• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.1C
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• pp.62-67
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• 2008

In this paper, wavelet based blind watermarking using self-reference method is proposed. First, we process wavelet transform of original image. Then, we set all domain except for the low-frequency domain to zero and make self-reference image after wavelet reverse transformation. By choosing specific domain according to the pixel value difference between original image and self-reference image, we make random sequence, use as watermark and embed. The experimental results of the watermark embedding and extraction on various images show that the proposed scheme not only has good image quality, but also has stability on JPEG lossy compression, filtering, sharpening, blurring and noise.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.271-271
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• 2007

LTCC 소재는 glass/ceramic composite로 구성된다. LTCC 소재에 embedding 되는 고유전율 소재 또한 이와 같은 소재설계를 통하여 무수축 접합이 가능할 것으로 판단된다. 그러나 이에 대한 연구결과가 보고된바 없고 몇몇 $Al_2O_3$의 infiltration에 대한 무수축 소성 관련 선행 연구를 바탕으로 고유전율 소재인 $BaTiO_3$의 무수축 소성이 연구되는 것이 필요한 시점이다. 따라서 본 연구는 저온에서의 glass infiltration에 의한 무수축 $BaTiO_3$ layer의 저온소성특성 및 유전특성을 평가하였다. 실험결과 $785^{\circ}C$에서 glass의 충분한 침투가 확인되며 결정구조에서는 glass/$BaTiO_3$ composite이 형성되었다. 무수축 접합 layer의 소성조건과 glass 두께 변화에 따른 유전특성 및 layer의 결정구조를 비교평가 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.644-647
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• 2004

RF 시스템에서 발룬(Balun)은 회로기판과 집적회로 사이의 임피던스 매칭에 사용되는 소자로서, 전력의 균등한 분배와 함께 180도 위상차를 만드는 역할을 하는 주요 회로부품이다. 시스템의 요구사양에 따라 balanced 임피던스가 $50\Omega$인 소자뿐만 아니라, 25 또는 100, $200\Omega$인 소자들도 많이 사용되는데, 대부분의 계측기가 $50\Omega$을 I/O 임피던스로 설정하고 있어, balanced 임피던스가 $50\Omega$이 아닌 경우 특성을 측정하기 위해서는 별도의 지그설계가 필요하다. 본 연구에서는 중심주파수가 900MHz이고, balanced 임피던스가 $100\Omega$이며, LTCC 모듈 내에 내장되는 임베디드 발룬의 최적 평가를 위한 PCB 측정지그의 구조에 대하여 설계 및 시뮬레이션을 실시하고, 이에 따라 제작된 지그를 시뮬레이션 결과와 비교하였다. 지그를 구성하는 마이크로스트림의 임피던스를 조절함으로써 유효한 측정주파수범위를 넓힐 수 있었으며, 제작된 지그는 설계치에 거의 근접한 전송특성을 나타내었다.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.35 no.11
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• pp.137-146
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• 2019

Recently, the Near-Surface-Mounting method using Fiber reinforced polymer (FRP) has been developed and applied to the reinforcement of many concrete structural members. However, as a part of the fire resistance design, there is a lack of research related to fire insulation for the areas reinforced with FRP. In case of NSM reinforcement, there is a difference in the transferred temperature from the external surface to the groove corresponding to the location of the groove where the FRP is embedded, and the effect of this should be reflected in the fireproof insulation design. Therefore, in this study, after forming grooves for surface embedding in concrete blocks, fireproof insulation reinforcement was performed using Calcium Silicate (CS) fireproof board and an experiment to evaluate the temperature transfer was performed. By observing the temperature at these groove positions, the reduction of temperature transfer according to fireproof insulation detail was studied. As a result, when the NSM-FRP is properly fire-insulated using the CS-based fireproof board, the epoxy inside the groove does not reach its glass transition temperature until the external temperature reaches $800^{\circ}C$.

• Composites Research
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• v.20 no.2
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• pp.27-31
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• 2007

"Structural surface becomes an antenna." This term, CAS, indicates antenna embedding in structural surfaces. The CAS is composed of several composite laminates and Nomex honeycombs, and microstrip antenna elements are inserted between layers with designed configurations. Constituent materials are selected considering electrical contributions as well as mechanical performances. Antenna design with adhesive films are impossible because of their thin and rough distributions between honeycomb and substrate. Therefore, adhesive effects on antenna performances in CAS are experimentally investigated, CAS with targeted impedance and radiation characteristics are designed considering adhesive effects. multilayer

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.50-61
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• 2010

Nowadays, the SoC is watched by all over the world with interest. The design trend of the SoC is hardware and software co-design which includes the design of hardware structure in RTL level and the development of embedded software. Also the technology is toward deep-submicron and the observability of the SoC's internal state is not easy. Because of the above reasons, the SoC debug is very difficult and time-consuming. So we need a reliable debugger to find the bugs in the SoC and embedded software. In this paper, we developed a hardware debugger named OCD. It is based on IEEE 1140.1 JTAG standard. In order to verify the operation of OCD, it is integrated into the 32bit RISC processor - Core-A (Core-A is the unique embedded processor designed by Korea) and is tested by interconnecting with software debugger. When embedding the OCD in Core-A, there is 14.7% gate count overhead. We can modify the DCU which occupies 2% gate count in OCD to adapt with other processors as a debugger.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.7C
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• pp.726-734
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• 2005

Traditional watermarking technologies are symmetric method which embedding and detection keys are the same. Although the symmetric watermarking method is easy to detect the watermark, this method has weakness against to malicious attacks remove or modify the watermark information when the symmetric key is disclosure. Recently, the asymmetric watermarking method that has different keys to embed and detect is watched by several researchers as a next generation watermarking technology. In this paper, hybrid asymmetric watermarking algorithm is proposed. This algorithm is composed of correlation detection method and critical criteria method. Each method can be individually used to detect watermark from a watermarked content. Hybrid asymmetric detection is complement between two methods, and more feasible than when each method is used respectively, Private key and public key are generated by secure linear transformation and specific matrix. As a result, we have proved the proposed algorithm is secured than symmetric watermarking algorithms. This algorithm can expand to multi bits embedding watermark system and is robust to JPEG and JPEG2000 compression.

• The Journal of Engineering Geology
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• v.22 no.1
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• pp.49-58
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• 2012

Anchor heads a recommonly exposed to surface weathering processes that cause physical damage by vibration and external forces. This study presents a new method of anchor-head installation that uses near-surface embedding based on analyses of concrete block failure. ABAQUS 3D numerical modeling performed to compare this method with the standard technique and to analyze the distribution of displacement and the stress pattern. In addition, application of the method to a real-world case was tested by in-situ measurements. The results show a maximum vertical stress of 9.73 MPa and vertical displacement of 1.34 mm. Field tests indicated that displacement of a concrete block was 3 to 4 times greater than that of an embedded bearing plate.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.