• Electronics and Telecommunications Trends
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• v.10 no.1 s.35
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• pp.1-17
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• 1995

본 연구에서는 아날로그 CMOS IC 제조를 위한 CMOS 소자기술 및 수동소자 기술인, 다결정실리콘 저항과 다결정실리콘(I)/산화막/다결정실리콘(II) 구조를 가진 커패시터의 공정기술을 개발하였다. 아날로그 CMOS 공정기술은 디지털 CMOS 공정에서 다결정실리콘 저항과 커패시터 공정이 추가됨으로씨 발생할 수 있는 CMOS 소자특성의 변화를 최소화하는 데 중점을 두어 개발하였다. 최종적으로 개발된 $1.2\mum$ 아날로그 CMOS 공정을 이용하여 10 비트 ADC 및 DACIC를 제작한 후 정상적인 동작을 확인함으로써, $1.2\mum$ 아날로그 CMOS 공정에 의한 아날로그 IC 제작의 응용 가능성을 검증하였다. 개발된 $1.2\mum$ 아날로그 CMOS 공정은 향후 $0.8\mum$ 아날로그 CMOS IC 개발에 크게 기여할 것으로 기대된다.

• Journal of IKEEE
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• v.23 no.1
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• pp.326-329
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• 2019

Gallium nitride(GaN) has been a superior candidate for the next generation power electronics. As GaN-on-Si substrate technology is mature, there has been new demand for monolithic integration of GaN technology with Si CMOS devices. In this work, (110)Si CMOS process was developed and the fabricated devices were evaluated in order to confirm the feasibility of utilizing domestic foundry facility for monolithic integration of Si CMOS and GaN power devices.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.1
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• pp.62-68
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• 1989

In this paper, Analog/Digital BCDMOS technology that the bipolar devices for driver applications CMOS devices for logic applications, and DMOS devices for high voltage applications is pressented. An optimized poly-gate p-well CMOS process is chosen to fabricate the BCDMOS, and the basic concepts to desigh these devices are to improve the characteristics of bipolar, CMOS & DMOS with simple process technology. As the results, $h_{FE}$ value is 320 (Ib-$10{\mu}A$ for bipolar npn transistor, and there is no short channel effects for CMOS devices which have Leff to $1.25{\mu}m$ and $1.35{\mu}m$ for n-channel and p-channel, respectively. Finally, breakdown voltage is obtained higher than 115V for DMOS device.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.14 no.3
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• pp.189-196
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• 1989

In this paper, BICMOS gate array technology that has CMOS devices for logic applications and bipolar devices for driver applications is presented. An optimized poly gate p-well CMOS process is chosen to fabricate the BICMOS gate array system and the basic concepts to design these devices are to improve the characteristics of bipolar & CMOS device with simple process technology. As the results hFE value is 120(Ic=1mA) for transistor, and there is no short channel effects for CMOS devices which have Leff to 1.25um and 1.35um for n-channel, respectively, 0.8nx gate delay time of 41 stage ring oscillators is obtained.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.788-791
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• 2010

We design 64-bit ROM IP for RFID tag chips using printed CMOS non-volatile memory IP design technology for a printed CMOS process. The proposed 64-bit ROM circuit is using ETRI's $0.8{\mu}m$ CMOS porocess, and is expected to reduce process complexity and cost of RFID tag chips compared to that using a conventional silicon fabrication based on a complex lithography process because the poly layer in a gate terminal is using printing technology of imprint process. And a BL precharge circuit and a BL sense amplifier is not required for the designed cell circuit since it is composed of a transmission gate instead of an NMOS transistor of the conventional ROM circuit. Therefore an output datum is only driven by a DOUT buffer circuit. The Operation current and layout area of the designed ROM of 64 bits with an array of 8 rows and 8 columns using $0.8{\mu}m$ ROM process is $9.86{\mu}A$ and $379.6{\times}418.7{\mu}m^2$.

