• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2006.06b
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• pp.365-372
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• 2006

In this paper, the possibility of statistical modeling from the pulp and peroxide bleaching condition variables to predict optical properties of a bleached chemimechanical pulp used in a newsprint paper machine at Mazandaran Wood and Paper Industries Company (MWPI) was studied. Due to the variations in the opacity and the brightness of the bleached pulp at MWPI and to tackle this problem, it was decided to study the possibility of modeling the bleaching process. To achieve this purpose, Multi-variate Regression Analysis was used for model building and it was found that there is a relationship between independent variables and pulp brightness as well as pulp opacity, consequently, two models were constructed. Then, model validation was carried out using new data set in the bleaching plant at MWPI to test model predictive ability and its performance.

• Korean Journal of Materials Research
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• v.18 no.6
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• pp.334-338
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• 2008

The purpose of this study is to characterize various electrolytes on electrochemical mechanical planarization (ECMP). The ECMP system was modified from conventional CMP system to measure the potentiodynamic curve and removal rate of Cu. The potentiodynamic curves were measured in static and dynamic states in investigated electrolytes using a potentiostat for the evaluation of the polishing behavior on ECMP. KOH (alkaline) and $NaNO_3$ (salt) were selected as electrolytes which have high conductivity. In static and dynamic states, the corrosion potential decreased and the corrosion current increased as a function of the electrolyte concentration. But, the electrochemical reaction was prevented by mechanical polishing effect in the dynamic state. The static etch and removal rate were measured as functions of concentration and applied voltage. When $NaNO_3$ was used, the dissolution was much faster than that of KOH. It was concluded that the removal rate was strongly depended on electrochemical dissolution. The removal rate increased up to 350 nm/min in $NaNO_3$ based electrolyte.

• Journal of Pharmaceutical Investigation
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• v.20 no.2
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• pp.89-95
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• 1990

Ethylcellulose-PEG 4000 film coated on core tablets was investigated as a potential drug delivery system for the controlled release of chlorpheniramine maleate (CPM). The kinetic analysis of the release data indicated that CPM release followed a diffusion-controlled model, where the quantity released per unit area is proportional to the square root of time. The effect of the film composition, CPM concentration, plasticizer concentration and CPM solubility on the release characteristics were examined. The release rate constant increased as CPM concentration increased. It also increased as the PEG 4000 content in the film increased above 10%(w/w), however, it decreased as the PEG 4000 content increased in the concentration range below 10%(w/w). The release rate constant was not affected by the coated weight on the core tablet. The film-coated tablets which contain CPM only in the coated film layer seemed to be a potential oral drug delivery system for the controlled release of CPM.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1278-1282
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• 2004

수열처리법으로 nano-sized $CeO_2$ 입자를 $Al_3O_3$ 입자의 표면에 균일하게 코팅하여 $AL_2O_3/O_2$ composite 연마 입자를 제조하었다. 제조된 $Al_2O_3\CeO_2$ composite 입자의 뭍성을 TEM, XRD, zeta potential analyzer 및 particle size analyzer로 측징하였다. $Al_2O_3/CeO_2$ composite 입자와 구성된 슬러리와 비교 시료로서 $Al_2O_3$와 $CeO_2$ 입자를 혼합한 슬러리를 사용하여 thermal oxide film에 대한 연마특성을 평가하였다. 연마슬러리에 포함된 $A1_2O_3/CeO_2$ composite 입자와 $Al_2O_3$와 $CeO_2$ 혼합입자에서 나노 크기의 세리아 입자가 sub-micron 크기의 알루미나 입자의 표면에 균일하게 코팅되므로서 $Al_2O_3$ 단일 성분의 슬러리에 비해 removal rate(RR)는 106 nm/min, WIWNU는 $8\sim9%$, roughness는 $2.6{\AA}$의 향상된 연마 특성을 나타내었다. 알루미나 입자의 불규칙한 형상 때문에 $Al_2O3/CeO_2$ composite 슬러리와 $Al_2O_3$ 와 $CeO_2$ 혼합슬러리의 연마 특성이 비슷한 수준을 나타내었다.

