing. Recently, IDDQ testing becomes very attractive since it can overcome the limitations of logic testing. In this paper, G-ATPG (gyeongsang automatic test pattern genrator) is designed which is able to be adapted to IDDQ testing for combinational CMOS VLSI. In G-ATPG, stuck-at, transistor stuck-on, GOS (gate oxide short)or bridging faults which can occur within priitive gate or XOR is modelled to primitive fault patterns and the concept of a fault-sensitizing gate is used to simulate only gates that need to sensitize the faulty gate because IDDQ test does not require the process of fault propagation. Primitive fault patterns are graded to reduce CPU time for the gates in a circuit whenever a test pattern is generated. the simulation results in bench mark circuits show that CPU time and fault coverage are enhanced more than the conventional ATPG using IDDQ test.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.33 no.11A
• /
• pp.1117-1123
• /
• 2008

Applications for mobile multimedia are testing the performance limits of present day CPUs with variety. However, hardwired solutions are inflexible and expensive to develop. CPUs with flexibility have limitation of performance. So, the requirement for both ASIC-like performance and CPU-like flexibility has led to reconfigurable processor. Mobile systems require low power and high performance concurrently. In this paper, we propose reconfigurable processor for mobile multimedia with high energy efficiency. Reconfigurable processor with 121MOPS/mW is developed by 130nm CMOS technology. And the processor was simulated for energy efficiency with 539MOPS/mW by 90nm CMOS technology and effective use of instructions. And we tested its applications for multimedia field. We tested the case of inverse MDCT for MP3 and DF for MPEG4 and ME for H.264.

• Proceedings of the IEEK Conference
• /
• 2006.06a
• /
• pp.671-672
• /
• 2006

Recently Communication with using IrDA is bing used in various fields. In this paper I designed a receiver by fabricating hardware that used to be fabricated through software, so anyone who don't have knowledge on IrDA can receive Ir Signal easily. This receiver can communicate with CPU through 8 bit data and 3 bit address. Also this receiver can use user-needed CLK because this receiver embodied 16 bit CLK Prescaler.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.17 no.2 s.105
• /
• pp.198-206
• /
• 2006

The GFSK Transceiver of 400 MHz ISM band for data communication is designed and fabricated. To reduce the occupied bandwidth of transmitted signal, the GFSK modulation is selected. The measured results of fabricated transceiver show the data rate of 2,400 bps at 8.5 kHz bandwidth, frequency deviation of less than ${\pm}3\;kHz$, sensitivity of -107 dBm at SINAD of 20 dB, BER of less than $1.8{\times}10^{-3}$ at -110 dBm input power. The fabricated transceiver is satisfied with the regulation of radio wave and has the good performance.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
• /
• 2004.04a
• /
• pp.11-15
• /
• 2004

This paper deals with EMC filter for a personal computer( PC). A PC contains many sources of noise inside and out, with many connected cables. High noise levels are also emitted from the PC became of high-speed signals. So radiated noise from the computer body may sometimes cause problems. Therefore, we design and fabricate an electromagnetic compatibility (EMC) filter for PC, which is composed of feed-through capacitors and ferrite beads with high permeability. Through extensive test, the proposed EMC filter is shown to have excellent differential-mode and common-mode noises filtering characteristics above 30 dB in the frequency band from 10 MHz to 1.5 GHz. The immunity characteristics are improved more than 10 to 30 dB over the frequency band from DC to 1.8 GHz

• Journal of Navigation and Port Research
• /
• v.28 no.8
• /
• pp.715-719
• /
• 2004

This paper deals with EMC filter for a personal computer(PC). A PC contains many sources of noise inside and out, with many connected cables. High noise levels are also emitted from the PC because of high-speed signals. So radiated noise from the computer body may sometimes cause problems. Therefore, we design and fabricate an electromagnetic compatibility (EMC) filter for PC, which is composed of feed-through capacitors and ferrite beads with high permeability. Through extensive test, the proposed EMC filter is shown to have excellent differential-mode and common-mode noises filtering characteristics above 30 dB in the frequency band from 10 MHz to 1.5 GHz. The immunity characteristics are improved more than 10 to 30 dB over the frequency band from DC to 1.8 GHz.