• Journal of IKEEE
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• v.4 no.2 s.7
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• pp.202-211
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• 2000

Utilizing the circuit simulator SPICE, we designed a 1.9GHz CMOS up-conversion mixer and explained in detail the simulation procedures including device modeling for the circuit design. Since the measured characteristics of the chip fabricated using the $0.5{\mu}m$ standard CMOS process had shown a big deviation from the characteristics expected by the original simulations, we tried to figure out the proper reasons for the discrepancies. Simulations considering the discovered problems in the original simulations have shown the validity of the simulation method tried for the design. We have shown that the utilized standard CMOS process can be used for the implementation of the chip characteristics similar to those of the equivalent chip fabricated using the GaAs MESFET process.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.6
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• pp.1117-1122
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• 2009

In this work, temperature sensor and control circuit for measuring temperature are proposed. The proposed circuit can be fabricated without additional CMOS fabrication process and the output of proposed circuit is digital value. The supply voltage is 5volts and the circuit is designed by using 0.5${\mu}m$ CMOS process. The circuit for measuring temperature consists of PWM control circuit, VCO, counter and register. consisted The frequency of PWM control circuit is 23kHz and the frequency of VCO is 416kHz, 1MHz and 2MHz, respectively. The circuit operation is analyzed by using SPICE.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.4A
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• pp.458-465
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• 2004

To reaffirm the use of a mainstream CMOS process for designing passive-like attenuator structures, a linearly controlled variable attenuator is realized with 0.35${\mu}{\textrm}{m}$ 2-poly 4-metal CMOS process. It uses the П configuration for large attenuation range and suitable matching property. Compared to conventional passive-like CMOS attenuators, it is demonstrated that this work advances the frequency band from MHz to ㎓ (DC- l㎓), and reduces the size to 700${\mu}{\textrm}{m}$${\times}$300${\mu}{\textrm}{m}$.. Both simulation results and test results are provided. They show the improved linear relation between attenuation and control voltage. It is very useful in CDMA or GSM band, which uses under 1㎓ frequency band. An alternative topology, Bridged-T configuration, is proposed to get over the limit of applications by elevating operation bandwidth. The proposed topology covers over DC-2㎓ frequency band, which means that the proposed architecture can cover the tripleband (800MHz CDMA/GSM, 1.5㎓ GPS, 1.9㎓z PCS system) in applications as well. The simulation results are provided.

• Electronics and Telecommunications Trends
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• v.23 no.6
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• pp.81-91
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• 2008

CMOS 공정의 가속적인 스케일링에 의해 CMOS 기술은 종래의 마이크론기술에서 나노기술로 변해가고 있다. 이러한 반도체 소자 및 제작기술에 따른 온도와 공정의 변화에 매우 민감한 부분인 아날로그 회로는 설계 초기단계에서 중요한 요소들(이득, 누설 전류, 잡음 및 부정합 등)을 재검토할 필요가 있다. 또한, 나노 CMOS 공정을 사용한 1.0 V 이하의 저전압 동작에서는 아날로그 신호의 동적영역 확보가 어렵고 잡음이 증가하므로 새로운 패러다임을 적용한 혁신적인 아날로그 회로기술 개발이 필요한 실정이다. 이에 따라, 본 고에서는 그린기술(green technology)의 한 요소로서, 나노 CMOS 공정기술을 이용한 1.0 V 이하 전원전압의 저전력 아날로그 회로기술 동향과 관련 특허동향에 대해서 살펴보고자 한다.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.12
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• pp.125-130
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• 2004

The characteristics of on-chip spiral rectangular inductors in CMOS process are investigated through the simulation and experiment. The ADS-momentum is used for EM simulation, and the spiral inductors are fabricated with Hynix 0.35㎛ CMOS process. This research mainly concerned the effects of the geometric change in terms of the number of turns and the width of micro strip line. The measured and simulated results show that the Hynix 0.35㎛ process could support a top metal spiral inductor of 1nH to 6nH with Q-factor less than 5.