The Effect of Electrolytes on Polshing Behavior in Cu ECMP
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Kwon, Tae-Young
(Department of Materials Engineering, Hanyang University)
Kim, In-Kwon (Department of Materials Engineering, Hanyang University) Kim, Tae-Gon (Department of Materials Engineering, Hanyang University) Cho, Byung-Gwun (Department of Bio-nano Technology, Hanyang University) Park, Jin-Goo (Department of Materials Engineering, Hanyang University) |
1 | L. Economikos, X. Wang, X. Sakamoto, P. Ong, M. Naujok, R. Knarr, L. Chen, Y. Moon, S. Neo, J. Salfelder, A. Duboust, A. Manens, W. Lu, S. Shrauti, F. Liu, S. Tsai, and W. Swart, Proceedings of the IEEE 2004 International Interconnect Technology Conference, p.233 (2004) |
2 | Y. J. Oh, G. S. Park, and C. H. Chung, J. Electrochem. Soc., 153(7), G617 (2006) DOI ScienceOn |
3 | S. C. Chang, J. M. Shieh, C. C. Huang, B. T. Dai, and M. S. Feng, Jpn. J. Appl. Phys., 41, 7332 (2002) DOI |
4 | J. Pallinti, S. Lakshminarayanan, W. Barth, P. Wright, M. Lu, S Reder, L. Kwak, W. Catabay, D. Wang, and F. Ho, Proceedings of the IEEE 2003 International Interconnect Technology Conference, p.83 (2003) |
5 | P. C. Goonetilleke, and D. Roy, Materials Chemistry and Physics, 94(2), 388 (2005) DOI ScienceOn |
6 | S. J. Lee, Y. M. Lee, and M. F. Du, J. Master. Process. Tech., 140(1), 280 (2003) DOI ScienceOn |
7 | J. G. Becerra, R. C. Salvarezza, and A. J. Arvia, Electrochimica Acta, 33(5), 613 (1988) DOI ScienceOn |
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