• The Journal of the Korea institute of electronic communication sciences
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• v.3 no.2
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• pp.79-85
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• 2008

It is important to consider the life of battery and low power operation for various wireless communications. Thus, Analog current-mode signal processing with SI circuit has been taken notice of in designing the LSI for wireless communications. However, in current mode signal processsing, current memory circuit has a problem called clock-feedthrough. In this paper, we examine the connection of CMOS switch that is the common solution of clock-feedthrough and calculate the relation of width between CMOS switch for design methodology for improvement of current memory. As a result of simulation, when the width of memory MOS is 20um, ratio of input current and bias current is 0.3, the width relation in CMOS switch is obtained with $W_{Mp}=5.62W_{Mn}+1.6$, for the nMOS width of 2~6um in CMOS switch. And from the same simulation condition, it is obtained with $W_{Mp}=2.05W_{Mn}+23$ for the nMOS width of 6~10um in CMOS switch. Then the defined width relation of MOS transistor will be useful guidance in design for improvement of current memory.

• Journal of IKEEE
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• v.12 no.4
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• pp.211-216
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• 2008

This paper proposes an 8${\times}$8 bit parallel multiplier using MOS current-mode logic (MCML) circuit for low power consumption. The proposed circuit has a structure of low-power MOS current-mode logic circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to PMOS transistor to minimize the leakage current. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/50. The designed multiplier is achieved to reduce the power consumption by 10.5% and the power-delay-product by 11.6% compared with the conventional MOS current-model logic circuit. This circuit is designed with Samsung 0.35 ${\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.159-165
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• 2016

Recently, active efforts are being made for future Si CMOS technology by various researches on emerging devices and materials. Capability of low power consumption becomes increasingly important criterion for advanced logic devices in extending the Si CMOS. In this work, a junctionless field-effect transistor (JLFET) with ultra-thin poly-Si (UTP) channel is designed aiming the sub-10-nm technology for low-power (LP) applications. A comparative study by device simulations has been performed for the devices with crystalline and polycrystalline Si channels, respectively, in order to demonstrate that the difference in their performances becomes smaller and eventually disappears as the 10-nm regime is reached. The UTP JLFET would be one of the strongest candidates for advanced logic technology, with various virtues of high-speed operation, low power consumption, and low-thermal-budget process integration.

• Journal of electromagnetic engineering and science
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• v.14 no.2
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• pp.68-73
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• 2014

A linear stacked field-effect transistor (FET) power amplifier (PA) is implemented using a $0.18-{\mu}m$ silicon-on-insulator CMOS process for W-CDMA handset applications. Phase distortion by the nonlinear gate-source capacitance ($C_{gs}$) of the common-source transistor, which is one of the major nonlinear sources for intermodulation distortion, is compensated by employing a PMOS linearizer with improved AM-PM. The linearizer is used at the gate of the driver-stage instead of main-stage transistor, thereby avoiding excessive capacitance loading while compensating the AM-PM distortions of both stages. The fabricated 836.5 MHz linear PA module shows an adjacent channel leakage ratio better than -40 dBc up to the rated linear output power of 27.1 dBm, and power-added efficiency of 45.6% at 27.1 dBm without digital pre-distortion.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.199-200
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• 2005

In this paper, the electrical characteristics and hot-carrier induced electrical performance degradations of high-voltage LDMOSFET fabricated by the existing CMOS technology were investigated. Different from the low voltage CMOS device, the only specific on-resistance was degraded due to hot-carrier stressing in LDMOS transistor. However, other electrical parameters such as threshold voltage, transconductance, and saturated drain current were not degraded after stressing. The amount of on-resistance degradation of LDMOS transistor that was implanted n-well with $1.0\times10^{13}/cm^2$ was approximately 1.6 times more than that of LDMOS transistor implanted n-well with $1.0\times10^{12}/cm^2$. Similar to low voltage CMOS device, the peak on-resistance degradation in LDMOS device was observed at gate voltage of 2.2V while the drain applied voltage was 50V. It means that the maximum impact ionization at the drain junction occurs at the gate voltage of 2.2V applying the drain voltage of 50V.

• Journal of IKEEE
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• v.23 no.2
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• pp.722-726
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• 2019

In this paper, we propose a low drop-out (LDO) regulator with improved power-supply rejection (PSR) characteristics in the high frequency region. In particular, an NMOS transistor with a high output resistance is added as a compensation circuit to offset the high frequency noise passing through the finite output resistance of the PMOS power switch. The elimination of power supply noise by the compensating transistor was explained analytically and presented as the direction for further improvement. The circuit was fabricated in a $0.35-{\mu}m$ standard CMOS process and Specter simulations were carried out to confirm the PSR improvement of 26 dB compared to the conventional LDO regulator at 10 MHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.54-59
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• 2008

A highly accurate wide swing BiCMOS cascode current mirror is proposed. It uses the base-current compensated BJT current mirror. It increases both output impedance and output voltage range by using the npn-NMOS cascode instead of the NMOS-NMOS cascode. The npn transistor copies the input current and the NMOS transistor increases the output impedance for the accurate current mirroring. The proposed current mirror achieves highly constant current for wide output voltage range. Simulation results were verified with measurements performed on a fabricated chip using a 5/16V 0.5um BCD process. It has only $-2.5%{\sim}1.0%$ current error for $0.3V{\sim}16V$ output voltage range.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.12
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• pp.2273-2277
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• 2010

In this paper a 2.4GHz CMOS colpitts type microwave oscillator was designed and fabricated using H-spice and Cadence Spetre. There are 140MHz difference between the oscillation frequency and the resonance frequency of a tank circuit of the designed oscillator. The difference is seemed to be due to the parasitic component of the transistor. The inductors used in this design are the spiral inductors proposed in other papers. Cascode current source was used as a bias circuit of a oscillator and the output transistor of the current source is used as the oscillation transistor. A common drain buffer amplifier was used at the output of the oscillator. The measured oscillation frequency and output power of the oscillator are 2.173GHz and -5.53dBm.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.139-144
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• 2003

We report the results of extensive mixed mode simulations and theoretical analysis to quantify the contribution of the edge direct tunneling (EDT) current on the total gate leakage current of 80nm NMOSFET with SiO2 gate dielectric. It is shown that EDT has a profound impact on basic analog circuit building blocks such as sample-hold (S/H) circuit and the current mirror circuit. A transistor design methodology with zero gate-source/drain overlap is proposed to mitigate the EDT effect. This results in lower voltage droop in S/H application and better current matching in current mirror application. It is demonstrated that decreasing the overlap length also improves the basic analog circuit performance metrics of the transistor. The transistor with zero gate-source/drain overlap, results in better transconductance, input resistance, output resistance, intrinsic gain and unity gain transition frequency.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.3A
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• pp.185-191
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• 2003

In this paper, we propose two CMOS composite transistors with an improved operating region by reducing the threshold voltage. The proposed composite transistorⅠand transistor Ⅱ employ a P-type folded composite transistor and a composite diode in order to decrease the threshold voltage, respectively. The limitation of the operating region of these transistors by current source is described. All circuits are simulated by Hsipice using 0.25㎛ n-well process with 2.5V supply voltage.