• Tribology and Lubricants
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• v.33 no.5
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• pp.228-233
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• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• Korean Journal of Food Science and Technology
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• v.27 no.5
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• pp.724-728
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• 1995

Chemical compositions of dried Auricularia polytricha mushroom were analyzed when the dried mushroom were soaked in distilled water at different soaking condition. Physicochemical properties of soaked mushroom were investigated. Compositions of chemical components were 12.6% crude protein, 2.1% crude fat, 6.7% crude fiber and 6.2% ash. The contents of Ca, K, Mg were higher than those of other minerals in the sample, but Mn and Ni were of little quantities. The major amino acids of the sample were found to be aspartic and glutamic acid. The increase in the soaking time and temperature increased the ratio of water uptake, amount of water soluble solid, browning and pH value in the soak water. Ribonucleotide contents of the sample after soaking decreased depending on soaking time and temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.53-53
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• 2007

반도체 소자의 고집적화, 미세화 화로 인해 반도체의 동작속도를 증가시키기 위하여 Cu를 이용한 금속배선이 주목받게 되었으나, 높은 압력으로 인한 보은 Cu 영역에서 과잉 디슁 현상과 에로젼을 유도하고 반도체 웨이퍼위의 low-k 물질에 손상을 줌에 따라 메탈라인 브리징과 단락을 초래할 있어, Cu의 단락인 islands를 남김으로서 표면 결항을 제거하지 못한다는 단점을 가지고 있었다. 그래서 이러한 문제점을 해결하기 위하여 기존의 CMP에 전기화학을 결합시킴으로서 낮은 하력에서의 Cu평탄화를 달성할 수 있는 ECMP (electrochemical mechanical polishing)기술이 필요하게 되었다. 따라서 본 논문에서는 전기화학적 기계적 연마(ECMP)작용을 위해, I-V 특성 곡선을 이용하여 패시베이션 막의 active, passive, transient, trans-passive영역의 전기화학적 특성을 비교 분석하였으며, Cu막의 표면 형상을 알아보기 위해 scanning electron microscopy (SEM) 측정과 energy dispersive spectroscopy (EDS)와 X-ray Diffraction (XRD) 분석을 통해 금속 화학적 조성을 조사하였다.

• Journal of Advanced Navigation Technology
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• v.14 no.6
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• pp.882-889
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• 2010

The development of network technology has made rapid growth for online gaming industry on the Internet. Recently, game players have been wanting for a free migration on the game character for game player managed by online game servers of different types. Existing research on the acceptance of the game players demands have suggested migration model of the game character. However, the game Character Migration Process between the game server of different types migration is focused only, and safety issue that is necessary in an online transaction is overlooked. Therefore, ensure the safety of transactions information and when a dispute arises is necessary countermeasures. In this paper, Secure game Character Migration System (SCMP) using dual signature method when migrating game characters between the game servers of different types based on existing research is propose and looks to examine the safety.

• Geophysics and Geophysical Exploration
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• v.11 no.3
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• pp.242-249
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• 2008

Recently, AVO analysis has been widely used in oil exploration with seismic subsurface section as a direct indicator of the existence of the gas. In the case of the deep reservoirs like the gas reservoirs in the East-sea, it is often difficult to observe AVO responses in CMP gathers even though the bright spots are shown in the stacked section. Because the reservoir becomes more consolidated as its depth deepens, P-wave velocity does not decrease significantly when the pore fluid is replaced by the gas. Thus the difference in Poisson's ratio, which is a key factor for AVO response, between the reservoir and the layer above it does not increase significantly. In this study, we analyzed the effects of Poisson's ratio difference on AVO response with a variety of Poisson's ratios for the upper and lower layers. The results show that, as the difference in Poisson's ratio between the upper and lower layers decreases, the change in the reflection amplitude with incidence angle decreases and AVO responses become insignificant. To consider the limitation of AVO responses shown in the gas reservoir in East-sea, the velocity model was made by simulation Gorae V structure with seismic data and well logs. The results of comparing AVO responses observed from the synthetic data with theoretical AVO responses calculated by using material properties show that the amount of the change in reflection amplitude with increasing incident angle is very small when the difference in Poisson's ratio between the upper and lower layers is small. In addition, the characteristics of AVO responses were concealed by noise or amplitude distortion arisen during preprocessing. To overcome such limitations of AVO analysis of the data from deep reservoirs, we need to acquire precisely reflection amplltudes In data acquisition stage and use processing tools which preserve reflection amplitude in data processing stage.