• Journal of Welding and Joining
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• v.32 no.3
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• pp.53-59
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• 2014

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

• Proceedings of the Korean Society of Life Science Conference
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• 2006.09a
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• pp.104.1-104.1
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• 2006

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1118-1121
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• 2009

We have fabricated inverted staggered pentacene Thin Film Transistor (TFT) with 1-${\mu}m$ channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro-scale source/drain electrodes without etching was successfully achieved using silver nano particle ink, Polydimethylsiloxane (PDMS) stamp and FC-150 flip chip aligner-bonder. Sheet resistance of the printed Ag nano particle films were effectively reduced by two step annealing at $180^{\circ}C$.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1342-1344
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• 2000

This paper presents a microcontroller-based control circuit for color variation of high brightness RGB LEDs in $8{\times}8$ matrix array. The control circuit is comprised of an AT89C52 chip, D Flip-flops, and transistors for switching, and is used to adjust the number of LEDs operated for color variation. For a stable operation, it is required that the input current to each LED should be maintained to a normal value irrespective of the number of LEDs operated.

• Bulletin of the Korean Chemical Society
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• v.12 no.5
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• pp.525-529
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• 1991

A simple route is described for the selective functionalization of calixarene at the para positions of phenyl rings. Calix[4]arene tetraacetate 2, obtained from the treatment of calix[4]arene with acetic anhydride, undergoes Fries rearrangement to yield the diametrically para substituted p-diacetylcalix[4]arene 3 in 80% yield. The crystal and molecular strucutre has been determined by X-ray diffraction method. The crystals are orthorhombic, space group Pna21, with a = 11.121 (3), b = 10.374 (3), c = 21.690 (6) $\AA$ and Z = 4. The structure was solved by direct method and refined by full-matrix least-squares methods to final R of 0.036 for 1795 observed reflections. Each hydroxyl hydrogen atom is disordered over two positions. The macrocycle exists in the cone conformation which is determined by the strong circular intramolecular flip-flop type hydrogen bonds of phenolic OH, while crystal packing effects of the diametrically para-acetyl substituents seem to be responsible for the distortion of the cone conformation.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.3
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• pp.327-339
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• 1986

In this paper, a hardware compiler for symbolic description language(SDL) is proposed for logic design automation. Lexical analysis is performed for SDL which describes the behavioral characteristics of a digital system at the register transfer level by the proposed algorithm I. The algorithm I is proposed to get the expressions for the control unit and for the data transfer unit. In order to obtain the network description language(NDL) expressions equivalent to gate-level logic circuits, another algorithm, the the algorithm II, is proposed. Syntax analysis for the data formed by the algorithm I is also Performed using circuit elements such as D Flip-Flop, 2-input AND, OR, and NOT gates. This SDL hardware compiler is implemented in the programming language C(VAX-11/750(UNIX)), and its efficiency is shown by experiments with logic design examples.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.877-880
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• 2005

This paper describes a PLL frequency synthesizer for wireless LNA applications. The design is focused mainly on low-power and low-phase noise characteristics. A 128/129 dual-modulus prescaler has been designed using the proposed TSPC D flip-flops for high-speed operation and low-power consumption The designed synthesizer includes all building blocks for elimination of external components, other than the crystal. Its operating frequency can be programmed by external data. The frequency synthesizer has been designed using a $0.25{\mu}m$ CMOS process parameters. It operates in the frequency range of 2GHz to 3GHz and consumes 3.2mA at 2.5GHz from a 2.5V supply.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.